Technology Trends for Inertial MEMS - I-Micronews
Technology Trends for Inertial MEMS - I-Micronews
Technology Trends for Inertial MEMS - I-Micronews
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
© 2012 • 1<br />
<strong>Technology</strong> <strong>Trends</strong> <strong>for</strong><br />
Copyrights © Yole Développement SA. All rights reserved.<br />
<strong>Inertial</strong> <strong>MEMS</strong><br />
Discover the key evolutions in accelerometers, gyros, magnetometers and combos based on 23 reverse-engineering <strong>MEMS</strong> devices<br />
SAMPLE REPORT
© 2012 • 2<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
Why this report?<br />
• Over the last 3 years, inertial <strong>MEMS</strong> have been subject to dramatic market & technological evolution. This has been driven by a large<br />
increase of the consumer market: mobile phones and tablets <strong>for</strong> accelerometers; gaming <strong>for</strong> gyros; mobile phones <strong>for</strong> magnetometers.<br />
• Along with “stand-alone” <strong>MEMS</strong> devices, inertial combo sensors – a combination of several inertial sensors into a single package - are<br />
also coming. Main applications are consumer – e.g. accelerometer with magnetometer or accelerometer with gyro – and automotive <strong>for</strong><br />
ESC and rollover functions first.<br />
• Indeed, inertial <strong>MEMS</strong> are today driven by 4 major market trends:<br />
– Future generation of sensors will deliver functions and will become “solutions<br />
– Fusion of sensors (combining data from different sensors) is starting to be widely used<br />
– New architectures are developed<br />
– Price pressure is still very strong (5% drop per quarter <strong>for</strong> consumer).<br />
• On the technical side, <strong>for</strong>m factor is ever decreasing with lower footprint and thickness. Power consumption has been reduced to a few<br />
microA and per<strong>for</strong>mances are still increasing.<br />
• To give clues about the differences in cost, size, package, structures … of the different inertial <strong>MEMS</strong>, Yole has released this report in<br />
order to:<br />
– Provide an understanding of the market drivers <strong>for</strong> inertial <strong>MEMS</strong><br />
– Give trends about packaging and tests strategies<br />
– Provide in-depth analysis <strong>for</strong> 23 <strong>MEMS</strong> devices in terms of cost, size, package type, per<strong>for</strong>mances<br />
– Have a comparative analysis in terms of per<strong>for</strong>mances, cost, <strong>MEMS</strong> size, ASIC cost, ASIC size, package size, year <strong>for</strong> market introduction.<br />
– For each devices, photos are depicting:<br />
• Package view<br />
• <strong>MEMS</strong> & ASIC dimensions<br />
• <strong>MEMS</strong> close-up structure<br />
• Specific process steps<br />
• Cost breakdown
List of <strong>MEMS</strong> devices covered into the report<br />
1. ST LIS331DLH<br />
2. ST LIS3DH<br />
3. Bosch Sensortec BMA180<br />
4. Bosch Sensortec BMA250<br />
5. Kionix KXTE9<br />
6. Freescale MMA8450<br />
© 2012 • 3<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
7. Freescale MMA8451<br />
8. Analog Device ADXL278<br />
9. Analog Device ADXL346<br />
10. Invensense IDG 1004<br />
11. Invensense IDG 600/650<br />
12. Invensense ITG3200<br />
13. ST L3G4200D<br />
14. VTI CRM3000<br />
15. Sensordynamics SD740<br />
16. SSS Pinpoint CRM100<br />
17. Epson Toyocom XV-<br />
3500CB<br />
18. Sony 2-Axis Gyro<br />
19. Murata ENC-03RC-10-R<br />
A11<br />
20. SensorDynamics SD746<br />
21. VTI SCC1300<br />
22. Invensense MPU6000<br />
23. AKM AK8973S
