Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
1106 Subject Index PAL - see Logic arrays, integrated circuit programmable logic arrays U13-C04C Pancake, for magnetic record carrier storage T03-A02D5 Panel, gas discharge display V05-A01 Panoramic receiver S01-D03C1 Paper analysis S03-E14G book binding X25-T cardboard manufacture X25-T09B decurling, in electrophotographic appts S06-K02E dielectric, treatment and manufacture S06-E01X electronic W05-E10 for computer ink jet printer S06-G05 heat sensitive for computer printer S06-H01A jam clearing, in copier S06-k02B manufacture X25-T09 other paper industry aspects X25-T09G paper and envelope handling X25-F02A paper manufacture X25-T09A paper manufacture, control T06-D03A paper shredding / cutting X25-T09C photosensitive, for computer printer S06-E01 press X25-A02A recycling S06-K04A recycling processes / systems X25-W04 stapling, binding in copier S06-K05A thermal, for computer printer S06-H01 Paper printer S06-K02 general T04-J01 Paper making control T06-D03A X25-T09 electrophotography S06-E01X Paper towel dispenser X27-X PAPR (peak to average power ratio control) W02-G04B1 Parabolic aerial reflector W02-B03B1A Parachutes W06-B09 Parallel bus logic interface U21-C02C Parallel-series code conversion - see Code conversion, parallel/series U21-A05B Parametric audio systems W04-S05P Parity error detection data recording T03-P01A data transmission W01-A01B1A digital computer T01-G01A1 general U21-A06A2 Parking system control T07-F meter T05-G03A Parsing T01-J11A1 mark up language T01-J11C3 T01-N03B2B Particle accelerator X14-G cyclic X14-G02 linear X14-G01 Particle beam treatment, semiconductor U11-C03B U11-C03E Particle counter S03-F06C Particle detector V05-H Particle separator tube V05-J01 combination with chromatography appts. V05-J01K control V05-J01M detection system V05-J01J interface with other equipment V05-J01K ion-optical systems V05-J01G ionising arrangements V05-J01E monitoring V05-J01M sample introduction arrangement V05-J01C Particle size measurement S03-F05C Particle spectrometer combination with chromatography appts. V05-J01K control of V05-J01M detection systems V05-J01J interface with other equipment V05-J01K ion-optical systems V05-J01G ionising arrangements V05-J01E monitoring V05-J01M sample introduction arrangement V05-J01C Party line selection, telephone W01-B04 Party line system, telephone W01-C04 Pass-fail test, production line T05-E Passivation insulating layer, for semiconductor manufacture U11-C05B9A Passwords call sceening, subscriber end W01-C01F5 computer system T01-N02B1B data networks W01-A05B W01-A06E1C Paste dielectric for electrolytic capacitor Pasteurization see Milking, milk processing V01-B01B5 X25-P01C Patient monitoring during surgery S05-B04 surgical instrument monitoring S05-B04A table, positioning for radiation diagnosis S05-D02E Pattern generator (video) W04-M07 Pattern recognition T04-D character containing code marks T04-D01 colour T04-D08 detecting defect in pattern T04-D07A detecting movement T04-D07D1 detecting position or orientation T04-D07D5 edge recognition T04-D03B hand written character T04-D07E identification of items T04-D07C image acquisition T04-D02 image preprocessing T04-D03 noise reduction T04-D03A non-visible image T04-D07K recognition per se T04-D04 sorting objects T04-D07B system error detection T04-D05
