Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
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adiation treatment U11-C03A<br />
U11-C03E<br />
recrystallisation U11-C03J1<br />
resist layer processing U11-C04A1F<br />
resistive layer formation U11-C05G<br />
scanning tunnelling microscope processing<br />
U11-C11<br />
self-assembly-monolayer deposition<br />
U11-C12<br />
sputtering deposition appts. U11-C09A<br />
strained layer U11-C01J6A<br />
temperature measuring U11-F01A4<br />
treatment producing localised depth profile<br />
U11-C03J7<br />
trimming, circuit repair U11-C19A<br />
vacuum apparatus U11-C09Q<br />
vacuum appts. U11-C09Q<br />
viral deposition U11-C12<br />
wafer charging prevention during mfr.<br />
U11-C10<br />
wafer identification U11-C15A<br />
wafer labelling U11-C15A<br />
wafer shaping U11-C15A<br />
waste processing U11-C15Q<br />
water purification U11-C15B3<br />
Semiconductor resistor U12-C03A<br />
Semiconductor structures U12-E01<br />
chalcogenide/chalcopyrite compounds<br />
U12-E01A4<br />
heterojunctions U12-E01B1<br />
quantum well, wire, supperlatice U12-E01B2<br />
silicon on insulator U12-E01A5<br />
with AII-BVI compounds U12-E01A2<br />
with AIII-BV compounds U12-E01A1<br />
with AIV elements and their compounds<br />
U12-E01A3<br />
Semiconductor wafer<br />
circuit testing S01-G02B1<br />
U11-F01D<br />
flatness measurements U11-F01A3<br />
point defects, dust measurements by<br />
beam scanning U11-F01B2<br />
Semiconductors<br />
abrasives U11-A10<br />
adhesives U11-A09<br />
annealing for U11-C03J2A<br />
bipolar U12-D01<br />
blanket treatment, heat/radiation U11-C03J3<br />
built-in self test U11-F01D2<br />
carrier concentration measurement U11-F01A1<br />
carrier mobility measurement U11-F01A1<br />
chalcogenide/chalcopyrite, solar cell<br />
U12-A02A2E<br />
chemical analysis U11-F01A5<br />
cleaners U11-A10<br />
conductive materials U11-A08B<br />
conductive materials (inorganic) U11-A08B2<br />
conductive materials (organic) U11-A08B1<br />
containers U11-D01<br />
cooling arrangements U11-D02<br />
defects, control U11-C03J2B<br />
deposition of U11-C01<br />
developers U11-A11<br />
dielectric materials U11-A08A<br />
dielectric test U11-F01A9<br />
dislocations, measurement U11-F01A2<br />
<strong>EPI</strong> Manual Codes 2011 1145<br />
Part 3<br />
dopants U11-A01M<br />
doping U11-C02J<br />
encapsulants U11-A07<br />
etchants U11-A10<br />
etching U11-C07<br />
film measurement, by beam scanning<br />
U11-F01B2<br />
film measurement, during processing<br />
U11-F01B1<br />
film measurement, optical/electron<br />
microscopic examination U11-F01B4<br />
gases, for mfr U11-A12<br />
gettering U11-C03J2B<br />
handling U11-F02<br />
headers U11-D01<br />
heating arrangements U11-D02<br />
impurity reduction U11-C03J2A<br />
indirect bandgap, LED U12-A01A1D<br />
insulating materials for dielectric layer<br />
U11-A08A<br />
insulators U11-A08A<br />
layer formation U11-C05<br />
lead arrangements U11-D03<br />
lead attaching U11-E01<br />
lithography U11-C04<br />
measuring, positioning U11-F<br />
mountings U11-D<br />
packages U11-D<br />
polishers U11-A10<br />
positioning U11-F02B<br />
precursor material for deposition process<br />
U11-A13<br />
recrystallising layer U11-C03J1<br />
sealants U11-A07<br />
temperature measuring U11-F01A4<br />
terminal arrangements U11-D03<br />
terminals U11-D<br />
testing U11-F01<br />
testing apparatus U11-F01D3<br />
testing IC packaged device U11-F01C3<br />
testing of manufacturing apparatus U11-C09F1<br />
testing probes for IC packaged device<br />
U11-F01C3<br />
testing probes, for wafer level testing<br />
U11-F01D1<br />
testing using electron microscope U11-F01D3<br />
testing, at wafer level U11-F01D<br />
unipolar U12-D02<br />
ventilating arrangements U11-D02<br />
wafer holders U11-F02A1<br />
U11-F02A2<br />
Sense amplifier for memories U14-A07A<br />
Sensing<br />
digital mark T04-A03<br />
Sensitiser<br />
electrophotography, charge application<br />
S06-E02<br />
material in photoconductor S06-E01A3<br />
Sensor<br />
addressing, telemetry W05-D02J<br />
W05-D08E<br />
compensation S02-K02<br />
heat S03-A03<br />
image, facsimile S06-D05<br />
image, video camera W04-M01B5<br />
inductive V02-G01E
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