Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
1104 Subject Index measurements of guide characteristics V07-J mode selector/converter V07-F03 packages, modules V07-G13 planar V07-F01A4 polarisation independent V07-F01A6 reels V07-H04 repair, maintenance V07-F01B2 rod V07-F01A slab V07-F01A4 splice cases V07-H02 splicing - see Optical couplers V07-G10B splicing equipment V07-H01 structures V07-F01A thin film V07-F01A5 Optics (printer) S06-D03 S06-E03B Optimum control system T06-A05 using algorithms T06-A05C Opto-electronic devices U12-A Opto-electronic integrated circuit U13-D04A Opto-electronic integrated circuit manufacture U11-C18B4 Opto-electronic logic circuit U21-C01G Opto-receiver amplifier U24-G01A5 Optocouplers U12-A02C1 Optoisolators U12-A02C1 Order telegraph W05-A04C Organ, computer W04-U01 Organic photoconductive layer S06-E01A1 Organic semiconductor devices U12-B03C film deposition U11-C01J5 light emitting diodes with organic layers U12-A01A1E Organiser T01-J11F T01-N03A3 Orientation measurement for surveying and navigation S02-B05A Orientation detection using pattern recognition T04-D07D5 Orientation flat, semiconductor wafer positioning U11-F02B Orientation switch V03-C06C Orthogonal multiplex systems W02-K07E Oscillator clock or watch timing source S04-B02 crystal U23-A01A dielectric resonator U23-A01B2 LCR U23-A01B LCR distributed constant elements U23-A01B2 LCR lumped constant elements U23-A01B1 MEMs U23-A01A2 microwave U23-Q negative resistance type U23-A02 output control U23-E01 quartz crystal U23-A01A receiver local oscillator W02-G03A7 SAW type U23-A01A1 sinusoidal U23-A temperature compensation U23-E05 transit time U23-A02 transmitter W02-G01A1 tunnel diode U23-A02 Oscilloscope S01-C01 probe S01-H03B OSD for recording appts. W04-J03C OSD for TV receiver W03-A13G channel number display W03-A01C W03-A13G OSI layer protocol W01-A06F Osmosis measurement S03-F04 Osmotic power generation X11-B09 X15-C OTDR - See Optical Time Domain Reflectometry Output control, X-ray appts. incorporating protection features V05-E02C5 limiting output level V05-E02C5C for flash operation V05-E02C1 Oven combination X27-C07 electric X27-C02 electric, using halogen lamp X27-C02A fan-assisted electric oven X27-C02C industrial cooking / baking equipment X25-P01A microwave - see Microwave oven X27-C01 toaster, grill X27-C03B Oven control, oscillators U23-E05 Overcurrent protection X13-C01A Overhead distribution / power line X12-G05 railway X23-A03A Overhead transmission line connector/fitting - see Cable Overload protection electric power system X13-C01A X13-C04A electronic circuits U24-F telephone circuits W01-C08A transducers, general S02-K02C transducers, pressure measurement S02-F04E Overmodulation avoidance (TX) W02-G04B1 Oversampling AD conversion U21-A03F6B AD converter architecture U21-A03A Overspeed protection for motor X13-C02 X13-C04C Overstress indicator, PCB, manufacture V04-R20 Overvoltage protection X13-C01C Ovshinsky-effect devices U12-B02 Oxidation, insulating thin film formation for semiconductor mfr. U11-C05B1 Ozone manufacture X25-X04 removal, in printer S06-K06B Ozoniser X12-F03 air conditioning X27-E01B2 for vehicle X22-J02E3
