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since 1977 - ggp-Schaltungen GmbH

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technology<br />

multilayer up to 24 layers<br />

fl flex / fl flex-rigid i id<br />

single- and doublesided pcbs<br />

sample service<br />

LDI (Laser Direct Imaging)<br />

mechanical drilling 0,15mm<br />

HDI / SBU - technology<br />

buried and blind vias<br />

Plugging<br />

ultrathin innerlayers up to 50 µm<br />

Heatsinks<br />

thick film copper technology up to 250 µm<br />

metalcore<br />

high frequency technology<br />

flying probe or grid test<br />

Impedance controlled pcbs

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