vehicle licence plate T04-D07C T07-A03C5A Pattern transfer, masking techniques U11-C04D Payment freed appts. T05-H banknote operated T05-H02A coin operated mechanism T05-H01 coin testing or sorting T05-H03 construction T05-H08A control systems T05-H08C dispensing cooked articles T05-H04A dispensing cold articles T05-H04B dispensing discrete articles T05-H04 dispensing fluid, grain, electricity T05-H06 entertainment T05-H05E hiring articles T05-H05A magnetic card operated T05-H02C5A optical card operated T05-H02C5B public telephone T05-H05C W01-C07A return of payment T05-H05A1 reverse vending T05-H02E services T05-H05C smart card operated T05-H02C5C PC (personal computer) T01-M06A PCB ATE S01-G01B3 V04-R06G3 component bandolier V04-R04G1 component magazine V04-R04G1 conductive material V04-R02P double-sided V04-R05B flex-rigid V04-R05H holder/support V04-R09 hybrid U14-H03 V04-R05G flexible V04-R05D mounting in computer T01-L02C multilayer V04-R05A multilayer, ceramic U14-H03B V04-R05A1 printed antenna V04-Q06 W02-B07A3A printed connection V04-M05 V04-Q01 probe card V04-Q08 rigid V04-R05C rigid-flex V04-R05H solder mask V04-R04A2 solder mask, permanent V04-R03E V04-R04A2A soldering V04-R04A static electricity neutralising V04-R09 substrate V04-R07 substrate constructional details V04-R07F substrate, flexible V04-R07C substrate, hybrid U14-H03 V04-R07D substrate, material V04-R07L X12-E substrate, metal-clad V04-R07E substrate, metal-clad, double-sided V04-R07E2 substrate, metal-clad, single-sided V04-R07E1 substrate, metal-cored V04-R07B substrate, multilayer V04-R07A EPI Manual Codes 2011 1107 Part 3 substrate, multilayer ceramic U14-H03F V04-R07A1 testing - see PCB testing V04-R06 three-dimensional V04-R05E types V04-R05 PCB manufacture adhering metal layer V04-R02 V04-R07 adhesion aids V04-R02G adhesive application, SMT V04-R04B1 adhesive curing, SMT V04-R04B1 adhesive drying, SMT V04-R04B1 adhesive material, SMT V04-R04B2 applying conductive material V04-R02 applying conductive material, electroless plating V04-R02A applying conductive material X25-R04 applying conductive material, evaporation V04-R02E applying conductive material, screen printing V04-R02F applying conductive material, sputtering V04-R02D assembling components, leaded V04-R04D assembling electronic components V04-R04 assembling electronic components, clinching leadsV04- R04D1 assembling electronic components,cutting leads V04- R04D1 assembling electronic components,shaping leads V04- R04D1 assembling electronic components, SMT using adhesive V04-R04B1 assembling electronic components, surface-mounted V04-R04B blanking V04-R13 board conveying, general V04-R17 X25-F01 board handling, general V04-R17 CAD of wiring layout T01-J15A2 V04-R11 chemical plating V04-R02A circuit pattern V04-R02 clean flux V04-R04A5C X24-A01A cleaning, brush V04-R03C1 cleaning, CFC-free V04-R03C9 cleaning, chemical V04-R03C cleaning, mechanical V04-R03C cleaning, ultrasonic V04-R03C4 cleaning, vapour degreasing V04-R03C2 cleaning, wave bath V04-R03C3 component bandolier handling V04-R04G1 component feeding V04-R04G component magazine handling V04-R04G1 component orienting V04-R04G component placement machine V04-R04F component placement machine, pick-and-place V04-R04F3 component placement machine, robotic V04-R04F1 component positioning V04-R04G conformal coating V04-R03E cutting V04-R13 de-soldering apparatus V04-R03J V04-R04A X24-A02
- Page 115 and 116: Ice detection S03-D02B for aircraft
- Page 117 and 118: Imprint lithography, for semiconduc
