EMLS 2030 - Inertec
EMLS 2030 - Inertec
EMLS 2030 - Inertec
- TAGS
- emls
- inertec
- www.inertec.de
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L Ö T T E C H N I K<br />
since 1992 professional soldering technology<br />
Matrix<br />
* the machine still runs, even in 2004<br />
* Minimum maintenance expenditure<br />
* Low susceptibility to break down<br />
* Avoidance of droplets of solder system<br />
* low times for change of product<br />
4 further transportation<br />
3 contacting - closing the gas compartment<br />
2. Conceptual requirements for a selective<br />
mass production soldering system<br />
2 opening the gas compartment<br />
1 positioning – skimming<br />
FUNCTIONAL SEQUENCE – MATRIX SOLDERING MODULE<br />
* soldering in the vicinity of contact structures<br />
(gold/carbon – circuit surfaces)<br />
* no solder on surfaces in the vicinity of the<br />
soldering points<br />
Implemented soldering application<br />
* no desoldering or melting-down work for<br />
components directly at the soldering joints<br />
* processing of the cheapest possible printedcircuit<br />
board materials<br />
* Plastic components at risk of being damaged by<br />
high temperature next to the soldering joints<br />
* soldering even in installation spaces<br />
* soldering without bridging, even with the<br />
smallest distances between components<br />
1. Requirements for the components<br />
Time taken to change the product: in linear timing