EPP Europe P2.2019

11 2019 www.epp-europe.eu 

INTERVIEW 

 

Kevin Youngs, 

Omron Europe 

Investing towards a 

sustainable future 

productronica 

Visit us at the 

3D AOI Arena 

Booth A2-506 

Exclusive 

fair guide 

COVER 

3D Automated 

Pin Inspection 

CONTENTS 

Trade Shows + Events 

Electronic innovations at 

productronica 2019 

PCB + Assembly 

Automotive-grade solder 

paste is the solution 

Long-term performance 

of LED systems 

Test + Quality Assurance 

Ultra-fast, inline way to 

inspect PCBs

EDITORIAL 

productronica 2019 

The electronics development and production tradeshow, productronica, will 

take place on November 12–15, 2019 at Messe München. International exhibitors 

and visitors will come together to see all the highlights this show 

has to offer. This includes, special events and forums, discussions, workshops, 

and more. Semicon Europa and InPrint Munich will also take place 

parallel to the show. Pick up your productronica Guide, to make your trip 

even easier. 

Visit us at the 3D AOI Arena, Booth A2-506. 

GLOBAL. 

AHEAD. 

SUSTAINABLE. 

Inspecting press-fit technology 

The Title story depicts the many different methods that are available for 

press-fit inspection. As miniaturization, complexity, and futuristic trends are 

becoming more prominent, some methods can be more effective than 

others. A 3D AOI pin inspection solution is key to ensure accurate, high 

quality production. In combination with Moiré technology and smart software, 

it will accurately locate and measure the pin body, right from the start. 

Growing importance for accurate inspection. 

All about automation 

A Slovakian electronics manufacturing company wanted to automate their 

production line on a bigger scale. They needed a solution that combined 

high quality production with high productivity and flexibility, all together 

with full customer support. After careful consideration, two soldering machines 

and a customized stencil printer with an integrated 3D SPI function 

was chosen. As production needs increased, a reflow soldering solution 

and a full tunnel wave soldering system were acquired. 

Demand for top quality. 

Automatizing reverse engineering 

Repairing printing circuit boards can be challenging as well as expensive, especially 

after long lifecycles where CAD data might not be available. Reverse 

engineering is a process that can be used to repair, copy, clone, test, and 

redesign a PCB module. This process contains five steps which can be automized 

with a flying probe system. Combined with specific software tools and 

mechanical abilities, a flying prober can create a comprehensive test program 

where a full data package can be generated. 

Flexibility of flying probers. 

YOUR 

PRODUCTION. 

DRIVEN BY 

KURTZ ERSA. 

At the Productronica show in Munich, Ersa 

will be presenting future-proof solutions for 

electronics production and its focus topics 

electromobility, autonomous vehicles, 

5G applications and Industry 4.0. 

Visit the Ersa experts on site and take the 

opportunity to exchange ideas on how you 

can make your electronics production even 

more efficient. Also through automation 

solutions from a single source. 

SEE YOU AT KURTZ ERSA IN HALL A4! 

Source: Carina Zarfelder 

Charlene Hesse 

Online Editor EPP E 

12 - 15 NOVEMBER 

www.driven-by-kurtzersa.com

Content 11 2019 

European Magazine for 

Production and Test in the 

Electronics Industry 

Cover 

3D automated pin inspection 

Source: Messe München/ Thomas Koy 

Source: MicroCare Corporation 

18 

Covering all the latest innovations, productronica 2019 will 

gather the entire industry, all in one place. 

66 

An electronics cleaning solutions manufacturer 

discusses three ways to clean PCBAs. 

During final assembly, press-fit technology has many advantages. 

Some prefer this method to soldering due to its reliability, however, 

it does come with defect manufacturing challenges. Due to ever 

increasing board and component complexity, most traditional inspection 

techniques are not fit to ensure accurate inspection. 

Combining the KY-P3 pin inspection solution with Moiré technology 

and the KSMART software will accurately locate and measure the 

pin body, right from the start. 

