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GROUNDING (EARTHING) FOR INTEGRATED COMMUNICATION SITES CHAPTER 5: INTERNAL GROUNDING (EARTHING) If a bonding grid is present, it should be used to bond the raised flooring system supports at each grid node location and suspended ceiling grids, in at least four places, preferably at the corners of the dispatch area, using bonding methods described in this chapter. Other items such as electrical panelboards, metallic water fountains, metallic plumbing, metallic ventilation ducts and other metallic ancillary support items shall be bonded back to the nearest bonding grid conductor with a minimum 16 mm 2 csa (#6 AWG) copper conductor of the shortest length possible. The bonding grid should be established within the same space used to run electrical power and communication cables to the operator positions. This space can be below a raised flooring system that supports the operator positions, the space immediately below the structural floor supporting the operator positions, or the space above a suspended ceiling grid system when a raised flooring system has not been installed (ANSI T1.321-R2000). The bonding grid shall be made from 16 mm 2 csa (#6 AWG) or coarser stranded copper conductor that may be jacketed as allowed by the space where it will be installed. The grid node connections shall be made using irreversible compression-type connections that are listed for the purpose. Each grid node connection should be positioned vertically below or above (ceiling area) each cluster SSGB. The grid nodes may be established with horizontal offsets of 1.5 m (5 ft.) or less from a cluster. Each cluster SSGB shall be connected to its associated grid node with a minimum 16 mm 2 csa (#6 AWG) copper conductor of the shortest and straightest length possible. The SSGB grounding conductor shall be no greater than 3.9 m (13 ft.) in length. If greater lengths are needed, the SSGB grounding conductors and the bonding grid conductor shall be sized up to 35 mm 2 csa (#2 AWG). The bonding grid shall be effectively bonded to the dispatch room main collection point SSGB or MGB with a copper bonding conductor of the same size as the bonding grid conductor. This bonding conductor shall be bonded to the nearest bonding grid conductor with an exothermically welded or an irreversible compression-type connection. The conductor shall be bonded to the SSGB or MGB with exothermic welding, irreversible compression two-hole lug, or other irreversible compression means. 5.9 GROUNDING (EARTHING) FOR INTEGRATED COMMUNICATION SITES For communications sites located on the rooftop or within a high-rise building whose primary purpose is something other than a communications site, connection of the communications internal grounding (earthing) system shall be made to the building’s common grounding electrode system as described herein and within this chapter. The information within this section specifies the requirements for establishing an integrated communications site grounding system on or within a high-rise building where an internal grounding system does not exist. When communications equipment is located on or within a building with an established grounding system, the communications equipment shall be effectively bonded back the common bonding network (CNB) for the building. See ANSI T1-313-2003 and ANSI T1.333-2001 for additional information on bonding to the building CBN. At high-rise sites, connection to effectively grounded structural building steel is the preferred connection location for the equipment room MGB. In poured concrete buildings where structural building steel may not be an option, effectively grounded and accessible rebar may be considered for use as a connection point. If these options are not available, use the other methods recommended within this section. 5-68 68P81089E50-B 9/1/05
STANDARDS AND GUIDELINES FOR COMMUNICATION SITES GROUNDING (EARTHING) FOR INTEGRATED COMMUNICATION SITES An adequately sized MGB shall be installed within the equipment area by following the requirements in paragraphs 5.3.1 on page 5-9, 5.3.1.1 on page 5-9, 5.3.1.2 on page 5-11, and 5.3.1.3 on page 5-12. The MGB shall be effectively bonded to the nearest accessible location on the building's common grounding electrode system. Bonding of the MGB to the building's common grounding electrode shall be made using one or more of the following recommendations below: IMPORTANT: At sites, such as high-rise buildings, where it is difficult to achieve an effective grounding electrode system, the need for single-point grounding and transient voltage surge suppression (TVSS) on all input/outputs is of paramount importance. • Bonding to an existing building grounding backbone-type system. • Installation of a bonding backbone conductor(s) as described in “Communication Bonding Backbone Conductor and Grounding (Earthing) Equalizer Conductors” on page 5-25. • Grounding conductor shall be run in as straight a line as is practical (NFPA 70-2005, Article 810.21(E) and ANSI T1.313-2003) and shall be run in a downward direction. • Minimum bend radius of grounding conductors shall be 203 mm (8 in.), and the included angle shall not exceed 90 degrees as shown in Figure 5-13 on page 5-19 (NFPA 780-2004, Section 4.9.5 and ANSI T1.313-2003). • Grounding conductors shall be permitted to be run either outside or inside the building or structure (NFPA 70-2005, Article 810.21(G)). • Grounding conductors shall be protected where exposed to physical damage (NFPA 70-2005, articles 250.64, 800.100, 810.20, 820.100; and NFPA 780-2004, section 4.9.11). • Grounding conductors shall be securely fastened at intervals not exceeding 914 mm (3 ft.) (ANSI T1.334-2002, section 8.3 and NFPA 780-2004, Section 4.10.) • Grounding conductors exposed to physical damage shall be protected for a minimum distance of 1.8 m (6 ft.) above grade level (NFPA 780-2004, section 4.9.11.2). Such areas may include, but are not limited to, runways, driveways, school playgrounds, cattle yards, public walks (NFPA 780-2004, section 4.9.11). • Bonding to effectively grounded metallic piping systems under the advice of the building engineer. NOTE: Gas piping systems shall not be used as part of a grounding electrode system (NFPA 70-2005, Article 250.52(7)(B)), but shall be bonded upstream from the equipment shut-off value to the grounding electrode system as required by NFPA 70-2005, article 250.104 and NFPA 780-2004, section 4.14.1.3. NOTE: In situations where metal piping systems (other than gas piping) may be required for use as part of a grounding electrode system, electrical continuity shall first be verified. See NFPA 70-2005, Article 250.68(B) for more details. Figure 5-42, Figure 5-43, and Figure 5-44 show grounding options for integrated sites. 68P81089E50-B 9/1/05 5-69
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© 2005 MOTOROLA, INC. ALL RIGHTS R
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TABLE OF CONTENTS Chapter 1. Introd
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STANDARDS AND GUIDELINES FOR COMMUN
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CHAPTER 1 INTRODUCTION 1 This manua
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CHAPTER 2 SITE DESIGN AND DEVELOPME
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CHAPTER 3 COMMUNICATION SITE BUILDI
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CHAPTER 4 EXTERNAL GROUNDING (EARTH
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CHAPTER 5 INTERNAL GROUNDING (EARTH
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CHAPTER 8 MINIMIZING SITE INTERFERE
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CHAPTER 9 EQUIPMENT INSTALLATION 9
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APPENDIX A ELECTROMAGNETIC ENERGY I
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APPENDIX B SOIL RESISTIVITY MEASURE
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APPENDIX C PROTECTING AGAINST ELECT
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APPENDIX D GROUNDING (EARTHING) ELE
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APPENDIX E GENERAL CONVERSIONS AND
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APPENDIX F R56 COMPLIANCE CHECKLIST
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I NDEX Index Index AC power cabling
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