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EMBEDDED COMPUTING A new processor generation for deeply embedded systems By Aurelius Wosylus, AMD Embedded Business Unit AMD Embedded G-Series processors use the same new 64-bit CPU core as the AMD Embedded G-Series accelerated processing units. This technology delivers x86 processing performance for deeply embedded, headless systems and devices which do not require any graphics output. n Historically, one of the main reasons for implementing x86 technologies into embedded systems was their high multi-purpose computing performance and network connectivity. As embedded computing technology has become more and more prevalent, sophisticated graphics capabilities for human machine interfaces (HMIs) in many different vertical markets have also dramatically gained significance. The combination of these two factors, the high multi-purpose computing power and the graphics capabilities, are paving the way for the extensive and growing success of x86 technologies in embedded applications. With the ongoing improvements in CPU performance, x86 processor technology has also proven successful and moved into areas where no graphics interface is required, such as high performance rack systems and backplane systems as used in AT/ISA 96 systems, VME or CompactPCI systems and ATCA, MicroTCA and VPX systems. Since graphics performance is not required, vendors have often implemented server-class chipsets into these systems. In recent years, the low-power embedded segment and dedicated-use systems have also been designed around x86 technology. This has been made possible by the ever-increasing performance-per-watt ratio and dramatically reduced footprint of new embedded x86 platforms, which now easily fit into very small d esigns and can meet the typical physical constraints of deeply embedded devices. Thus, x86 processor technology is now in a position to move more and more deeply into applications and segments where other processor technologies have dominated in the past. x86 technology is now set up to benefit headless system designs which have no need for a g raphics interface for displays. One example is the industrial automation sector where in the past, conventional hardware-decoded programmable logic controllers (PLCs) in the process level dominated. These devices usually provide no direct graphics functionality for the user interface. They are often connected to sensors and actuators such as motion control or distributed conveyor sensors and many other industrial applications. In this area, x86-based soft PLCs can now deliver, together with the connectivity via the always-on grid of connected devices, a value that can best be described by the terms openness and user comfort. The ability to access these deeply embedded devices via web browsers, for example, makes it possible to remotely configure and monitor decentralized processes over an entire factory from anywhere in the world. When OEMs use an x86 technology platform for these devices, they benefit from the extensive x86 ecosystem of software, tools, and compilers. There are further June 2011 26 Figure 1. One platform for a broad range of embedded applications: the AMD Embedded G-Series CPUs and APUs efficiencies based on the familiarity that so many designers and developers have with x86. System integrators can leverage unified and seamless communication and networking infrastructure across the entire shop floor up to the IT network, including the embedded systems in the field. Being able to deploy unified technology across the entire infrastructure can bring unique advantages in terms of cost and reliability. These enhancements open the p ossibilities to move even more deeply down the stack to sensors and actuators. Until now, this has been somewhat of a dilemma for x86 processor platforms: the smaller they became, the more functionality they integrated. This is especially true as the graphics unit, usually the second most energy-demanding component after the CPU, moved from the chipset into a single unit with the processor, enabling space-saving and highly powerefficient two-chip solutions instead of the former triumvirate of CPU, northbridge, and southbridge. Yet, despite the high integration of functionalities into the processor and the small form factor trend spurred by this integration, x86 technologies have still often been viewed as oversized for deeply embedded headless a pplications. This perception has persisted, even considering the fact that the x86 platform can now be an ideal fit with its low-power consumption, small form factor
and proven technologies used in millions of standard consumer devices and the extremely wide ecosystem of software and development tools. Consequently, to better pave the way for designers to take advantage of the benefits of x86 for deeply embedded applications, the ideal step would be to eliminate the overhead functionalities which are not required, by excluding them from the processor die. This is exactly what AMD has now done with its AMD Embedded G-Series processor. Following the recently launched AMD Embedded APUs in January 2011, at the Embedded World trade show AMD presented three new CPUs for the AMD Embedded G-Series, all based on the eagerly-awaited Bobcat core. These new CPUs are specifically offered for headless implementations, where there is no need for graphics or direct user input and these new variants of the AMD Embedded G-Series platform deliver amazing x86 CPU functionality. As with the standard APUs, the headless system variants of the AMD Embedded G-Series feature exceptional power efficiency and a feature set that is optimized to the needs of a large range of embedded systems. With three performance classes from the 800 MHz singlecore processor T24L up to the 1.4 GHz dual core T48L, the 64-bit multi-purpose x86 processing performance can be adjusted to suit the application. The CPUs feature a maximum thermal design power (TDP) of just 5 to 18 EMBEDDED COMPUTING Figure Fig ig igu gure 2. 2 The Th T e 64-bit 64 6 bit low-power low power “Bobcat” “B “ obcat” core of oof th tthe e AMD MD M GG-Series Series in deta detail: ta t il: severa several ra r l perf perform- rf rfo form ance features such as out-of-order instruction execution combined with a low-power design result in an excellent performance per watt ratio. watts. Furthermore, these new CPUs also include a variety of critical system elements including memory controllers, I/O controllers and bus interfaces. All this processing power comes in a very small BGA package that enables fanless designs and 4-layer printed circuit boards. With the new AMD Embedded G- Series CPUs, engineers can develop their embedded devices with new levels of power efficiency and can recognize more cost-effectiveness with optimized x86 platforms. Now, there is no need to change the basic technology platform that so many designers and engineers are familiar with in order to move more deeply into embedded appliances. These benefits make the AMD Embedded G- Series platform – whether the CPU or the APU - an ideal choice for a wide range of applications in the converging embedded markets. On the one hand, this new technology serves embedded applications in the consumer electronics (CE) area, smart residential gateways, storage appliances and NAS servers, and other network-connected devices. On the other hand, the highly scalable platform also serves deeply embedded applications which require exceptional overall performance on a small form factor and fanless design in combination with long-term availability. These designs can be found in many industrial markets such as automation, transportation, distributed smart grid data boxes, rugged firewalls, M2M and 27 June 2011
Page 1: COVER STORY Multi-core processors a
Page 4: CONTENTS Viewpoint 3 ATCA, MTCA & A
Page 7 and 8: Fi Figure 11: Si Simplified plif if
Page 9 and 10: n ELMA: 12-slot xTCA system with re
Page 11 and 12: Figure 1. CPU-to-CPU connectivity u
Page 13 and 14: terconnected via a high-performance
Page 15 and 16: an integrated 1U fan drawer. Fitted
Page 18 and 19: COMPACTPCI A straightforward x86 em
Page 20 and 21: PCI EXPRESS Using PCI Express as hi
Page 22 and 23: PCI EXPRESS Figure Fig ig igu gure
Page 24 and 25: EMBEDDED COMPUTING Figure Fig ig ig
Page 28 and 29: EMBEDDED COMPUTING hundreds of othe
Page 30 and 31: PRODUCT NEWS n VIA: Mini-ITX board
Page 32 and 33: PRODUCT NEWS n NEXCOM: rugged trans
Page 34: PRODUCT NEWS n DDC: avionics 1553/4

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