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EMBEDDED COMPUTING hundreds of other small boxes required for control applications or to collect and distribute data. Plus, a further fact is convincing: because both the CPU and APU technology is based on the same AMD Embedded G-Series platform, hardware platform vendors can find it very easy to switch their designs between the APUs and the CPU. They are thus able to offer both advantages with only a slight redesign of their full custom designs or board-level products such as computer-on-modules, single board computers, and motherboards. Thus the broad ecosystem developed for standard low-power x86 devices can also be extended for usage in even more specialized embedded devices. Owing to continuous improvements in processor design, the AMD Embedded G-Series platform has become more compact and power-optimized. The integration of the APU device reduces the footprint of a traditional three-chip platform to two chips. The APU and its companion controller hub simplify the design, as fewer board layers and a smaller power supply are required. With a 48% area efficiency improvement compared to the previous platform generations, the small footprint and low power consumption help reduce overall system costs and enable fanless ultra-mobile devices to run longer between battery charges. With an array of performance options, ranging from a 1.2 GHz single-core APU up to the 1.6 GHz dual-core variants, the AMD Embedded G-Series platform enables OEMs to utilize single board designs for the whole span of embedded systems - from entry-level up to highend solutions. Thus a single platform can be n Kontron: VPX/OpenVPX solution for high memory applications Kontron announces an additional SKU of its 6U VPX dual processor node VX6060 with 16 GByte soldered ECC RAM; several significant programs are already utilizing a cluster of these powerful processor nodes. All versions support the Kontron VXFabric API for IP based data transport over PCI Express to accelerate application development. OEMs benefit from a performance boost and simplified data flow management in high performance embedded computing applications based on 6U VPX/OpenVPX architectures and can begin with the development and deployment of high memory architectures based on Intel Core i7 technology. Each of the independently implemented dual-core Intel Core i7 processing nodes of the VX6060 have full access to 8 GByte ECC RAM. Through this enhanced memory capacity, extensive application data can be hosted in the low latency RAM without Figure Fig ig igu gure 3. 3 The Th T e AMD MD M G-Series processor covers rs r an area of only 361 mm² the basis for a host of product variants, for example a product family of box PCs with SKUs ranging from low-power up to high-performance versions. And if a new system based on this platform has already been developed, the reusability factor for new designs is tremendous because the processor’s high scalability covers the great majority of today’s x86 performance requirements in most embedded markets. Due to the common denominators of scalable platform design, the supply chain is simplified and operational complexity is minimized along with those associated costs, helping to drive better platform economics for the OEM. Furthermore the AMD Embedded lifecycles help to ensure the long-term availability of the platform which is essential, especially for the non- CE embedded computing markets. Both the AMD Embedded G-Series APUs and the CPUs Product News the need for reloading data from high latency mass storage devices. News ID 13676 n Curtiss-Wright: quad channel 250 MSPS 16-bit analog input FMC card Curtiss-Wright has introduced a new rugged FPGA Mezzanine Card module, the FMC- 516 is a quad channel 250 MSPS 16-bit analog input card that enables I/O devices to be directly coupled to a host FPGA. By providing direct ADC connection to the host FPGA, this compact card ensures maximum throughput and enables multiple channels and boards to be synchronized. The FMC-516 speeds and simplifies the integration of FPGAs into embedded system designs. The low latency, highbandwidth module eliminates data bottlenecks. The card is designed for use in demanding military applications such as Signal Intelligence, Electronic Counter Measures and RADAR that require high-speed ADC com- June 2011 28 for headless designs provide embedded customers with a complete and scalable platform with long-term support. This helps to speed up design work and development cycles and therefore helps shorten the time-to-market for applications that can offer an outstanding performance-per-watt ratio. The ideal applications for this platform cover a broad range - they rely on impressive visual experience while maintaining very low power consumption, or require an exceptionally high parallel processing power, or they are focused on an optimized feature set and highly efficient CPU performance for deeply embedded systems. With all the benefits available on a extremely compact footprint, it is not surprising that parallel to the launch of the new AMD Embedded G-Series platform, several embedded hardware manufacturers, including Compulab, Congatec, Fujitsu and Kontron, have already announced products with the first APU for embedded systems, on a broad range of form factors that can be also easily switched to headless variants. This can be done far more easily compared to previous platforms, since all designs have the same controller hub. With the introduction of one of the most competitive technologies to date, new AMD APU technology is a compelling solution which is not only suitable for the majority of applications in the entire embedded market, but also has the exciting potential to revolutionize the embedded computing market itself. Thus, OEMs should consider evaluating this new technology in their endeavor to fulfil customers’ demands for a vivid user experience and massive data throughputs in all offered performance classes. n ponents as part of a digital receiver. The FMC format is supported on a wide range of CWCEC FPGA-based host boards, which are designed to process the FMC-516’s I/O data with high bandwidth, low latency paths. News ID 13651 n Eurotech: low power PC/104+ module with true ISA and DOS support Eurotech launches the CPU-1440, a new low power PC/104+ module based on the Vortex86DX processor. At less than 4W of power consumption and fanless operation, the CPU- 1440 provides x86 compatibility for legacy applications using DOS, as well as for more current PC/104+ embedded applications using Linux and Windows CE. The flexibility and performance capabilities of Eurotech’s CPU- 1440 make it ideal for installations requiring rugged construction and high reliability, such as those in transportation applications. News ID 13718
