Two-wire Serial EEPROMs AT24C128 AT24C256 - Atmel Corporation
Two-wire Serial EEPROMs AT24C128 AT24C256 - Atmel Corporation Two-wire Serial EEPROMs AT24C128 AT24C256 - Atmel Corporation
8Y4 – SAP 0670T–SEEPR–3/07 R D PIN 1 INDEX AREA E 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 A A1 A COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A – – 0.90 A1 0.00 – 0.05 D 5.80 6.00 6.20 E 4.70 4.90 5.10 D1 2.85 3.00 3.15 E1 2.85 3.00 3.15 b 0.35 0.40 0.45 e 1.27 TYP e1 3.81 REF L 0.50 0.60 0.70 TITLE 8Y4, 8-lead (6.00 x 4.90 mm Body) SOIC Array Package (SAP) Y4 b PIN 1 ID E1 e1 AT24C128/256 D1 e DRAWING NO. 8Y4 L 5/24/04 REV. A 20
8A2 – TSSOP 0670T–SEEPR–3/07 R 3 Top View D 2 1 Pin 1 indicator this corner b N e Side View 2325 Orchard Parkway San Jose, CA 95131 A2 E1 A E End View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D 2.90 3.00 3.10 2, 5 E 6.40 BSC E1 4.30 4.40 4.50 3, 5 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 4 e 0.65 BSC L 0.45 0.60 0.75 L1 1.00 REF AT24C128/256 Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02 TITLE DRAWING NO. REV. 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8A2 B L L1 21
- Page 1 and 2: Features • Low-voltage and Standa
- Page 3 and 4: 0670T-SEEPR-3/07 AT24C128/256 Pin D
- Page 5 and 6: Table 4. AC Characteristics - Indus
- Page 7 and 8: Device Operation 0670T-SEEPR-3/07 A
- Page 9 and 10: Figure 4. Data Validity Figure 5. S
- Page 11 and 12: Read Operations 0670T-SEEPR-3/07 AT
- Page 13 and 14: AT24C128 Ordering Information (1) 0
- Page 15 and 16: Packaging Information 8P3 - PDIP 06
- Page 17 and 18: 8S2 - EIAJ SOIC 0670T-SEEPR-3/07 R
- Page 19: 8Y1 - MAP 0670T-SEEPR-3/07 R D PIN
- Page 23: Atmel Corporation Atmel Operations
8Y4 – SAP<br />
0670T–SEEPR–3/07<br />
R<br />
D<br />
PIN 1 INDEX AREA<br />
E<br />
1150 E. Cheyenne Mtn. Blvd.<br />
Colorado Springs, CO 80906<br />
A<br />
A1<br />
A<br />
COMMON DIMENSIONS<br />
(Unit of Measure = mm)<br />
SYMBOL MIN NOM MAX NOTE<br />
A – – 0.90<br />
A1 0.00 – 0.05<br />
D 5.80 6.00 6.20<br />
E 4.70 4.90 5.10<br />
D1 2.85 3.00 3.15<br />
E1 2.85 3.00 3.15<br />
b 0.35 0.40 0.45<br />
e 1.27 TYP<br />
e1 3.81 REF<br />
L 0.50 0.60 0.70<br />
TITLE<br />
8Y4, 8-lead (6.00 x 4.90 mm Body) SOIC Array Package<br />
(SAP) Y4<br />
b<br />
PIN 1 ID<br />
E1<br />
e1<br />
<strong>AT24C128</strong>/256<br />
D1<br />
e<br />
DRAWING NO.<br />
8Y4<br />
L<br />
5/24/04<br />
REV.<br />
A<br />
20
Change language