- Page 119 and 120: transceiver W02-C04A4 transmitter W
- Page 121 and 122: Intelligent transducer V06-V01Q Int
- Page 123 and 124: Internet portal T01-N02B1H Internet
- Page 125 and 126: K Kalman filter U22-G01A1B Karaoke
- Page 127 and 128: connections, optical fibre U12-A01C
- Page 129 and 130: manufacture U11-C18B4 organic/ poly
- Page 131 and 132: portable, solar-powered X26-E01E po
- Page 133 and 134: well S03-C01C X25-E02 well, electro
- Page 135 and 136: variables measurement using SQUID S
- Page 137 and 138: alloy materials T03-A03 array type
- Page 139 and 140: electric installation X12-G01D elec
- Page 141 and 142: coefficient of friction, measuremen
- Page 143 and 144: depth using microwaves S02-A05C3, S
- Page 145 and 146: volume S02-C volume flow S02-C VSWR
- Page 147 and 148: static RAM U13-C04B1B testing, usin
- Page 149 and 150: II-VI element substrate (novel) V05
- Page 151 and 152: cellular base station W01-B05A1A W0
- Page 153 and 154: Multi-standard TV receiver decoder
- Page 155 and 156: Nd:YAG laser V08-A04C Near-field sy
- Page 157 and 158: Noise-measuring receiver S01-G08B3
- Page 159 and 160: hospital beds S05-G02B1 hospital mo
- Page 161 and 162: Optical disk carrier T03-B01 contai
- Page 163 and 164: card player/recorder T03-B10C T03-N
- Page 165: P P-n junction, IC component isolat
- Page 169 and 170: substrate, depositing (patterned) m
- Page 171 and 172: triggered by lack of activity W05-B
- Page 173 and 174: density S03-F01 emulsion concentrat
- Page 175 and 176: Polarimetry, optical S03-A02C Polar
- Page 177 and 178: micro hydroelectric X11-B05 mini hy
- Page 179 and 180: ushing X12-C01C bushing, manufactur
- Page 181 and 182: electroerosive S06-J electrographic
- Page 183 and 184: lens/optics associated with CRT V05
- Page 185 and 186: overvoltage limiter U24-F02 X13-C03
- Page 187 and 188: Q Q-factor measurement S01-D05A5 QA
- Page 189 and 190: audio amplifier W02-G03F baseband b
- Page 191 and 192: Rankine cycle plant X11-C05 Rapid p
- Page 193 and 194: duplication prevention, audio W04-G
- Page 195 and 196: components, frost sensor X27-F02C2
- Page 197 and 198: ultrasonic link (general) W05-D06A5
- Page 199 and 200: impact type S06-F03 Rice cooker, el
- Page 201 and 202: Satellite airborne radio relay W02-
- Page 203 and 204: Secondary emission electrodes, mfr.
- Page 205 and 206: adiation treatment U11-C03A U11-C03
- Page 207 and 208: Shift stores U14-A01 charge transfe
- Page 209 and 210: mechanical transmission W05-A01A pn
- Page 211 and 212: Solar cell U12-A02A X15-A02A array
- Page 213 and 214: power supplies W06-B03B propulsion
- Page 215 and 216: Sports and leisure activities W04-X
vehicle licence plate T04-D07C<br />
T07-A03C5A<br />
Pattern transfer, masking techniques<br />
U11-C04D<br />
Payment freed appts. T05-H<br />
banknote operated T05-H02A<br />
coin operated mechanism T05-H01<br />
coin testing or sorting T05-H03<br />
construction T05-H08A<br />
control systems T05-H08C<br />
dispensing cooked articles T05-H04A<br />
dispensing cold articles T05-H04B<br />
dispensing discrete articles T05-H04<br />
dispensing fluid, grain, electricity T05-H06<br />
entertainment T05-H05E<br />
hiring articles T05-H05A<br />
magnetic card operated T05-H02C5A<br />
optical card operated T05-H02C5B<br />
public telephone T05-H05C<br />
W01-C07A<br />
return of payment T05-H05A1<br />
reverse vending T05-H02E<br />
services T05-H05C<br />
smart card operated T05-H02C5C<br />
PC (personal computer) T01-M06A<br />