Pinning down defects to improve entire process 

News + Highlights 

6 Highly efficient automation lines 

Demand for IPTE’s production equipment 

10 Investing towards a sustainable future 

Interview with Omron‘s European Sales Manager 

16 Strong focus on soldering and sintering 

Pink establishes development department 

16 Joining the UN Global Compact 

Advantest commits to a sustainable future 

16 Advancing in future developments 

Viscom forms New Technologies team 

16 Business development manager 

Essemtec appoints department head 

16 Regional manager for US and Canada 

Kyzen grows Western markets 

Trade Shows + Events 

18 Comprehensive international tradeshow 

Accelerating innovation at productronica 2019 

20 Solutions for assemblies and systems 

SMTconnect 2019: Meeting manufacturing challenges 

25 Compare. Evaluate. Decide. 

Accurate inspection at the 3D AOI Arena 

Source: Saki Europe 

109 

Using bottom-side AOI for assembly processes 

increases productivity, while reducing substrate 

damage. 

PCB + Assembly Features 

60 Cleaning electronic PCBs 

Traceabillity and process assurance (Zestron) 

62 Selective soldering of challenging components 

Ensuring process control (Nordson Select) 

65 Product-Updates PCB + Assembly 

66 Decreasing PCBA malfunction 

Cleaning for PCB reliability (MicroCare) 

70 Pushing for high quality production 

All about automation (Ersa) 

73 Automobile industry driving for advanced packaging 

Electrification, ADAS, and connectivity (ASM) 

4 EPP EUROPE November 2019

Source: Koh Young 

54 

DEFECTS 

ELIMINATED 

RELIABILITY 

DELIVERED 


78 Long-term performance and reliability of LEDs 

Utilizing protection materials (Electrolube) 

82 Electrical reliability in harsh conditions 

Automotive-grade solder paste (Indium) 


86 Rotary soldering table with four stations 

Tinning coil connections (Zevatron) 

88 Process technology ready for future trends 

Systematic convection soldering (Rehm) 


94 Soldering method using laser technology 

Local non-contact heating (Koki) 

98 Balance of equipment and process control 

Conformal coating line (Nordson Asymtek) 


Test + Quality Assurance Features 

104 Resistance welder for quality assurance 

Safety in mobile energy production (Hilpert) 

106 Reverse engineering with flying probe 

Automated process for full data (Seica) 

109 Ultra-fast, inline way for PCB inspection 

2D-bottom side AOI system (Saki) 

112 Product-Updates Test + Quality Assurance 

Columns 

3 Editorial 

4 Contents 

114 Imprint/List of advertisers 

AVOID: 

VOIDING 

AVOID: 

DENDRITIC GROWTH 

AVOID: 

SOLDER BEADING 

AVOID: 

HEAD-IN-PILLOW 

AVOID: 

NON-WET OPENS 

AVOID: 

INSUFFICIENT 

SOLDER DEPOSITS 

Visit us at Productronica: 

Hall A4, Booth 214 

Learn more: 

www.indium.com/avoidthevoid/EPPE 

Contact our engineers: 

askus@indium.com 

©2019 Indium Corporation 

EPP EUROPE November 2019 5

NEWS + HIGHLIGHTS 

High level demand for production equipment 

From depanelizing to highly 

efficient automation lines 

Panel cutter, router, depaneler – whatever the machines that separate the individual board assemblies 

that are manufactured in differently sized panels are called- they are a central stage 

in electronics manufacturing environments. For over 20 years now, IPTE, headquartered in 

Belgium, has been successful in this industry with its families of routers, as well as, automation 

solutions for the electronics and machinery industries. 

Sales Director Rainer Krohmann and Dr. Jörg Handke, Business 

Unit Manager Systems, from the company’s German office in 

Heroldsberg, discuss the success and benefits of the systems. 

“Our market position has become clear by the matter of fact that 

customers often come to us with demand for an efficient depaneling 

machine. And then as further discussions and questions on application, 

handling, functionality and automation reveal, they are 

going to order a comprehensive automation solution, including the 

router, for their electronics production, because our highly flexible 

and efficient range of equipment has convinced them.” 

Solutions with flexibility 

It is important, as the managers make clear, that as a supplier of 

such system solutions, the company has always actively and cooperatively 

taken up the requirements of the market and then, on a 

case-by-case basis, implemented promptly the relevant options requested. 

