Conference Program - LOPE-C 2011
Conference Program - LOPE-C 2011
Conference Program - LOPE-C 2011
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SCIENTIFIC CONF. | THURSDAY-JUNE 30, <strong>2011</strong><br />
Track 5<br />
Sintering of Inorganic Materials (02:30 pm - 04:00 pm) | LOCATION HARMONIE E / LEVEL C2<br />
03:20 pm Inkjet printing and microwave flash sintering of conductive nanoparticles for R2R applications<br />
Dr Jolke Perelaer,<br />
Friedrich-Schiller-University Jena, Postdoc / project manager, Germany<br />
In recent years, inkjet printing is increasingly used as a flexible and digital patterning technique in the field of microelectronics. The main advantages of inkjet printing are its<br />
ease of processing and its potential for mass production. Furthermore, based on its digital properties, inkjet printing is both a flexible and low cost technique, since materials<br />
are used in an efficient manner, compared to other patterning techniques, like non-digital printing techniques and spin coating, which significantly reduces waste production.<br />
During the last years, there has been a growing interest in printing silver inks as a basis for conductive tracks in microelectronics applications, including OLED, OPV and<br />
RFID.<br />
Currently, much interest is dedicated to inkjet printing of conductive materials, such as silver nanoparticles; as an effect of their reduced particle size, the melting<br />
temperature is reduced significantly. Although the sintering temperatures are reduced to well below 300 °C, these temperatures are not compatible with polymer foils, which<br />
are required for applications in plastic electronics.<br />
We have used alternative techniques to sinter inkjet printed silver nanoparticles that are compatible with common polymer foils, such as PET and polycarbonate. The<br />
process involves either a low pressure argon plasma exposure or microwave radiation.<br />
Recently, we made good progress with combining the two alternative techniques, which enhances the process of creating conductive patterns on polymer substrates in two<br />
ways: firstly, the features' conductivity can be increased by using a hybrid sintering setup and, secondly, the overall sintering time can be reduced by using the so-called<br />
flash sintering approach. Hereby, sintering times can be reduced from more than one hour to a few minutes or even seconds. Furthermore, the obtained conductivity is<br />
between 10 and 50% of bulk silver, while leaving the polymer substrate unaffected.<br />
These conductive features may be used in many plastic electronic applications.<br />
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