PCB<br />
ATE S01-G01B3<br />
V04-R06G3<br />
component bandolier V04-R04G1<br />
component magazine V04-R04G1<br />
conductive material V04-R02P<br />
double-sided V04-R05B<br />
flex-rigid V04-R05H<br />
holder/support V04-R09<br />
hybrid U14-H03<br />
V04-R05G<br />
flexible V04-R05D<br />
mounting in computer T01-L02C<br />
multilayer V04-R05A<br />
multilayer, ceramic U14-H03B<br />
V04-R05A1<br />
printed antenna V04-Q06<br />
W02-B07A3A<br />
printed connection V04-M05<br />
V04-Q01<br />
probe card V04-Q08<br />
rigid V04-R05C<br />
rigid-flex V04-R05H<br />
solder mask V04-R04A2<br />
solder mask, permanent V04-R03E<br />
V04-R04A2A<br />
soldering V04-R04A<br />
static electricity neutralising V04-R09<br />
substrate V04-R07<br />
substrate constructional details V04-R07F<br />
substrate, flexible V04-R07C<br />
substrate, hybrid U14-H03<br />
V04-R07D<br />
substrate, material V04-R07L<br />
X12-E<br />
substrate, metal-clad V04-R07E<br />
substrate, metal-clad, double-sided V04-R07E2<br />
substrate, metal-clad, single-sided V04-R07E1<br />
substrate, metal-cored V04-R07B<br />
substrate, multilayer V04-R07A<br />
<strong>EPI</strong> Manual Codes 2011 1107<br />
Part 3<br />
substrate, multilayer ceramic U14-H03F<br />
V04-R07A1<br />
testing - see PCB testing V04-R06<br />
three-dimensional V04-R05E<br />
types V04-R05<br />
PCB manufacture<br />
adhering metal layer V04-R02<br />
V04-R07<br />
adhesion aids V04-R02G<br />
adhesive application, SMT V04-R04B1<br />
adhesive curing, SMT V04-R04B1<br />
adhesive drying, SMT V04-R04B1<br />
adhesive material, SMT V04-R04B2<br />
applying conductive material V04-R02<br />
applying conductive material, electroless<br />
plating V04-R02A<br />
applying conductive material X25-R04<br />
applying conductive material, evaporation<br />
V04-R02E<br />
applying conductive material, screen<br />
printing V04-R02F<br />
applying conductive material, sputtering<br />
V04-R02D<br />
assembling components, leaded V04-R04D<br />
assembling electronic components V04-R04<br />
assembling electronic components, clinching leadsV04-<br />
R04D1<br />
assembling electronic components,cutting leads V04-<br />
R04D1<br />
assembling electronic components,shaping leads V04-<br />
R04D1<br />
assembling electronic components, SMT<br />
using adhesive V04-R04B1<br />
assembling electronic components,<br />
surface-mounted V04-R04B<br />
blanking V04-R13<br />
board conveying, general V04-R17<br />
X25-F01<br />
board handling, general V04-R17<br />
CAD of wiring layout T01-J15A2<br />
V04-R11<br />
chemical plating V04-R02A<br />
circuit pattern V04-R02<br />
clean flux V04-R04A5C<br />
X24-A01A<br />
cleaning, brush V04-R03C1<br />
cleaning, CFC-free V04-R03C9<br />
cleaning, chemical V04-R03C<br />
cleaning, mechanical V04-R03C<br />
cleaning, ultrasonic V04-R03C4<br />
cleaning, vapour degreasing V04-R03C2<br />
cleaning, wave bath V04-R03C3<br />
component bandolier handling V04-R04G1<br />
component feeding V04-R04G<br />
component magazine handling V04-R04G1<br />
component orienting V04-R04G<br />
component placement machine V04-R04F<br />
component placement machine,<br />
pick-and-place V04-R04F3<br />
component placement machine, robotic<br />
V04-R04F1<br />
component positioning V04-R04G<br />
conformal coating V04-R03E<br />
cutting V04-R13<br />
de-soldering apparatus V04-R03J<br />
V04-R04A<br />
X24-A02
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