• <strong>Inertial</strong> <strong>MEMS</strong> market is growing from $3.2B in 2011 to $4.8B in 2016<br />
© 2012 • 4<br />
Market ($M)<br />
<strong>Inertial</strong> <strong>MEMS</strong> market is booming<br />
3X more volume in 6 years!<br />
– Market in volume will grow from 2.9B units to 6.9B units (less in number of packages since combo sensors will be a<br />
significant part of the consumer market in 2016)<br />
– Growth in wafer manufacturing is slowed by the decreasing die size: this will grow from 337K wafers (8 inch eq.) in<br />
2011 to 416K wafers (8 inch ed.) in 2016<br />
5000<br />
4000<br />
3000<br />
2000<br />
1000<br />
0<br />
2010-2016 Market <strong>for</strong> inertial <strong>MEMS</strong> devices<br />
- Accelerometers, gyroscopes, magnetometers (both standalone and included in combo packages -<br />
Yole Developpement © May 2011<br />
2 713<br />
2 219<br />
3 156<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
2 865<br />
3 481<br />
3 493<br />
3 811<br />
4 260<br />
4 200<br />
5 263<br />
4 479<br />
6 157<br />
4 778<br />
6 903<br />
2 010 2 011 2 012 2 013 2 014 2 015 2 016<br />
8 000<br />
7 000<br />
6 000<br />
5 000<br />
4 000<br />
3 000<br />
2 000<br />
1 000<br />
0<br />
Market (M Units)
<strong>MEMS</strong><br />
Accelerometers<br />
<strong>MEMS</strong> Gyroscopes<br />
Magnetometers<br />
© 2012 • 5<br />
<strong>MEMS</strong>-based <strong>Inertial</strong> Sensors & Magnetometers<br />
The different approaches<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
<strong>MEMS</strong><br />
Surface MM Bulk MM<br />
Comb drive (capacitive detection) ex: STM, AD, Kionix ex: VTI ex: AD ex: Baolab<br />
Resonating quartz beam ex: Honeywell<br />
Thermal principle ex: <strong>MEMS</strong>IC<br />
Optical principle<br />
ex: Lumedyne, Symphony<br />
Acoustics<br />
Tunneling effect ex: Agiltron<br />
Piezo ceramic ex: MSI ex: MSI<br />
Vibrating beam (quartz) ex: Murata<br />
ex: Epson Toyocom<br />
Vibrating <strong>for</strong>k (quartz)<br />
(Q<strong>MEMS</strong>), Honeywell,<br />
Thales, SDI<br />
Vibrating <strong>for</strong>k (Si) ex: Invensense IDG family ex: VTI, Sensonor<br />
Vibrating plate (Si)<br />
ex: Melexis, Bosch<br />
SMG060, STM LPR family<br />
Vibrating shell (Si) ex: Silicon Sensing Systems<br />
Bulk Acoustic Wave (BAW) ex: Qualtré<br />
CMOS <strong>MEMS</strong><br />
Hall effect ex: AKM<br />
Magneto impedance (MI) ex: AMI<br />
ex: ST<br />
Anisotropic magneto resistance (AMR)<br />
(Honeywell),<br />
<strong>MEMS</strong>IC<br />
Magnetic tunnel junction (MTJ) ex: Freescale<br />
Lorentz effect<br />
ex: BSAC, Tsinghua<br />
University, VTT, CEA, Bosch<br />
ex: Baolab<br />
CMOS<br />
NOT COVERED<br />
IN THE REPORT
Added value of the packaging shifts at the wafer level<br />
More TSV and more monolithic integration to be expected!<br />
Wafer level<br />
Packaging<br />
expertise<br />
Assembly<br />
level<br />
© 2012 • 6<br />
Panasonic<br />
Multiaxis<br />
integration not<br />
possible with the<br />
dominant gyro<br />
technologies<br />
2005 2008 2011 2014<br />
Year of introduction<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
WLP <strong>for</strong> leading<br />
magnetometers<br />
AKM<br />
Most<br />
accelerometers<br />
have ASIC/<strong>MEMS</strong><br />
side by side<br />
Multi-die combo<br />
sensors<br />
Combos share<br />
common ASIC<br />
and/or <strong>MEMS</strong> die<br />
ST / Honeywell<br />
Bosch Sensortec<br />
ST TSVs in volume<br />
production<br />
InvenSense<br />
Most acceleros<br />
/gyros have <strong>MEMS</strong><br />
and ASIC die<br />
stacked + <strong>MEMS</strong><br />
cap<br />
Freescale<br />
• SOC <strong>for</strong> more<br />