In this case, they are also a competent partner for users 

resolving such projects. After all, these system solutions have to exhibit 

their performance in daily operation. “The feedback from our 

customers in the field, with whom we generally maintain long-term 

and trustful relationships, including the exchange of special knowhow, 

is very important for such further developments,“ emphasizes 

Rainer Krohmann. This also applies to upcoming manufacturing con- 

Modular machine concepts enable a wide range of applications 

IPTE offers a total of four different depaneling machine families in its 

portfolio. 

The systems EasyRouter and TopRouter for off-line operation originate 

from the headquarters in Genk, Belgium. On the other hand, FlexRouter II 

and SpeedRouter in-line machines are developed and manufactured in 

Heroldsberg, Germany. Continuous improvements have made these systems 

very efficient. For more than 20 years, the in-line capable and flexible 

SpeedRouter for the depaneling processes sawing and milling or a 

combination of these has been continuously further improved. Designed 

for high-speed requirements, it is characterized by high reliability, robustness 

and speed. The modular concept allows for a variety of different 

tools, grippers and in-feed and out-feed transport mechanisms for in-line 

and off-line applications. Integration in manufacturing lines is supported 

by a wide range of different cells and modules. The system is also ideally 

suited for requirements demanding very narrow tolerance limits and short 

cycle times. 

The FlexRouter II has been developed for medium to high production 

throughput with a high product mix. It now also works with framelessrouting 

technology. Despite the small space requirement of only onemeter 

width, panels up to 330 mm x 500 mm can be processed. Four of the 

seven axes are designed as linear drives. The panel is loaded, clamped 

and measured in position by means of a width-adjustable belt conveyor. A 

freely programmable servo gripper on a Cartesian 3-axis system with rotary 

axis holds the panel during the cutting process, thus basically eliminating 

PCB-specific tooling costs. The milling spindle under the PCB is also 

positioned with a Cartesian 3-axis system and can be equipped with different 

spindle types to realize even complex applications without difficulties. 

The automated change of gripper fingers allows simple and fast 

product changes. Various options are available for positioning and moving 

the panels: such as belt conveyor (also double beam), tray magazines up 

to a size of 600 x 400 mm, work-piece holder, linear shuttle and turntable. 

As an option, it is possible to check the singularized board assemblies by 

means of optical inspection. Separation programs can be created with 

camera support or with the integrated DXF converter for the transfer of 

CAD data. The machine is intuitive and easy to operate. Features, such as 

the use of several milling cutter sections for cost reduction, automatic 

milling bit change and detection of bit breakage, are standard. 

The EasyRouter II is a low-cost off-line depaneler for operations from the 

top of the panel at a speed of up to 60 mm/sec. Among other features, 

the accuracy, user guidance and noise level have been optimized. The 

complete process sequence of the milling tool can be displayed in 3D 

real-time positions or simulated using industry-specific parameters to determine 

the cycle time from the original product data. Loading and unloading 

take place alternately during the cutting process via a turntable 

with an integrated work-piece carrier. Handling is carried out manually, 

and robot support (Cobot) can also be implemented. X and Y axes of the 

milling machine feature fast and precise spindle drives. Automatic 

change of the milling tool with bit recognition and diameter inspection 

are also provided for. The bit position can be learned to use a camera; 

ESD monitoring of the milling tool is possible. Programming can be provided 

via DXF files or codes. 


Dr. Jörg Handke and Rainer Krohmann (from left) during a tour at the manufacturing 

floor of the IPTE in-line depaneler machines: “The demand for our solutions 

is particularly high.” 

Source: IPTE 

Dr. Handke: “Frameless routing allows a further increase in efficiency and 

cost reduction, as panel waste is significantly reduced.“ 

Source: IPTE 

cepts, such as Industry 4.0/Smart Factory and their implementation. 

In addition, there are user requests for easy program generation 

and CAD import of product data, high flexibility and functions, such 

as the optimization of the edge-cut procedure, detailed system 

monitoring and ergonomics, as well as application-specific customization 

and user aids. As Dr. Handke states, “operation, programming 

and maintenance must be practically intuitive and self-explaining. 

