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Utilizing LVDS to Reduce EMI/EMC in Network Cameras

Utilizing LVDS to Reduce EMI/EMC in Network Cameras

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Match<strong>in</strong>g FPC Impedance<br />

150.00<br />

140.00<br />

130.00<br />

120.00<br />

Polyamide Sheets<br />

110.00<br />

100.00<br />

90.00<br />

Ansoft Corporation Impedance<strong>LVDS</strong><br />

TDR folded with modified FPC<br />

-V(Diff1)/I(Diff1)<br />

140.00<br />

130.00<br />

120.00<br />

110.00<br />

100.00<br />

90.00<br />

80.00<br />

70.00<br />

60.00<br />

50.00<br />

On both side<br />

Ansoft Corporation XY Plot 1<br />

FPC Improve<br />

mag(sqrt(Z(Open,Open)*Z(Short,Short)))<br />

-V(Diff1)/I(Diff1)<br />

Transient<br />

80.00<br />

70.00<br />

60.00<br />

<strong>Reduce</strong> portion of FPC<br />

impedance Mismatch<br />

50.00<br />

Curve Inf o<br />

1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10.00<br />

Time [ns]<br />

0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00<br />

F [GHz]<br />

Curve Inf o<br />

mag(sqrt(Z(Open,Open)*Z(Short,Short)))<br />

L<strong>in</strong>earFrequency<br />

75um Polyamide sheets on both<br />

side of FPC<br />

*=============================================<br />

.param FPC_Base=25.4um<br />

.param FPC_Conduc<strong>to</strong>r=35um<br />

.param Air_thickness=800um<br />

.param FPC_Thickness='Air_thickness+3*FPC_Base'<br />

.param FPC_Thickness_stacked='Air_thickness+(2*FPC_Base+FPC_Conduc<strong>to</strong>r)+FPC_Base'<br />

*=============================================<br />

.layerstack FPCBoard<br />

+ layer = (air, 'Air_thickness'),<br />

+ layer = (Polymide, '6*FPC_Base+FPC_Conduc<strong>to</strong>r') ,<br />

+ layer = (air, 'Air_thickness')

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