P P-n junction, IC component isolation U11-C08A1 PA systems W04-S05 amplifiers W04-S05A microphones W04-S05C mixing desk W04-S05A stands W04-S05C wireless microphones W04-S05C1 Pacemaker, heart S05-A01A control aspects S05-A01A5 demand type S05-A01A1 electrode S05-A02A power supplies S05-A01C remote programming S05-A01A5A Packages for semiconductor devices U11-D01 assembling U11-E assembly U11-E02A2 attaching covers, sealing device U11-E02A2 attaching leads U11-E01 bare chip mountings U11-D01A9 card type U11-D01A7 carrier tapes U11-D03A1B ceramic type U11-D01A1 chip on board (COB) U11-D01A3A chip/substrate connection, hybrid circuits, multichip package U14-H05 die bonding U11-E02A3 discrete device U11-D01B dual-in-line (DIP) U11-D01A1 electromagnetic shielding U11-D01C5 encapsulants U11-A07 encapsulated U11-D01A1 encapsulation U11-E02A encapsulation for hybrid, multichip packages U14-H05 U14-H04B flip chip U11-E01C forming lens on package U11-E02A9 gang bonding U11-E01B glob top U11-D01A3A high density U11-D01A6 high frequency package U11-D01A4 holders U11-D01Q hollow type U11-D01A1 hybrid circuits U14-H05 input/output pad layout U11-D03C1A lasers U12-A01B3 V08-A04A lead frame type U11-D01A1 lead frames U11-D03A1A light emitting diodes U12-A01A4 light emitting diodes (white light) U12-A01A4A marking U11-E02B3 memories U14-A10 metallic type U11-D01A1 moisture barrier package adaptation U11-D01C9 multichip modules U11-D01A6 phototransistor, photodiode or photoresistor U12-A02B3 pin insertion type U11-D01A1 power supply U11-D03C1A protection against electrostatic discharge U11-D01C3 protection against radiation U11-D01C2 protection from inspection, reverse EPI Manual Codes 2011 1105 Part 3 engineering U11-D01C3 protection fuses inside packages U11-D03C1B resin encapsulation U11-E02A1 sealants U11-A07 short circuit prevention U11-D01C9 solar cell U12-A02A1 substrates U11-D01A substrates, multilayer U14-H03F TAB packages U11-D01A1 U11-D01A3 tape automated bonding U11-E01B terminals, pins with special shape U11-D03A3 testing (air tightness, encapsulation moisture resistance) U11-F01E thermal protection U11-D01C6 thin film U14-H01D transport, carrier lines U11-F02A4 wafer scale U11-D01A8 window structures for ROMs, imagers U11-D01C1 wire bonding U11-E01A zigzag in line (ZIP) U11-D01A1 Packaging X25-F03A AV equipment W03-G10G electrical equipment X25-F03A1 electrical package X25-F03A3 electronic device (general) V04-X01A general V04-X01A television W03-A19G Packet data transmission W01-A03B assembler/disassembler (PAD) W01-A03B GPRS mobile phone aspects W01-C01D3 W01-C01G6G GPRS system aspects W01-B05A1A W01-C05B3J W02-C03C1A Push to talk over packet network, mobile phone aspects W01-C01G6H store and forward switching W01-A06G2 Packet switching, general and audio/video W02-K03 Packing X25-F03A1 control T06-D08X X25-F03A food packing / canning X25-P01X Pad grid array, semiconductor package U11-D01A3 U11-D01A5 Pad, semiconductor terminal U11-D03A2 PAFC X16-C04 Pagers W05-A05C1A receiver details W02-G03 transceiver (answer-back) W02-G02A3 Paging centre W05-A05C1E Paging system W05-A05C2 radio system aspects W02-C03C3 selective call (radio) aspects W01-B05A5 telephone exchange aspects W01-C02B7A telephone network aspects W01-C05A Pain threshold sensing S05-D01X Paint stripper X25-X X27-X
- Page 113 and 114: I i-mode telephone W01-C01G6E IC -
- Page 115 and 116: Ice detection S03-D02B for aircraft
- Page 117 and 118: Imprint lithography, for semiconduc
- Page 119 and 120: transceiver W02-C04A4 transmitter W