Straightforward and machine-aided troubleshooting, as well as 

preventive maintenance and statistical process control (SPC), are inherited 

elements of our machine concept. Of course, also a reduction 

of downtime is very important, because shutdowns in lines are 

always very costly. The system also includes so-called software wizards 

for providing user assistance. It is not exaggerated to say that 

our software has now become a unique selling point in the equipment 

design.“ 

Transparent cost and quality situation 

“To set up a cutting process, the operator has to only follow the 

carving process on the panel with the aid of the machine. The result, 

including possible optimization, is thus immediately available. The 

transfer of CAD data to a cutting program is likewise convenient. 

Because the trend towards smaller boards is increasing, panels 

with 256 single assemblies are already a reality in production, high 

precision and cutting speed are essential. Also, we have further optimized 

the management of dust generation and extraction as well 

as the reduction of operating noise. And, of course, the exact monitoring 

of tool wear or tool breakage as well as statistical evaluation 

and traceability are included in the performance machine package. 

And for production monitoring, users can extract the data from the 

running process and prepare it immediately,“ Dr. Handke further explains. 

Therefore, not only the costs for the separation of a single 

board assembly are transparent for the user, but also the quality of 

process and product. 

No wonder that besides the outstanding hardware design, the company 

also gives high priority to software development. Rainer Krohmann 

underlines the current development in this topic of interest in 

the industry and its impact on the company: “For some time now, 

we have been hiring an above-average number of employees in the 

software area, in order to meet the increasing demands in the application, 

optional enhancement, functionality and user-friendliness. 

The software‘s proportion of added value in our machines is thus 

constantly increasing.“ 

Frameless routing increases efficiency and profitability 

As well as on the hardware side, highly innovative solutions continue 

to be developed. As Dr. Handke, responsible for the design of 

the SpeedRouter and FlexRouter II product families, points out: 

“With the new frameless routing (option), we are now increasing 

the efficiency of the FlexRouter II. Because with frameless routing, 

i.e. without the use of frames, there are only very few circuit board 

leftovers.“ This is also interesting from both, an ecological and a 

cost-related point-of-view, because it reduces the amount of nonrecyclable 

material and therefore reduces the amount of waste that 

has to be disposed of. This solution also features a transport mechanism 

without any edges, which enables fast, stress-free and pre- 



cise separation by milling. Further enhancements in the cutting process 

are the outstanding board cut quality, in which no torque 

(force) is applied to the part singularized, whereby the grippers work 

without any distortion and with absolute positioning accuracy. 

“With the extensive range of different 

equipment options in our four 

depanelizer families, we can meet 

virtually any customer requirement”, 

notes Dr. Handke. 

A system was developed according to customer specifications in 

which the panels are processed via 12 motorized axes, and additional 

processes are also integrated into the depaneler machine. In 

addition to the relevant cutting options, such as sawing, milling or 

laser operations as well as various application-specific gripper 

mechanisms, the integration of in-line cells for handling, transport, 

stacking and barcode reading or writing, is also part of feasible system 

configurations. Furthermore, optionally available are optical process 

monitoring as well as the measurement and control of the singularized 

boards by automatic vision system (AOI). The outstanding 

performance of the equipment used is, of course, decisive for 

meeting the requirements of the customers with high precision, 

speed, availability and economy. “It goes almost without saying, the 

implementation of all relevant industry standards and interfaces for 

automation in electronics manufacturing is an essential task for us,“ 

adds Sales Director Krohmann. 

Close-up of a depanelizer with built-in verification of components and some 

more options: those are complex and extremely reliable systems, too. 

Source: IPTE 

High-speed and precision 

For IPTE as a supplier, this means that the range of solutions extends 

from various in-line systems for the large volume to small 

series production, each of which can be specifically configured according 

to application requirements. The high efficiency can also be 

seen, for example, with maximum cutting speeds of up to 60 mm/s, 

resulting in short processing times of approx. 1 to 1½ seconds per 

board. Line cycle times in the region of 7 seconds can, therefore, be 

realized without complications, depending on the user‘s requirements. 

