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EMLS 2030 - Inertec

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L Ö T T E C H N I K<br />

since 1992 professional soldering technology<br />

Matrix<br />

* the machine still runs, even in 2004<br />

* Minimum maintenance expenditure<br />

* Low susceptibility to break down<br />

* Avoidance of droplets of solder system<br />

* low times for change of product<br />

4 further transportation<br />

3 contacting - closing the gas compartment<br />

2. Conceptual requirements for a selective<br />

mass production soldering system<br />

2 opening the gas compartment<br />

1 positioning – skimming<br />

FUNCTIONAL SEQUENCE – MATRIX SOLDERING MODULE<br />

* soldering in the vicinity of contact structures<br />

(gold/carbon – circuit surfaces)<br />

* no solder on surfaces in the vicinity of the<br />

soldering points<br />

Implemented soldering application<br />

* no desoldering or melting-down work for<br />

components directly at the soldering joints<br />

* processing of the cheapest possible printedcircuit<br />

board materials<br />

* Plastic components at risk of being damaged by<br />

high temperature next to the soldering joints<br />

* soldering even in installation spaces<br />

* soldering without bridging, even with the<br />

smallest distances between components<br />

1. Requirements for the components<br />

Time taken to change the product: in linear timing

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