Acer Emachines E627 COMPAL LA-5481P HCWG0_H0 Rev1.0
Service Manual Acer Emachines E627...
Service Manual Acer Emachines E627...
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5
4
3
2
1
+1.8VS
D
C
<17>
LDT_RST#
<17> H_PWRGD
<13,17> LDT_STOP#
1 2
+1.8VS
1 2
+1.8VS
1 2
R344
300_0402_5%
LDT_RST#
1
C721
0.01U_0402_25V4Z
@
2
R346
300_0402_5%
H_PWRGD
1
C720
0.01U_0402_25V4Z
@
2
R342
300_0402_5%
LDT_STOP#
1
C719
0.01U_0402_25V4Z
@
2
+3VS
C119
0.1U_0402_16V4Z
1 2
+2.5VS
C113
150U_D2_6.3VM
<16> CLK_CPU_BCLK
<16> CLK_CPU_BCLK#
1
+
2
+2.5VDDA VDDA=300mA
L4
<15/20>
1 2
3300P_0402_50V7K
FCM2012CF-800T06_2P
1
1
1
C116
C118
C22
0.22U_0603_16V4Z
2
2
2
4.7U_0805_10V4Z
<BOM Structure>
<BOM Structure>
LDT_RST#
H_PWRGD
LDT_STOP#
(10/5/5/5/10)
+1.2V_HT
1 2
3900P_0402_50V7K
C109
1
2
R22
169_0402_1%
1 2
C23
3900P_0402_50V7K
R61
R16
2
R13
<45> CPU_VCC_SENSE
<45> CPU_VSS_SENSE
1 2
44.2_0402_1% CPU_HTREF1 P6
1 2
44.2_0402_1% CPU_HTREF0 R6
(5/10, >1")
CPU_CLKIN_SC_P
CPU_CLKIN_SC_N
1 CPU_SIC
300_0402_5%
CPU_DBRDY
CPU_TMS
CPU_TCK
CPU_TRST#
CPU_TDI
CPU_TEST25_H_BYPASSCLK_H
CPU_TEST25_L_BYPASSCLK_L
CPU_TEST19_PLLTEST0
CPU_TEST18_PLLTEST1
(10/10)
TP26
TP3
TP5
TP30
TP8
TP28
TP31
CPU_THERMDC
CPU_THERMDA
F8
F9
B7
A7
F10
AF4
AF5
F6
E6
W9
Y9
A9
A8
G10
AA9
AC9
AD9
AF9
E9
E8
G9
H10
AA7
C2
D7
E7
F7
C7
AC8
C3
AA6
W7
W8
Y6
AB6
VDDA2
VDDA1
RESET_L
PWROK
LDTSTOP_L
SIC
SID
HTREF1
HTREF0
VDDIO_FB_H
VDDIO_FB_L
CLKIN_H
CLKIN_L
DBRDY
TMS
TCK
TRST_L
TDI
JCPU1D
THERMTRIP_L
PROCHOT_L
VID5
VID4
VID3
VID2
VID1
VID0
CPU_PRESENT_L
VDD_FB_H
VDD_FB_L
PSI_L
TEST25_H
TEST25_L
TEST19
TEST18
TEST13
TEST9
TEST17
TEST16
TEST15
TEST14
TEST12
TEST7
TEST6
THERMDC
THERMDA
TEST3
TEST2
DBREQ_L
TDO
TEST29_H
TEST29_L
TEST24
TEST23
TEST22
TEST21
TEST20
TEST28_H
TEST28_L
TEST27
TEST26
TEST10
TEST8
AF6
AC7
A5
C6
A6
A4
C5
B5
CPU_THERMTRIP#_R
CPU_PROCHOT#_1.8
AC6 CPU_PRESENT#
A3
E10
CPU_DBREQ#
TP6
TP7
TP9
CPU_TEST21_SCANEN
TP29
CPU_TEST26_BURNIN#
CPU_VID5 <45>
CPU_VID4 <45>
CPU_VID3 <45>
CPU_VID2 <45>
CPU_VID1 <45>
CPU_VID0 <45>
PSI_L <45>
AE9 CPU_TDO
R53
80.6_0402_1%
C9 CPU_TEST29_H_FBCLKOUT_P 1 2
C8 CPU_TEST29_L_FBCLKOUT_N
<BOM Structure>
ROUTE AS 80 Ohm DIFFERENTIAL PAIR
PLACE IT CLOSE TO CPU WITHIN 1"