In addition, there are very small positioning tolerances of the 

axes (repeatability) in the order of ± 1–2 μm and, as Dr. Handke explains, 

„with this specification we have clearly a leading position in 

the depaneler industry. A further decisive factor of economic efficiency 

is also the fast retooling and high user-friendliness of the machines, 

as well as the very small footprint required on production 

floors. In general, space is very limited here and therefore also a 

cost factor that should not be underestimated.“ 

The technology of the company’s equipment can also be seen in 

other relevant characteristics. The automation specialist also implements 

additional work cells into the integrated line, such as oddform 

assembly, electrical and/or electromechanical testing back-end 

tasks, etc., right through to the packaging of the finished product. 

Users can thus put together turnkey production configurations that 

are individually tailored to their specific requirements. Irrespective 

of whether the product mix consists of small and medium-sized 

production batches or very large volumes of practically identical 

boards, the configurations can be matched precisely to the production 

volumes and individual automation concepts. Dr. Handke comments: 

“Of course, a system solution must be exactly tailored to 

the task and the customer‘s requirements. Parameters, such as cutting 

speed and cycle time, are just as important as the quality of the 

cut-out edges of the material, the efficiency of the dust extraction or 

the required space on the production floor.“ 

And as Rainer Krohmann adds: “As a general contractor for a complete 

production line, our customers can take it for granted that 

IPTE is fully in charge of adhering to the performance parameters of 

such system solutions and of the smooth integration and operation 

of the individual modules and processing stations. The advantage 

for the customer is quite obvious: there is always only one contact 

for whatever issue may turn up, namely, just us“. As both, Business 

Unit Manager Systems Dr. Handke, and Sales Director Krohmann, 

conclude commonly: “It is essential, in addition to flawless, efficient 

and safer processes and procedures, that we offer our customers 

optimal and trouble-free operation of their plants and systems with 

an explicitly increased added value.“ The current position on the market, 

which the managers describe in unison positively, shows that 

the company‘s machine concept turned out a grand success: “The 

demand for our depaneling systems continues to be high. Since 

2016, we have been able to increase sales significantly by more 

than 100 %, and even this year and next year, we can also expect excellent 

figures of plus 50 %.“ (Gerhard B. Wolski) 

productronica, Booth A1-534 

www.ipte.com 


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INTERVIEW 

Investing towards a sustainable future 

Industry 4.0 and automation have been on-going trends that have 

become more attainable and accessible. The future of the electronics 

manufacturing industry lies on companies that are willing to 

invest in the progress of technology. In an interview with Kevin 

Youngs, the European Sales Manager of Omron Europe’s Automated 

Inspection Systems Division, he discusses trends and 

goals the company is striving towards, to reach their vision of 

the future for all industries, including industrial automation, 

electronic component, and more. Following their mission of being 

a pioneer in creating inspired solutions for the future, the company 

is not only focused on futuristic trends, such as flexible manufacturing, 

AI, and digital factory, but also to continue to cover all aspects 

of the production line, including smart vision inspection. 

INFO 

Integrated automation 

All Omron sensing and control products are designed with integration 

in mind. As each physical component is controlled by the Sysmac 

automation platform and is designed to be interoperable with any 

other Omron component, integration into any production environment 

is made simple. This platform provides a single software development 

environment to ease application development. Standard form factors 

and protocols also facilitate the upgrade and maintenance of the line. 

Intelligent automation 

The IIoT relies on the collection and organisation of large amounts of 

data from the factory floor to ensure that the line is always operating 

at maximum efficiency. The company’s intelligent machines incorporate 

sophisticated machine learning techniques, to make the correct 

decisions close to where they are needed on the line. The company’s 

controllers also feature an integrated SQL database to simplify communication 

between the factory floor and the IT layer to allow data 

and control commands to flow freely in both directions. 

Interactive automation 

The IIoT production environment needs both the cognitive skills and 

flexibility of humans and strength, accuracy and data capability of robots 

to work together to achieve manufacturing excellence. Creating a 

safe working environment is essential to allow both humans and robots 

to work together. A new generation of collaborative robots have 

been introduced that allow humans and robots to work in close proximity 

to each other. 

In an interview with Kevin Youngs, he discusses the company’s actions and 

investments towards the future of technology as well as their environmental 

targets. 

