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Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters

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ultrasonic link (general) W05-D06A5<br />

utility meter reading application W05-D07G<br />

vehicle application W05-D07D<br />

vehicle service monitoring X22-X16<br />

vehicle theft X22-D03C<br />

Remote reading<br />

electricity meter S01-B01<br />

S02-K08A<br />

X12-H04A<br />

gas meter S02-K08A<br />

pressure measurement S02-F04E<br />

water meter S02-K08A<br />

Repair<br />

circuit breakers X13-B08<br />

electric machines V06-M11M<br />

X11-J08M<br />

integrated circuits U11-C19A<br />

moulded case circuit breakers X13-D08<br />

switchgear X13-E08<br />

Repeater<br />

data transmission W01-A06G5G<br />

line W02-C01E<br />

optical communications systems W02-C04A5<br />

radio W02-G05C<br />

Re-recording<br />

magnetic carrier T03-A07B<br />

magneto-optical carrier T03-D01E<br />

W04-D<br />

optical carrier T03-B05<br />

W04-C05<br />

Reserve cell X16-A03<br />

sea-water X16-A03B<br />

thermal X16-A03A<br />

Residual current circuit breaker X13-D05<br />

Resin encapsulated semiconductor packages<br />

U11-D01A1<br />

mfg. steps U11-E02A<br />

Resins<br />

analysis S03-E14D7<br />

Resist<br />

coating, semiconductor mfr. lithography U11-C04A1B<br />

for PCB mfr. V04-R01A<br />

for semiconductor mfr. U11-A06<br />

inorganic, for semiconductor mfr. U11-A06B<br />

layer processing, for semiconductor mfr.<br />

U11-C04A1F<br />

organic, for semiconductor mfr. U11-A06A<br />

stripping, semiconductor mfr. Lithography<br />

U11-C04A1C<br />

Resistance cutting - see Welding, resistance<br />

Resistance element - see Resistor<br />

X24-C<br />

Resistance welding - see Welding, resistance<br />

X24-C<br />

Resistance, measuring S01-D05B1<br />

in resistor manufacture S01-D05B1<br />

S01-G12A<br />

V01-A04H1<br />

Resistive braking, electric machines V06-N06<br />

X13-F02<br />

electric vehicle X21-A03C<br />

railway vehicle X23-A01B3<br />

<strong>EPI</strong> Manual Codes 2011 1137<br />

Part 3<br />

Resistive transducers S02-K03A2A<br />

conversion of sensor output S02-K03A2A<br />

Resistor V01-A<br />

array V01-A02G1<br />

chip V01-A02D<br />

coding V01-A01D<br />

composite V01-A02G<br />

composite RC component V01-A02G5<br />

V01-B03C8<br />

current responsive V01-A02B<br />

electrodes V01-A01C1<br />

encapsulation V01-A01B1<br />

film (discrete device only) V01-A02C<br />

film, novel composition V01-A02C3<br />

film, thick V01-A02C3C<br />

film, thin V01-A02C3A<br />

fixed V01-A02<br />

housings V01-A01B<br />

lead arrangements V01-A01C5<br />

leadless V01-A02D<br />

liquid (low power) V01-A02X<br />

manufacture - see Resistor manufacture<br />

V01-A04<br />

marking details V01-A01D<br />

mounting V01-A01B<br />

network V01-A02G1<br />

power X12-A<br />

semiconductor U12-C03<br />

semiconductor U12-C03A<br />

shielding V01-A01X<br />

substrate details V01-A01A<br />

surface mounting V01-A02D<br />

temp. compensation V01-A02H<br />

temp. dependent V01-A02A<br />

terminals V01-A01C5<br />

testing (see also Resistor manufacture)<br />

S01-G12A<br />

testing - see Resistor manufacture V01-A04H1<br />

thermistor - see Thermistor V01-A02A<br />

thick film (discrete device only) V01-A02C3C<br />

thin film (discrete device only) V01-A02C3A<br />

variable - see Variable resistor V01-A03<br />

varistor/voltage dependent - see Varistor<br />

V01-A02B<br />

wire-wound V01-A02F<br />

Resistor manufacture V01-A04<br />

attaching leads V01-A04F<br />

bandolier V01-A04J<br />

characterised by type V01-A04K<br />

chip resistor V01-A04K4<br />

coating substrate V01-A04B<br />

composite (RC, RL etc.) V01-A04K9<br />

encapsulation V01-A04D<br />

film resistor (discrete device only) V01-A04K3<br />

firing V01-A04E<br />

heat treatment V01-A04E<br />

leadless resistor V01-A04K4<br />

marking V01-A04H5<br />

multistep process V01-A04G1<br />

packing V01-A04J<br />

potentiometer V01-A04K6<br />

resistive material deposition V01-A04B<br />

semiconductor devices U11-C05G1A<br />

separation of chip elements V01-A04K4<br />

V01-A04X<br />

sintering V01-A04E<br />

sorting V01-A04H1

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