Conference Program - LOPE-C 2011
Conference Program - LOPE-C 2011
Conference Program - LOPE-C 2011
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SCIENTIFIC CONF. | THURSDAY-JUNE 30, <strong>2011</strong><br />
Track 4<br />
Novel Inks and Processes (04:30 pm - 06:00 pm) | LOCATION HARMONIE D / LEVEL C2<br />
05:40 pm Electrical sintering of printed metal structures for mechanical sensors<br />
Mr Christian Werner,<br />
Fraunhofer IFAM, Germany<br />
Today, physico-mechanical sensors like strain gauges, thermo-elements or resistance thermosensors are often discrete devices that have to be mounted onto the surface<br />
of the part (SMD). With the evolving possibilities of printed electronics it is desired not only to print conductive patterns but additionally sensors or sensor arrays. Maskless<br />
printing techniques, like Ink Jet and Aerosol Jet®, are able to print microstructured metal patterns from nanoparticulate inks on virtually any substrate. The thermal<br />
treatment of the printed structure is often done by furnace, with temperatures usually above 150 °C. Furnace sintering results not only in a high thermal load of the whole<br />
part or substrate, but also limits the general substrate selection. Another issue for sintering printed structures is the differing of electrical resistivities due to variations in<br />
process reliability of maskless printing processes for specific printed patterns, like strain gauges.<br />
The electrical sintering process is an unconventional, but promising candidate for sintering printed metal patterns to a specific target resistivity, as well as reducing the<br />
thermal load on the substrate. This work is focusing on the characterization of electrically sintered printed metal structures in comparison to the thermal processing of these<br />
structures by furnace. For this purpose, commercially available conductive inks, like gold or silver as well as resistive inks under development, like copper-nickel, are<br />
printed by Ink Jet or Aerosol Jet® on various substrates.<br />
With electrical sintering, it was possible to achieve highly conductive metal structures within some seconds of treatment. Besides electrical characterization, scanning<br />
electron microscopy with focused ion beam is used to analyze surface morphologies and cross-sectional areas of the different metals after electric and conventional<br />
sintering. Further on, dynamic testing of printed strain gauges is performed to give information about the mechanical load capacity.<br />
06:00 pm SESSION END<br />
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