Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
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hardware T01-J15A<br />
ICs U11-G<br />
PCB V04-R11<br />
Desk calculator T01-J01<br />
Desk top publishing (DTP) T01-J11B<br />
Desk, for computer T04-L07<br />
Destroying/recycling/ recording media<br />
magnetic T03-A01R<br />
optical T03-B01R<br />
magneto-optical T03-D01R<br />
general T03-H02R<br />
Detection<br />
conception S05-D09<br />
digital mark T04-A03<br />
movement, using pattern recognition<br />
T04-D07D1<br />
ovulation S05-D09<br />
Detectors<br />
AM U23-K<br />
broadcast radio receiver W03-B02C<br />
communications radio receiver W02-G03E<br />
FM U23-L<br />
optical detector S03-A<br />
particles V05-H<br />
radiation V05-H<br />
Determination of sex S05-D09<br />
Detonator<br />
blasting X25-D01<br />
blasting, mining X25-D02<br />
weapon W07-C01<br />
Developer material<br />
for semiconductor mfr. U11-A11<br />
printing S06-K07B<br />
Developing process<br />
electrophotographic, using liquid developer<br />
S06-E04B<br />
electrophotographic, using magnetic<br />
brush S06-E04C<br />
electrophotographic, using solid developer<br />
S06-E04A<br />
lithography, semiconductor mfr. U11-C04A1C<br />
Diac - see Thyristors, bidirectional U12-D01B2<br />
Diagnosis, medical S05-D<br />
diagnostic display S05-D07<br />
endoscope S05-D04<br />
endoscope, imaging aspects S05-D04B<br />
eye testing S05-D05<br />
in dentistry S05-E03<br />
information systems S05-D06<br />
medical endoscope, positioning and control<br />
S05-D04A<br />
NMR S05-D02B<br />
nuclear radiation S05-D02C<br />
simulation and education systems S05-P<br />
sonic or ultrasonic S05-D03<br />
ultrasonic transducer arrangements<br />
S05-D03A2<br />
using expert systems S05-D06<br />
using UV, IR, Laser S05-D02X<br />
using visible light S05-D02X<br />
X-ray S05-D02A<br />
Dial<br />
clock or watch S04-A02A<br />
<strong>EPI</strong> Manual Codes 2011 1007<br />
Part 3<br />
for indicating/ recording measured values<br />
S02-K06A<br />
Dialling, telephone<br />
automatic dialling W01-C01B1<br />
bar code input T04-A03B1<br />
W01-C01B1C<br />
dial format detection W01-C01B7<br />
dial pulses W01-C01B2A<br />
dial signal generator W01-C01B2<br />
DTMF W01-C01B2C<br />
external module W01-C01B1D<br />
hands free dialling W01-C01B1B<br />
mechanical lock W01-C01B5D<br />
number storage at exchange W01-C02B5<br />
OCR input W01-C01B1C<br />
preventing dialling of<br />
predetermined numbers W01-C01B5C<br />
repertory W01-C01B1A<br />
reply dialling W01-C01B1E<br />
security/restricted dialling W01-C01B5<br />
voice dialling W01-C01B1B<br />
voice recognition-based secure dialling<br />
W01-C01B5B<br />
Dialysis S05-H<br />
blood treatment circuits S05-H01<br />
dialysis systems S05-H01<br />
Diameter measurement<br />
electrical/magnetic S02-A02A<br />
mechanical S02-A01C1<br />
optical S02-A03B1<br />
using combination of methods S02-A08A<br />
Diamond - see AIV elements and their<br />
compounds<br />
Diaphragm, acoustic transducer<br />
general transducers V06-V02A<br />
loudspeakers V06-V02A<br />
V06-V04A1<br />
manufacture V06-V03A1<br />
Dichroism, optical, materials investigation<br />
S03-E04B5<br />
Dicing, semiconductor wafer U11-C06A2<br />
Die bonding<br />
for semiconductor device package U11-E02A3<br />
metallurgical aspects U11-D03B3<br />
Die, semiconductor, handling U11-F02A3<br />
Dielectric<br />
heating X25-B02D<br />
material X12-E01<br />
X12-E02<br />
material manufacture V01-B03B3<br />
strength testing S01-G03<br />
waveguide conductor W02-A01B3<br />
waveguide resonator W02-A03A5<br />
Dielectric barrier discharge lamp X26-A01C<br />
construction - see Discharge lamp<br />
X26-A02<br />
Dielectric constant<br />
measuring S01-D05A3<br />
measuring- materials investigation S03-E02C<br />
Dielectric for capacitors V01-B03<br />
inorganic material V01-B03A1<br />
organic material V01-B03B1
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