Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
Derwent World Patents Index (DWPI) - EPI ... - Thomson Reuters
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static RAM U13-C04B1B<br />
testing, using built-in circuits U14-D01<br />
testing, using error correction codes U14-D02<br />
thin film arrays U14-H01A<br />
thin magnetic film U14-A04A<br />
using bipolar transistors U14-A03A1<br />
using diodes/bipolar<br />
transistors/thyristors U14-A03A<br />
with adjustable threshold FET cells U14-A03B7<br />
with electro-optical element U14-A02A<br />
with electrochemical cell U14-A03X<br />
with ferroelectric elements U14-A03F<br />
with FETs U14-A03B<br />
with hologram storage U14-A02B1<br />
with magneto-optical element U14-A02A<br />
with optical storage element U14-A02B<br />
with random access - see RAMs U14-A03<br />
with redundant circuits U14-D01A<br />
U14-D01B<br />
with shift stores - see Shift stores U14-A01<br />
with superconductive elements U14-A03G<br />
U14-F02B<br />
with variable resistance organic film U14-A03X<br />
word line control U14-A08<br />
Memory bus access control T01-H05B1<br />
Memory storage in facsimile S06-K07A4<br />
Memory storage in telephone W01-C01Q2<br />
Internal W01-C01Q2A<br />
External W01-C01Q2C<br />
T01-H01B3A<br />
Memory systems, computer T01-H01B<br />
associative T01-H03B<br />
by type T01-H03<br />
cache T01-H03A<br />
content addressable T01-H03B<br />
dual port T01-H03D<br />
hardware details T01-H01A<br />
illegal access T01-H01C2<br />
interleaved T01-H03C<br />
multiprocessor memory management<br />
T01-H08<br />
non-volatile T01-H01B3D<br />
other memory components T01-H01X<br />
other memory types T01-H03X<br />
preventing memory corruption/loss T01-H01C4<br />
protection of contents T01-H01C<br />
refresh T01-H01C3<br />
sequential access T01-H03D<br />
shared T01-H03D<br />
smart card, fraud prevention T01-H01C1<br />
stacks T01-H01D<br />
static T01-H01B3<br />
storage components T01-H01B<br />
virtual T01-H03A<br />
MEMS U12-B03F1<br />
MEMS actuator V06-M06G<br />
MEMS device U12-B03F1A<br />
MEMS display T04-H03C8<br />
MEMS generator V06-M06G8<br />
MEMS motor V06-M06G<br />
MEMS oscillator U23-A01A2<br />
MEMS relay V03-D10<br />
MEMS resonator V06-V01E<br />
V06-V01K1<br />
MEMS sensor V06-V01K1<br />
V06-V04G<br />
<strong>EPI</strong> Manual Codes 2011 1087<br />
Part 3<br />
MEMS switch V03-C10<br />
MEMS switch, manufacture V03-C07A<br />
MEMS system U12-B03F1B<br />
MEMS transducer(audio) V06-V01K1<br />
V06-V04A<br />
Menu-driven telephone W01-C01G8A<br />
Menu interface, keyboard T01-C02A1<br />
Mercury selenide - see AII-BVI compounds<br />
Mercury sulphide - see AII-BVI compounds<br />
Mercury telluride - see AII-BVI compounds<br />
Mercury thermometer S03-B01D<br />
MESFET - see Field effect transistor U12-D02B<br />
Metadata T01-J05B2C<br />
Metadyne X11-H09<br />
control X13-F03A9<br />
X13-G01A<br />
Metal<br />
casting X25-A01<br />
casting, control T06-D05B<br />
detector S03-C02B<br />
phase segregation, semiconductor masking<br />
U11-C04D2<br />
refining, electrolysis X25-R02<br />
shaping X25-A02<br />
shaping, control T06-D05A<br />
working, control T06-D05A<br />
Metal base transistor - see Hot electron<br />
transistor U12-D02J<br />
Metal insulator-silicon oxide-silicon<br />
structures - see MIOS<br />
Metal vapour laser - see Lasers V08-A04B<br />
Metal-air hybrid cell X16-A01B<br />
X16-D01<br />
electrode X16-E03<br />
X16-E06C1<br />
Metal-air primary cell X16-A01B<br />
Metal-air secondary cell X16-D01<br />
Metal-halogen cell X16-B01D<br />
X16-D02<br />
electrode X16-E06C2<br />
Metal-hydrogen cell X16-B01A3<br />
electrode X16-E05C<br />
Metal-in-gap magnetic head T03-A03F<br />
gap-filling material T03-A03F1<br />
Metal-Insulator-Metal - see MIM<br />
Metallurgical connections, semiconductor<br />
devices U11-D03B<br />
bonding pads U11-D03B1<br />
bump terminals U11-D03B1<br />
fuse U12-C04<br />
HF monolithic signal transmission lines<br />
U11-D03B9<br />
metal-ceramics bonding U11-D03B3<br />
solder U11-D03B3<br />
to substrate U11-D03B3<br />
Metallurgy X25-Q<br />
cold working X25-Q02<br />
heat treatment X25-Q02<br />
iron or steel manufacture X25-Q01<br />
process X25-Q
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