AE7
AD7
AE8
AB8
AF7
J7
H8
AF8
AE6
K8
C4
+1.8V
CPU_VID1
CPU_PRESENT#
CPU_TEST26_BURNIN#
CPU_TEST21_SCANEN
2
R65
2
R68
2
R69
2
R66
+1.8V
1 2
VID1: For compatibility
with future processors
R24
300_0402_5%
<BOM Structure>
1 2
R64
1K_0402_5%
<BOM Structure>
1 2
R27
300_0402_5%
1 2
R47
300_0402_5%
1 CPU_TEST25_H_BYPASSCLK_H
510_0402_5%
1 CPU_TEST25_L_BYPASSCLK_L
510_0402_5%
1
CPU_TEST19_PLLTEST0
300_0402_5%
1
CPU_TEST18_PLLTEST1
300_0402_5%
D
C
B
CPU_THERMDA
1 2 CPU_THERMDC
C120
2200P_0402_50V7K
U3
1
VDD
2
3
4
D+
D-
THERM#
SCLK 8
SDATA
ALERT#
ADM1032ARMZ-2REEL_MSOP8
<BOM Structure>
F75383M_MSOP8
SMBus Address: 1001110X (b)
7
6
GND 5
EC_SMB_CK2 <28>
EC_SMB_DA2 <28>
P20
RSVD0
P19
RSVD1
N20
RSVD2
N19
RSVD3
R26
RSVD4
R25
RSVD5
P22
RSVD6
R22
RSVD7
FOX_PZ63823-284S-41F
CONN@
RSVD8
RSVD9
RSVD10
RSVD11
RSVD12
RSVD13
RSVD14
RSVD15
RSVD16
RSVD17
RSVD18
RSVD19
RSVD20
H16
B18
B3
C1
H6
G6
D5
R24
W18
R23
AA8
H18
H19
R8
CPU_THERMTRIP#_R
+1.8V
1
300_0402_5%
2
+1.8V
Q3
3 1H_THERMTRIP#
E
1
2
B
2
R18
1K_0402_5%
C
MMBT3904_NL_SOT23-3
+3VALW
1
2
R17
+3VALW
10K_0402_5%
Q2
MMBT3904_NL_SOT23-3
3 1
MAINPWON <39,41>
@
E
1
2
B
2
R25
@1K_0402_5%
C
B
H_THERMTRIP# <18>
+1.8V
AMD: suggest DBREQ need pull high
A
CPU_DBREQ#
CPU_DBRDY
CPU_TCK
CPU_TMS
CPU_TDI
CPU_TRST#
CPU_TDO
@ 220_0402_5%
R33
@ 220_0402_5%
R38
1
2
@ 220_0402_5%
R34
R36
220_0402_5% R36
220_0402_5% 2 1
NOTE: HDT TERMINATION IS REQUIRED
FOR REV. Ax SILICON ONLY.
1
1
2
2
1
2
@ 220_0402_5%
R35
HDT Connector
WWW.AliSaler.Com
5
JP3
1 2
3 4
5 6
7 8
9 10
11 12
+3VS
13 14
15 16
17 18
19 20
21 22
HDT_RST#
B
2
23 24
4
Y
26
U51
A
1
NC7SZ08P5X_NL_SC70-5
@SAMTEC_ASP-68200-07
<BOM Structure>
4
5
P
G
3
LDT_RST#
CPU_PROCHOT#_1.8
1 2
H_PROCHOT_R# <17>
R52
0_0402_5%
SB_PWRGD <18,33>
Security Classification
Compal Secret Data
Issued Date
2007/5/18 Deciphered Date
2010/03/12
Title
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Size AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF Document Number Rev
R&D
Custom
401743 C
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Date: Wednesday, June 24, 2009
Sheet 8 of
46
3
2
1
+1.8V
1
R20
300_0402_5%
2
Compal Electronics, Inc.
SCHEMATIC, MB A5481
A