Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
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DC-AC, half-bridge U24-D05A<br />
X12-J05A<br />
DC-DC U24-D02<br />
X12-J02<br />
DC-DC with intermediate AC U24-D02B<br />
X12-J02B<br />
DC-DC without intermediate AC U24-D02A<br />
X12-J02A<br />
DC-DC, flyback U24-D02B1<br />
DC-DC, forward U24-D02B1<br />
DC-DC, full-bridge U24-D02B5<br />
DC-DC, half-bridge U24-D02B3<br />
DC-DC, push-pull U24-D02B3<br />
DC-DC, resonant U24-D02B7<br />
DC-DC, SEPP U24-D02B3<br />
DC-DC, single-ended push-pull U24-D02B3<br />
details, other U24-D01X<br />
X12-J01X<br />
digital protector U24-F05<br />
dynamo-electric X11-H09<br />
dynamo-electric, braking X13-F02<br />
dynamo-electric, control X13-G04<br />
dynamo-electric, starting X13-F01<br />
excess current/voltage limiting U24-D01B<br />
U24-F02<br />
X12-J01B<br />
X13-C03<br />
X13-C04D<br />
filtering output U24-D01E<br />
U25-E<br />
X12-J01E<br />
frequency U24-D03<br />
X12-J03<br />
frequency, matrix X12-J03A<br />
general details U24-D01<br />
X12-J01<br />
harmonics reduction U24-D01E1<br />
U25-E<br />
X12-J01E<br />
measuring/testing U24-D01J<br />
multi-phase control U24-D01A8<br />
multiple input/outputs U24-D11<br />
position, interface T01-C02B<br />
power, electric train/tram X23-A01A3<br />
protection U24-D01B<br />
U24-F<br />
X12-J01B<br />
X13-C04D<br />
pulse U24-D06<br />
X12-J06<br />
PWM control U24-D01A9<br />
X12-J01A9<br />
ripples reduction U24-D01E2<br />
U25-E<br />
X12-J01E<br />
smart protector U24-F03<br />
smoothing output U24-D01E<br />
U25-E<br />
X12-J01E<br />
snubber circuits U24-D01B1<br />
snubber circuits, active U24-D01B1C<br />
snubber circuits, dissipative U24-D01B1F<br />
snubber circuits, non-dissipative U24-D01B1H<br />
snubber circuits, passive U24-D01B1A<br />
solid-state (analogue) protector U24-F04<br />
synchronous rectifier U24-D04G<br />
utility inter-tie inverter U24-D05B3<br />
X12-J05B3<br />
<strong>EPI</strong> Manual Codes 2011 999<br />
Part 3<br />
voltage source inverter U24-D05B1<br />
X12-J05B1<br />
Conveyor X25-F01<br />
conveying trucks X25-F05A<br />
control T06-D08C<br />
X25-F01A<br />
conveying X25-FO5A<br />
counting objects on T05-A01<br />
for semiconductor wafers U11-F02A<br />
mining X25-D02A<br />
Convolution, analogue T02-A04B2A<br />
Convolutional code data transmission,<br />
error detection/correction W01-A01B2<br />
algorithm aspects T01-S<br />
W01-A01B2S<br />
combined convolutional coding scheme W01-A01B4<br />
coding T01-D02<br />
W01-A01B2S<br />
Turbo coding W01-A01B2E<br />
Viterbi coding W01-A01B2A<br />
Convolutional error detection/correction<br />
U21-A06C<br />
turbo coding U21-A06C2<br />
using Trellis coding U21-A06C3<br />
Viterbi coding U21-A06C1<br />
Cooker X27-C<br />
combination X27-C07<br />
electric X27-C02<br />
gas X27-C05<br />
in vending machine T05-H04A<br />
induction X27-C06<br />
pressure, electric X27-C04<br />
rice, electric X27-C04<br />
Cooker hood X27-B05<br />
Cooling<br />
battery X16-K01<br />
computer equipment T01-L02A<br />
discharge tube V05-M07<br />
electric machine V06-M13<br />
X11-J06<br />
electronic appts V04-T03<br />
fuel cell X16-K01<br />
instruments S01-J02C<br />
IR detector S03-A04<br />
lasers V08-A05<br />
light fixture X26-D02<br />
magnetic X27-F02A1<br />
optical instruments S03-A04<br />
radio transmitters W02-G01H<br />
semiconductor packages U11-D02<br />
semiconductor packages, cryrogenic<br />
arrangements U11-D02C<br />
semiconductor packages, external heat<br />
sinks (detachable) U11-D02B2<br />
semiconductor packages, heat transfer<br />
by fluid means U11-D02D1<br />
semiconductor packages, high power<br />
thyristor, transistor, rectifier U11-D02A<br />
semiconductor packages, high power,<br />
stacks, installation U11-D02A1<br />
semiconductor packages, materials for<br />
heat transfer U11-D02B<br />
semiconductor packages, modules,<br />
surface mounted chip assemblies U11-D02D<br />
semiconductor packages, on chip/within
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