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GROUNDING (EARTHING) FOR SMALL, LARGE, AND MULTI-STORY BUILDINGS CHAPTER 5: INTERNAL GROUNDING (EARTHING) NOTE: Conductors installed within a plenum shall be compliant with NFPA 70-2005, Article 300.22 and cables installed within Information Technology rooms shall be compliant with NFPA 70-2005, Article 645. Ground conductors shall have an approved covering (insulation) or may be bare. When bare conductors are used they shall be solidly supported on suitable standoff insulators at intervals of no more than 610 mm (24 in.). These conductors shall not make contact with metallic surfaces or other conductors unless intended to be bonded to these surfaces or conductors. NOTE: The interior water piping systems of the building and metallic cable shields shall not be used as communication bonding backbone conductors (ANSI-J-STD-607-A-2002). In all cases, the main SSGB shall be bonded to the communication bonding backbone conductor or grounding equalizer conductor with a conductor the same size as the communication bonding backbone conductor. The MGB grounding conductor for the service equipment (power) ground shall be, at a minimum, the same size as the communication bonding backbone conductor (ANSI-J-STD-607-A- 2002). 5.7.3 BONDING CONNECTIONS FOR THE MGB The connection of the MGB grounding (earthing) conductor, the communication bonding backbone conductor(s) and ground bus conductors to the MGB shall utilize exothermic welding, listed compression two-hole lugs, or irreversible compression type connections. The connection of equipment grounding conductors that bond communications equipment to the MGB shall utilize exothermic welding, listed compression single-hole lugs, or other irreversible compression type connections. Twohole lugs are preferred over single-hole lugs (ANSI-J-STD-607-A-2002). NOTE: All grounding and bonding connectors shall be listed for the application by a nationally recognized testing laboratory (ANSI-J-STD-607-A-2002). The MGB grounding conductor shall be bonded to the building's common grounding electrode system as described in paragraph 5.3.1.3 on page 5-12. 5.7.4 BONDING CONNECTIONS FOR THE SSGB The grounding (earthing) conductor between the main SSGB and the communication bonding backbone conductor shall be continuous and routed in the shortest possible straight line path back towards the MGB. If a bend is required in the SSGB grounding conductor, minimum bending radius and angle shall be adhered to. The grounding conductor shall be connected to the SSGB with exothermic welding, compression two hole lug, or an irreversible compression type connector. The SSGB grounding conductor shall be connected to the communication bonding backbone conductor or to the grounding equalizer conductor with exothermic welding or irreversible compression-type connection. The connection of equipment grounding conductors for bonding communications equipment to the SSGB shall utilize exothermic welding, listed compression single-hole lugs, or other irreversible compression type connections. Two-hole lugs are preferred over single hole-lugs (ANSI-J-STD-607-A-2002) 5-60 68P81089E50-B 9/1/05
STANDARDS AND GUIDELINES FOR COMMUNICATION SITES GROUNDING (EARTHING) FOR SMALL, LARGE, AND MULTI-STORY BUILDINGS NOTE: All grounding and bonding connectors shall be listed for the application by a nationally recognized testing laboratory (ANSI-J-STD-607-A-2002). When a grounding equalizer conductor is bonded to a main SSGB, the grounding equalizer conductor shall be connected to the SSGB using exothermic welding, compression two-hole lugs, or irreversible compression type connections. 5.7.5 ITEMS TO BE BONDED TO THE INTERNAL GROUND (EARTH) SYSTEM See ANSI-J-STD-607-A-2002 for additional information. When a electrical power panelboard is located in the same room or space as the MGB or SSGB, that panelboard's alternating current equipment ground (earth) (ACEG) bus or the panelboard enclosure shall be effectively bonded to the MGB or the SSGB with a 16 mm 2 csa (#6 AWG) or coarser grounding conductor. Where a panelboard for the communications equipment is not located in the same room or space as the SSGB, consideration should be given to bonding panelboard ACEG bus or the panelboard enclosure back to the SSGB with a properly sized grounding conductor. In all cases the grounding conductor should be sized according to its length in accordance with the requirements in Table 5-5 on page 5-29. All metallic raceways or cable trays for telecommunication cabling that is located within the same room or space as the MGB or a main SSGB shall be effectively bonded back to the MGB or the SSGB with a 16 mm 2 csa (#6 AWG) or coarser, grounding conductor as described in paragraph 5.5.1.5 on page 5-45. When structural building steel is readily accessible within the room of a MGB or main SSGB, the MGB and/or SSGB shall be effectively bonded to the vertical steel frame with a 16 mm 2 csa (#6 AWG) or coarser, grounding conductor by following bonding methods in paragraphs 5.4.2 on page 5-34 and 5.4.3 on page 5-36. If the structural steel frame is external to the room or space of the MGB or SSGB and readily accessible, the steel frame should be bonded back to the MGB or SSGB with a 16 mm 2 csa (#6 AWG) or coarser, grounding conductor as described above. The MGB or SSGB grounding conductor shall be bonded to the vertical steel column, routed downward toward the earth’s surface. When practicable because of shorter conductor runs and where horizontal steel members of the building frame are permanently and electrically bonded to the vertical column members, the SSGBs may be bonded to the horizontal members. The grounding conductor should be sized according to its length as shown in Table 5-5 on page 5-29, and if a bend is required in the grounding conductor, minimum bending radius and angle shall be adhered to. The telecommunications primary SPD grounding conductor shall be connected to the MGB using the shortest and straightest routing path practical. A minimum separation distance of 305 mm (1ft) shall be maintained between other cable groups even if the conductor is routed inside a metallic conduit. See paragraph 5.5.1.8.2 on page 5-50 for additional information. 68P81089E50-B 9/1/05 5-61
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© 2005 MOTOROLA, INC. ALL RIGHTS R
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TABLE OF CONTENTS Chapter 1. Introd
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STANDARDS AND GUIDELINES FOR COMMUN
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CHAPTER 1 INTRODUCTION 1 This manua
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CHAPTER 2 SITE DESIGN AND DEVELOPME
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CHAPTER 3 COMMUNICATION SITE BUILDI
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CHAPTER 4 EXTERNAL GROUNDING (EARTH
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CHAPTER 5 INTERNAL GROUNDING (EARTH
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CHAPTER 7 SURGE PROTECTIVE DEVICES
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CHAPTER 8 MINIMIZING SITE INTERFERE
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CHAPTER 9 EQUIPMENT INSTALLATION 9
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APPENDIX A ELECTROMAGNETIC ENERGY I
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APPENDIX B SOIL RESISTIVITY MEASURE
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APPENDIX C PROTECTING AGAINST ELECT
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APPENDIX D GROUNDING (EARTHING) ELE
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APPENDIX E GENERAL CONVERSIONS AND
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APPENDIX F R56 COMPLIANCE CHECKLIST
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I NDEX Index Index AC power cabling
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