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GROUNDING (EARTHING) FOR SMALL, LARGE, AND MULTI-STORY BUILDINGS CHAPTER 5: INTERNAL GROUNDING (EARTHING) 5.7 GROUNDING (EARTHING) FOR SMALL, LARGE, AND MULTI- STORY BUILDINGS Building infrastructure encompasses telecommunication spaces, pathway, cables, connecting hardware, and the telecommunication grounding (earthing) and bonding system (ANSI-J-STD-607-A-2002). The information herein specifies the requirements for establishing a uniform communication grounding system within a small, large or multistory building when an internal grounding system does not exist. For additional information, see ANSI-J-STD-607-A-2002. 5.7.1 ESTABLISHING A COMMUNICATION GROUNDING (EARTHING) SYSTEM A MGB shall be properly installed as described herein and within “General Bonding Requirements” on page 5-31. The MGB serves as the dedicated extension of the building grounding (earthing) electrode system for the communication systems throughout the building. It also serves as a central attachment point for the communication bonding backbone conductor(s) and the equipment. There should only be a single MGB installed within the building. The following paragraphs are requirements of ANSI-J-STD- 607-A-2002. NOTE: Buildings or campuses with more than one electrical service entrance, each of which serves the communication system, require special design considerations that are beyond the scope of this document. Consultation with Motorola Engineering or with an engineering firm specializing in grounding system design is recommended in the instances. The MGB shall be bonded back to the service equipment (power) ground with the shortest and straightest routing possible. The MGB grounding conductor should be routed to provide a direct downward flow path back to the building's grounding electrode system. If a bend is required in the MGB grounding conductor, minimum bending radius and angle shall be adhered to. The ideal location for the MGB is in the telecommunications entrance facility, however the MGB should be located to minimize the length of the MGB grounding conductor back to the electrical service (power) ground where the electrical service neutral to ground bond has been established. When a panelboard is located within the same room as the MGB, the MGB shall be located as close to the panelboard as practicable and it shall be installed to maintain clearances required by applicable electrical codes. The MGB should also be located to provide the shortest and straightest routing for the telecommunications primary SPD grounding conductor. See Figure 5-38 for an example. 5-58 68P81089E50-B 9/1/05
STANDARDS AND GUIDELINES FOR COMMUNICATION SITES GROUNDING (EARTHING) FOR SMALL, LARGE, AND MULTI-STORY BUILDINGS ELECTRICAL ENTRANCE FACILITY F SERVICE N G GROUNDING ELECTRODE CONDUCTOR COMMUNICATIONS A BONDING BACKBONE CONDUCTOR FIGURE 5-38 BONDING TO THE ELECTRICAL SERVICE (POWER) GROUND At locations where communication bonding backbone conductors are used to interconnect multiple equipment rooms together, the communication bonding backbone conductors shall meet the installation requirements as specified in paragraph 5.3.6 on page 5-25. While the communication bonding backbone conductor will carry fault current under AC power ground fault conditions, it is not intended to serve as the only conductor providing a ground fault current return path. SSGBs shall be installed as described herein and within paragraph 5.3.2 beginning on page 5-15. A main SSGB shall be placed in each communications equipment room or space as needed to keep equipment ground bus conductors or equipment grounding conductors as short as practicable. If a bend is required in the SSGB grounding conductor, minimum bending radius and angle shall be considered. When a panelboard for the communications equipment is located within the same room or space as the main SSGB, the SSGB shall be located as close to the panelboard as practicable and shall be installed to maintain clearances as required by applicable electrical codes. 5.7.2 SPECIFICATIONS FOR CONDUCTORS TELECOMMUNICATIONS A ENTRANCE FFACILITY All grounding (earthing) and bonding conductors shall be copper and may be insulated. When the conductors are insulated, they shall be listed for the space in which they are intended to be placed. See paragraph 5.3.4 beginning on page 5-20 for information on grounding conductor specifications. All grounding and bonding conductors shall be sized according to their functions. Grounding conductor sizing specifications are located in the following sections: • Ground bus conductors: paragraph 5.3.5.2 on page 5-25 • Communication bonding backbone conductors: paragraph 5.3.6.2 on page 5-26 • IPGB conductors: paragraph 5.3.7.2 on page 5-29 • Equipment grounding conductors: paragraph 5.3.8.2 on page 5-29 • Bonding jumpers: paragraph 5.3.9.2 on page 5-30 68P81089E50-B 9/1/05 5-59 MGB CONDUCTOR FOR MGB EQUIPMENT
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© 2005 MOTOROLA, INC. ALL RIGHTS R
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TABLE OF CONTENTS Chapter 1. Introd
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STANDARDS AND GUIDELINES FOR COMMUN
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CHAPTER 1 INTRODUCTION 1 This manua
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CHAPTER 2 SITE DESIGN AND DEVELOPME
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CHAPTER 3 COMMUNICATION SITE BUILDI
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CHAPTER 4 EXTERNAL GROUNDING (EARTH
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CHAPTER 5 INTERNAL GROUNDING (EARTH
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Page 201 and 202: STANDARDS AND GUIDELINES FOR COMMUN
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CHAPTER 7 SURGE PROTECTIVE DEVICES
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CHAPTER 8 MINIMIZING SITE INTERFERE
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CHAPTER 9 EQUIPMENT INSTALLATION 9
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APPENDIX A ELECTROMAGNETIC ENERGY I
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APPENDIX B SOIL RESISTIVITY MEASURE
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APPENDIX C PROTECTING AGAINST ELECT
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APPENDIX D GROUNDING (EARTHING) ELE
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APPENDIX E GENERAL CONVERSIONS AND
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APPENDIX F R56 COMPLIANCE CHECKLIST
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I NDEX Index Index AC power cabling
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