integration<br />
• Smaller size<br />
• ASIC as an active<br />
capping<br />
• <strong>MEMS</strong> in CMOS<br />
• …<br />
ST<br />
Baolab<br />
SiP still needed when<br />
adding new sensors /<br />
functionnalities<br />
ST
Exemple of electrical test<br />
Source: Polytec<br />
© 2012 • 7<br />
<strong>MEMS</strong> testing<br />
Specificity of <strong>MEMS</strong> compared to std ICs<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
Electrical<br />
component<br />
<strong>MEMS</strong><br />
Mechanical<br />
component<br />
Complexity of test<br />
<strong>MEMS</strong> gyroscope<br />
Source: HSG - IMIT<br />
Exemple of mechanical test<br />
Source: Polytec
<strong>MEMS</strong> Size (mm²)<br />
Accelerometer <strong>MEMS</strong> size evolution<br />
For accelerometers, there is a clear <strong>MEMS</strong> die size decrease over 2007-2011.<br />
12<br />
5<br />
4<br />
3<br />
2<br />
© 2012 • 8<br />
ST<br />
LIS3L02AE<br />
2007<br />
ST<br />
LIS331DLH<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
VTI<br />
CMA3000<br />
BOSCH<br />
BMA180<br />
Kionix<br />
KXTE9<br />
All are 3-axis accelerometers<br />
US$ values are Production Cost<br />
ST LIS3DH<br />
ADI<br />
ADXL346<br />
2008 2009 2010 2011<br />
$0.05-0.075<br />
$0.075-0.1<br />
BOSCH<br />
BMA250<br />
>$0.1<br />
n.a.
Example of Reverse Engineering <strong>MEMS</strong>: Sensordynamics SD746<br />
6-Axis <strong>MEMS</strong> IMU (2011)<br />
© 2012 • 9<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
<strong>MEMS</strong> Gyro<br />
Same proces than <strong>MEMS</strong><br />
gyro in SD740<br />
<strong>MEMS</strong> Accelero<br />
Same proces than <strong>MEMS</strong><br />
accelero in KXTE9
Example of Reverse Engineering <strong>MEMS</strong>: Sensordynamics SD746<br />
6-Axis <strong>MEMS</strong> IMU (2011)<br />
ASIC/<strong>MEMS</strong> - Dimensions<br />
© 2012 • 10<br />
2.45mm<br />
<strong>MEMS</strong> Gyro Optical View<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
2.65mm<br />
1.73mm<br />
1.33mm<br />
<strong>MEMS</strong> Accelero Optical View<br />
• ASIC Area: 6.56mm²<br />
• <strong>MEMS</strong> Gyro Area: 6.49mm²<br />
• <strong>MEMS</strong> Accelero Area: 2.30mm²<br />
4.00mm<br />
ASIC Optical View<br />
1.64mm
Media business<br />
News feed / Magazines / Webcasts<br />
© 2012 • 11<br />
Yole activities in <strong>MEMS</strong><br />
Copyrights © Yole Développement SA. All rights reserved.<br />
Market Research<br />
Reports<br />
Market research,<br />
<strong>Technology</strong> & Strategy<br />
Consulting services<br />
www.yole.fr
Sensor fusion of<br />
acceleros, gyros &<br />
magnetometers<br />
© 2012 • 12<br />
New!<br />
<strong>Trends</strong> in <strong>MEMS</strong><br />
Manufacturing &<br />
Packaging<br />
New!<br />
CMOS Image Sensors<br />
Available <strong>MEMS</strong> Reports<br />
Permanent Wafer<br />
Bonding<br />
New!<br />
Motion Sensors <strong>for</strong><br />
Consumer & Mobile<br />
applications<br />
New!<br />
<strong>MEMS</strong> Cosim+<br />
<strong>MEMS</strong> Manufacturing<br />
Cost Simulation Tool<br />
Copyrights © Yole Développement SA. All rights reserved.<br />
Thin Wafer<br />
Handling<br />
New!<br />
IMU &High Per<strong>for</strong>mance<br />
<strong>MEMS</strong><br />
<strong>MEMS</strong> Microphone<br />
New!<br />
<strong>MEMS</strong> & Sensors<br />
<strong>for</strong> Smartphones<br />
Ferro-Electric<br />
Thin Films<br />
New!<br />
Uncooled IR Cameras &<br />
detectors <strong>for</strong> thermography &<br />
nigh Vision<br />
<strong>MEMS</strong> Players:<br />
Analysis of Financial<br />
Per<strong>for</strong>mance
Change language