- Page 121 and 122: Intelligent transducer V06-V01Q Int
- Page 123 and 124: Internet portal T01-N02B1H Internet
- Page 125 and 126: K Kalman filter U22-G01A1B Karaoke
- Page 127 and 128: connections, optical fibre U12-A01C
- Page 129 and 130: manufacture U11-C18B4 organic/ poly
- Page 131 and 132: portable, solar-powered X26-E01E po
- Page 133 and 134: well S03-C01C X25-E02 well, electro
- Page 135 and 136: variables measurement using SQUID S
- Page 137 and 138: alloy materials T03-A03 array type
- Page 139 and 140: electric installation X12-G01D elec
- Page 141 and 142: coefficient of friction, measuremen
- Page 143 and 144: depth using microwaves S02-A05C3, S
- Page 145 and 146: volume S02-C volume flow S02-C VSWR
- Page 147 and 148: static RAM U13-C04B1B testing, usin
- Page 149 and 150: II-VI element substrate (novel) V05
- Page 151 and 152: cellular base station W01-B05A1A W0
- Page 153 and 154: Multi-standard TV receiver decoder
- Page 155 and 156: Nd:YAG laser V08-A04C Near-field sy
- Page 157 and 158: Noise-measuring receiver S01-G08B3
- Page 159 and 160: hospital beds S05-G02B1 hospital mo
- Page 161 and 162: Optical disk carrier T03-B01 contai
- Page 163: card player/recorder T03-B10C T03-N
- Page 167 and 168: vehicle licence plate T04-D07C T07-
- Page 169 and 170: substrate, depositing (patterned) m
- Page 171 and 172: triggered by lack of activity W05-B
- Page 173 and 174: density S03-F01 emulsion concentrat
- Page 175 and 176: Polarimetry, optical S03-A02C Polar
- Page 177 and 178: micro hydroelectric X11-B05 mini hy
- Page 179 and 180: ushing X12-C01C bushing, manufactur
- Page 181 and 182: electroerosive S06-J electrographic
- Page 183 and 184: lens/optics associated with CRT V05
- Page 185 and 186: overvoltage limiter U24-F02 X13-C03
- Page 187 and 188: Q Q-factor measurement S01-D05A5 QA
- Page 189 and 190: audio amplifier W02-G03F baseband b
- Page 191 and 192: Rankine cycle plant X11-C05 Rapid p
- Page 193 and 194: duplication prevention, audio W04-G
- Page 195 and 196: components, frost sensor X27-F02C2
- Page 197 and 198: ultrasonic link (general) W05-D06A5
- Page 199 and 200: impact type S06-F03 Rice cooker, el
- Page 201 and 202: Satellite airborne radio relay W02-
- Page 203 and 204: Secondary emission electrodes, mfr.
- Page 205 and 206: adiation treatment U11-C03A U11-C03
- Page 207 and 208: Shift stores U14-A01 charge transfe
- Page 209 and 210: mechanical transmission W05-A01A pn
- Page 211 and 212: Solar cell U12-A02A X15-A02A array
- Page 213 and 214: power supplies W06-B03B propulsion
P<br />
P-n junction, IC component isolation U11-C08A1<br />
PA systems W04-S05<br />
amplifiers W04-S05A<br />
microphones W04-S05C<br />
mixing desk W04-S05A<br />
stands W04-S05C<br />
wireless microphones W04-S05C1<br />
Pacemaker, heart S05-A01A<br />
control aspects S05-A01A5<br />
demand type S05-A01A1<br />
electrode S05-A02A<br />
power supplies S05-A01C<br />
remote programming S05-A01A5A<br />
Packages for semiconductor devices U11-D01<br />
assembling U11-E<br />
assembly U11-E02A2<br />
attaching covers, sealing device U11-E02A2<br />
attaching leads U11-E01<br />
bare chip mountings U11-D01A9<br />
card type U11-D01A7<br />
carrier tapes U11-D03A1B<br />
ceramic type U11-D01A1<br />
chip on board (COB) U11-D01A3A<br />
chip/substrate connection, hybrid<br />
circuits, multichip package U14-H05<br />