n GE: OpenVPX module provides up to 24 ports of 10GigE layer 2/3 switching GE Intelligent Platforms announced the fully managed NETernity GBX460 rugged 6U Open- VPX data plane switch module. The GBX460 with OpenWare supports high throughput interprocessor communication between 10GigEenabled processing nodes for deployed network-centric defense and aerospace applications. Its non-blocking 10GigE ports provide high performance throughput across the VPX backplane; the non-blocking feature means that the GBX460 can pass traffic across all 10GigE ports at wire speed without bottlenecks. News ID 13663 n embedded-logic: PC/104+ with Atom N455 and Intel ICH8M Southbridge embedded-logic released the new PB-ATOM- L+N455/D425/D525, an advanced PC/104+ product based on the Intel Atom processor, as well as the Intel ICH8M Southbridge. The design is sophisticated and compact, ideal for industrial applications with highest requirements. The typical power consumption of the PB- ATOM-L+ N455 is under 10 watt. For price sensitive applications that require the optimal balance between performance and energy consumption. The PB-ATOM-L+N455/D425/D525 is offered in three different CPU-variants. One version has the Intel Atom processor N455 with 1,66 GHz clock frequency 512MB 2L Cache and 667 MHz Front-Side and memory bus, the Intel Atom processor D425 with 1,8 GHz clock frequency 512MB 2L News ID 13729 n BVM: industrial grade Core i7/i5/i3 Mobile Micro ATX motherboard BVM Group has augmented its family of compact Micro ATX format motherboards with the introduction of the MS-C71, which combines scalable computing power for heavy processing tasks, a huge array of I/O and expansion slots and integrated high definition graphics capability in a 244 x 244mm footprint. The mobile CPU and chipset minimise power consumption and reduce the cooling requirements of the finished system. Typical applications will be in kiosks, large-scale displays, industrial control and automation, security and surveillance, gaming, print imaging, digital signage and other applications where fast processing is a fundamental requirement. The SBC is based on the Intel Mobile QM57 Express chipset, supporting the 32nm Intel Core i7/i5/i3 Mobile processors in the rPGA988A socket with up to 8GB of 1066MHz dual-channel memory. HD audio is provided by the Realtek ALC888 HD Audio codec; HD VGA, 24-bit dual channel LVDS and optional DVI video are supported. Twelve USB2.0, five RS232 and one RS232/422/485 serial ports, two Gigabit Ethernet RJ45 network ports and an S/PDIF PRODUCT NEWS audio port are onboard. For mass storage, six ATA II 300MB/s interfaces supporting RAID 0/1/5/10 are provided. News ID 13745 n Diamond: managed 8-port Gigabit Ethernet Switch in PC/104 format Diamond Systems unveils Epsilon, a managed Layer 2 managed Ethernet switch module offering eight 10/100/1000Mbps copper twisted pair ports on a PC/104 form-factor board. Epsilon can be used standalone, without any connection to a single board computer, or in conjunction with a host CPU. The module’s builtin microcontroller handles configuration and management. On-board memory holds dual application images, boot code, MAC addresses, and other parameters, and can also be used for program execution.An RS-232 serial port enables communication between the module’s on-board management microcontroller and a host processor. Epsilon’s built-in microcontroller is also accessible via a web management interface over one of the Ethernet ports. Epsilon provides a full PC/104 stackthrough bus interface, allowing it to be integrated into any PC/104 stack. News ID 13715 n Kontron: 3U OpenVPX PCI Express and Ethernet hybrid switch Kontron has announced the 3U OpenVPX PCI Express and Ethernet hybrid switch VX3905 which delivers extremely high transfer rates in centralized VPX and OpenVPX platforms. With up to 4 x 6 Gen1/Gen2 PCIe backplane ports for the data plane, it provides ten times the I/O bandwidth found in systems deploying today and paves the way for a new generation of high performance embedded computing applications.The VX3905 is compliant with the Open- VPX VITA65 switch slot profile SLT3-SWH- 6F6U-14.4 for highest compatibility in multiboard designs. It provides up to 24 PCI Express Gen 1/Gen 2 ports for up to 32 lanes which can be configured ( x8, x4, x2 and x1) depending on the required bandwidth. News ID 13823 n AAEON: fanless multi-touch infotainment PC AAEON announced the newest addition to the ACP series: ACP-5182, a 18.5” industrialgrade, energy saving/low power consumption multi-touch infotainment Panel Computer. This product adheres to the market demand for a slim, compact and fanless Panel Computer with additional features such as spill-resistant IPx1 configuration and a scratch resistant touch panel. The ACP-5182 is powered by the Intel Dual Core Atom D510 Processor with the Intel ICH8M Chipset. This model is quiet and can serve in applications that require no ventilation or sound, such as hospitals and wafer factories. News ID 13817 29 June 2011
Page 1: COVER STORY Multi-core processors a
Page 4: CONTENTS Viewpoint 3 ATCA, MTCA & A
Page 7 and 8: Fi Figure 11: Si Simplified plif if
Page 9 and 10: n ELMA: 12-slot xTCA system with re
Page 11 and 12: Figure 1. CPU-to-CPU connectivity u
Page 13 and 14: terconnected via a high-performance
Page 15 and 16: an integrated 1U fan drawer. Fitted
Page 18 and 19: COMPACTPCI A straightforward x86 em
Page 20 and 21: PCI EXPRESS Using PCI Express as hi
Page 22 and 23: PCI EXPRESS Figure Fig ig igu gure
Page 24 and 25: EMBEDDED COMPUTING Figure Fig ig ig
Page 26 and 27: EMBEDDED COMPUTING A new processor
Page 30 and 31: PRODUCT NEWS n VIA: Mini-ITX board
Page 32 and 33: PRODUCT NEWS n NEXCOM: rugged trans
Page 34: PRODUCT NEWS n DDC: avionics 1553/4

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