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DesignCon 2002

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A B<br />

Figure 17: A: SIwave isometric view of the extracted differential pair on the Blade card. B:<br />

SIwave top-down view of the Switch card.<br />

The post-layout model is shown in Figure 18 and consists of the three SIwave models,<br />

SMP connector models, and a high speed connector model. A Touchstone file was<br />

created for each PWB in the system (Blade, Switch, and Backplane); these were used to<br />

model the channel in lieu of w-elements and discreet vias. The full-wave package and<br />

PWB extraction tool performs a 2D FEM solution on all planar objects within the PWB<br />

and combines this with a Method of Moments solution for the signal traces. The final<br />

solution incorporates the fabricated board including the stack-up, plane geometries, trace<br />

geometries, components, vias, via padstacks, and frequency dependent dielectrics for<br />

each layer. Upon completion of the simulation, a Touchstone file was exported to the<br />

statistical tools for rapid,statistical analysis.<br />

0 1 2 3 4 5 0<br />

ref<br />

0<br />

Port1 Port2<br />

SWITCH<br />

HFSS<br />

Mid-Plane<br />

HFSS<br />

Blade<br />

switch<br />

switch<br />

Port3 Port4<br />

ref<br />

ref<br />

ref<br />

0<br />

smp+<br />

smp- conn-<br />

ref<br />

conn+<br />

C<br />

sw+<br />

blade+<br />

sw- blade-<br />

ref<br />

0 0 0 0 0<br />

1 = Switch PCB Model (SIwave)<br />

2 = Connector Model (HFSS)<br />

3 = Mid-plane PCB Model (SIwave)<br />

4 = Connector Model (HFSS)<br />

5 = Blade PCB Model (SIwave)<br />

Figure 18: Post-layout circuit model.<br />

The post-layout simulation results show a very similar solution space to that of the final<br />

pre-layout simulation (2 ps difference at a BER of 1x10 -12 ). VerifEye BER results are<br />

shown in Figure 19 for the post-layout simulation.<br />

C<br />

conn+<br />

smp+<br />

conn- smp-<br />

ref<br />

blade<br />

blade<br />

ref<br />

ref<br />

0<br />

0

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