die bonding U11-E02A3<br />
discrete device U11-D01B<br />
dual-in-line (DIP) U11-D01A1<br />
electromagnetic shielding U11-D01C5<br />
encapsulants U11-A07<br />
encapsulated U11-D01A1<br />
encapsulation U11-E02A<br />
encapsulation for hybrid, multichip<br />
packages U14-H05<br />
U14-H04B<br />
flip chip U11-E01C<br />
forming lens on package U11-E02A9<br />
gang bonding U11-E01B<br />
glob top U11-D01A3A<br />
high density U11-D01A6<br />
high frequency package U11-D01A4<br />
holders U11-D01Q<br />
hollow type U11-D01A1<br />
hybrid circuits U14-H05<br />
input/output pad layout U11-D03C1A<br />
lasers U12-A01B3<br />
V08-A04A<br />
lead frame type U11-D01A1<br />
lead frames U11-D03A1A<br />
light emitting diodes U12-A01A4<br />
light emitting diodes (white light) U12-A01A4A<br />
marking U11-E02B3<br />
memories U14-A10<br />
metallic type U11-D01A1<br />
moisture barrier package adaptation<br />
U11-D01C9<br />
multichip modules U11-D01A6<br />
phototransistor, photodiode or<br />
photoresistor U12-A02B3<br />
pin insertion type U11-D01A1<br />
power supply U11-D03C1A<br />
protection against electrostatic discharge<br />
U11-D01C3<br />
protection against radiation U11-D01C2<br />
protection from inspection, reverse<br />
<strong>EPI</strong> Manual Codes 2011 1105<br />
Part 3<br />
engineering U11-D01C3<br />
protection fuses inside packages U11-D03C1B<br />
resin encapsulation U11-E02A1<br />
sealants U11-A07<br />
short circuit prevention U11-D01C9<br />
solar cell U12-A02A1<br />
substrates U11-D01A<br />
substrates, multilayer U14-H03F<br />
TAB packages U11-D01A1<br />
U11-D01A3<br />
tape automated bonding U11-E01B<br />
terminals, pins with special shape U11-D03A3<br />
testing (air tightness, encapsulation<br />
moisture resistance) U11-F01E<br />
thermal protection U11-D01C6<br />
thin film U14-H01D<br />
transport, carrier lines U11-F02A4<br />
wafer scale U11-D01A8<br />
window structures for ROMs, imagers<br />
U11-D01C1<br />
wire bonding U11-E01A<br />
zigzag in line (ZIP) U11-D01A1<br />
Packaging X25-F03A<br />
AV equipment W03-G10G<br />
electrical equipment X25-F03A1<br />
electrical package X25-F03A3<br />
electronic device (general) V04-X01A<br />
general V04-X01A<br />
television W03-A19G<br />
Packet data transmission W01-A03B<br />
assembler/disassembler (PAD) W01-A03B<br />
GPRS mobile phone aspects W01-C01D3<br />
W01-C01G6G<br />
GPRS system aspects W01-B05A1A<br />
W01-C05B3J<br />
W02-C03C1A<br />
Push to talk over packet network,<br />
mobile phone aspects W01-C01G6H<br />
store and forward switching W01-A06G2<br />
Packet switching, general<br />
and audio/video W02-K03<br />
Packing X25-F03A1<br />
control T06-D08X<br />
X25-F03A<br />
food packing / canning X25-P01X<br />
Pad grid array, semiconductor package<br />
U11-D01A3<br />
U11-D01A5<br />
Pad, semiconductor terminal U11-D03A2<br />
PAFC X16-C04<br />
Pagers W05-A05C1A<br />
receiver details W02-G03<br />
transceiver (answer-back) W02-G02A3<br />
Paging centre W05-A05C1E<br />
Paging system W05-A05C2<br />
radio system aspects W02-C03C3<br />
selective call (radio) aspects W01-B05A5<br />
telephone exchange aspects W01-C02B7A<br />
telephone network aspects W01-C05A<br />
Pain threshold sensing S05-D01X<br />
Paint stripper X25-X<br />
X27-X
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