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CONNECTION METHODS FOR INTERNAL GROUNDING (EARTHING) SYSTEM CHAPTER 5: INTERNAL GROUNDING (EARTHING) 5.4.3 BONDING TO THE MGB, SSGB AND RGB All applicable general bonding requirements and the bonding requirements listed below shall apply when attaching grounding (earthing) conductors, grounding electrode conductors, ground bus conductors and equipment grounding conductors to the MGB, SSGB or RGB: • The MGB grounding conductor(s) shall be installed using the shortest and straightest downwardflowing path toward the earth and the grounding electrode system. For examples of grounding conductor routing requirements see Figure 5-8 on page 5-12 and Figure 5-9 on page 5-14. • All ground bus conductors and equipment grounding conductors bonded directly to the MGB, SSGB or RGB shall have a direct path back toward the grounding electrode system. • Connection of a grounding conductor, grounding electrode conductor, communication bonding backbone conductor and ground bus conductor to the MGB or SSGB shall utilize exothermic welding, listed irreversible compression-type connection or listed compression two-hole lug and securing hardware of the proper size for the application unless otherwise specified within this chapter (ANSI-J-STD-607-A-2002). • Connection of a grounding conductor, grounding electrode conductor and ground bus conductor to the RGB shall utilize exothermic welding, listed irreversible compression-type connection, or listed compression lug and securing hardware of the proper size for the application. Listed compression two-hole lugs are preferred. • Connection of an equipment grounding conductor to the MGB, SSGB or RGB shall utilize exothermic welding, listed irreversible compression-type connection, listed compression lug, or listed pressure lug and securing hardware of the proper size for the application. Listed compression two-hole lugs are preferred (ANSI-J-STD-607-A-2002). • Grounding materials should be of copper or copper alloy. Where other materials are used in conjunction with copper or copper alloy, care shall be exercised in providing proper bimetallic couplings to reduce the possibility of galvanic corrosion (ANSI T1.334-2002; ANSI T1.313-2003). • It is desirable for the MGB, SSGB, and RGB to be electrotin-plated for reduced contact resistance. If not electrotin-plated, the bus bar bonding surface shall be cleaned prior to fastening the conductor's connection device. An appropriate type of listed conductive anti-oxidant compound should be applied to the contact area to control corrosion and reduce contact resistance of mechanical and compression-type connections. Some customers such as cellular operators may require that conductors be bonded to the MGB in a specific sequence or order determined by the conductor's origin or the type of equipment being bonded to the MGB. One of these methods, known as PANI, allocates specific areas of the MGB for bonding surge energy Producers, Absorbers, Non-isolated equipment, and Isolated equipment. An example of this type of configuration is shown in Figure 5-23 and Figure 5-24. This method is not required for compliance with this installation standard and is provided for reference only. See ANSI T1.313-2003 for additional information on this method of bonding to the MGB. 5-36 68P81089E50-B 9/1/05
STANDARDS AND GUIDELINES FOR COMMUNICATION SITES CONNECTION METHODS FOR INTERNAL GROUNDING (EARTHING) SYSTEM INTERIOR EXTERIOR TO OTHER FLOORS PANI connections from other floors P A N I Vertical ground riser P A N I { { { { { { { CATEGORY TELECOMM- UNICATIONS MECHANICAL AC POWER NON-ISOLATED INTEGRATED GROUNDS DC POWER ISOLATED GROUND EQUIPMENT BUILDING INTERNAL FIGURE 5-23 PANI GROUNDING SYSTEM SEQUENCE { BUILDING EXTERNAL Internal radio frames Outside Plant Metallic Members* HVAC Motors Generator Frame AC Service Equipment Ground Integrated Frames Telecom Ironwork 48 Volt* Other DC Supplies* Isolated Frames* DC Power Returns* (optional) Water Pipe Building Steel EXAMPLES Grounding Electrode System Tower Grounding Electrode System Lightning Protection System NOTE: Items marked with an asterisk (*) may have ground bars associated with them. 68P81089E50-B 9/1/05 5-37
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© 2005 MOTOROLA, INC. ALL RIGHTS R
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TABLE OF CONTENTS Chapter 1. Introd
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STANDARDS AND GUIDELINES FOR COMMUN
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CHAPTER 1 INTRODUCTION 1 This manua
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CHAPTER 2 SITE DESIGN AND DEVELOPME
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CHAPTER 3 COMMUNICATION SITE BUILDI
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CHAPTER 4 EXTERNAL GROUNDING (EARTH
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Page 179 and 180: STANDARDS AND GUIDELINES FOR COMMUN
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CHAPTER 7 SURGE PROTECTIVE DEVICES
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CHAPTER 8 MINIMIZING SITE INTERFERE
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CHAPTER 9 EQUIPMENT INSTALLATION 9
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APPENDIX A ELECTROMAGNETIC ENERGY I
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APPENDIX B SOIL RESISTIVITY MEASURE
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APPENDIX C PROTECTING AGAINST ELECT
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APPENDIX D GROUNDING (EARTHING) ELE
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APPENDIX E GENERAL CONVERSIONS AND
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APPENDIX F R56 COMPLIANCE CHECKLIST
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I NDEX Index Index AC power cabling
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