How much does Omron invest in research and 

development and how many people are employed in 

this area? 

Research and development expense is an important long-term investment 

for the Omron Group. We have set a standard for R&D expense 

at 7 % of sales, and we intend to raise this level to 7.5 % by 

fiscal 2020. Our target for investments in core technologies, including 

AI and robotics, is about 1 % of sales. Dedicating capital to the 

progress of technology represents up-front investments that will 

bear fruit for corporate growth 10 and 20 years down the line. This is 

the type of investment we must undertake as a manufacturing company, 

if we are to develop innovations that improve lives and contribute 

to a better society. Accordingly, we will continue to make 

bold investment decisions that challenge the frontiers of science, 

balancing discipline and risk to deliver to the world innovation. 

What is the significance of the innovative 

automation concept? 

Manufacturers face many challenges when moving towards an agile 

and flexible production environment. It is only when they are confident 

of meeting both the demands set by consumers and the markets 

that they can begin the journey to truly flexible manufacturing 

and the ultimate goal of the digital factory. Omron’s complete range 

of hardware and software products have been designed from the 

ground up to assist that process by providing the highest levels of 

integration, highly advanced intelligence capabilities and safe and 

easy interaction with the complex technology. 

Source: Omron Europe 


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www.cyberoptics.com 

Copyright © 2019. CyberOptics Corporation, Inc. All rights reserved. 

Visit us at 

Productronica Germany 

Hall A2 - Booth 439 

See the SQ3000 at the 

3D-AOI Arena 

Hall A2 - Booth 506 



INTERVIEW 

Source: Omron Europe 

To assist manufacturers, the company has launched its innovativeautomation 

(i-Automation) programme, which is intended to provide 

manufacturers with a consistent, reliable way of ensuring they can 

meet both consumer demands and the changing needs of industry. 

i-Automation is based on three ‘i’s – integrated, intelligent and interactive. 

Together these three pillars can be combined to provide 

manufacturers with the highest levels of quality, sustainability and 

operational excellence that will help meet any future demands. 

The innovative-automation philosophy is the shortest and quickest 

route for manufacturers to surpass customer expectations and 

achieve manufacturing excellence. 

Constantly growing demands on component production 

require preventive, integrated strategies 

for zero-defect production. What do they look like 

at Omron? 

For many years now, the company has used a process template for 

back-casting to create innovation driven by social needs. We contribute 

to a better society by developing technologies and products 

necessary to achieve near-future design, incubating businesses that 

become an indispensable part of society. 

100 % reliability and achieving zero defect processes are essential 

for example in electric vehicle and advanced driver assistance systems 

(ADAS). Therefore, electronic assemblies of automotive PCB 

processes must meet the highest quality manufacturing standards. 

To meet these customer needs in PCB optical and X-ray inspection 

in the SMT process, the company’s solutions guarantee the quality 

of PCB components and the strength of solder joints. Automatic full 

inspection offers extremely high inspection accuracy and eliminates 

defective products and any inspection variations caused by manual 

work. We provide manufactures with user-friendly in-line inspection 

machines that can be easily implemented in the manufacturing line, 

offering reliable and robust performance. 

For zero-defect, the Q-up system collects and monitors data, 

all while making improvements based on information from 

the inspection system. 

Zero defect production means avoiding the causes 

of deviation even before the service has been completed. 

How and what is Omron doing to approach 

zero-defect production? 

The new Artificial Intelligence solution, which is now available, collects, 

analyzes and utilizes data on ‘edge’ devices within a controller 

to prolong equipment longevity and detects unforeseen abnormalities 

to prevent failures. It is the first AI machine automation controller 

with a Sysmac library, and fuses control functions of manufacturing 

lines and equipment with AI processing at manufacturing 

sites in real time. 

The process of collecting raw data from machines is completely 

automated by the new AI controller, which operates on the “edge” 

within the machine, ensuring higher data fidelity and consistency. In 

addition, the controller automatically creates data models from correlation 

analysis and monitors machine status based on that model. 

The hardware is based on the Sysmac NY5 IPC and the NX7 CPU 

and includes the AI Application Components. This is a library of preprogrammed 

predictive maintenance function blocks, based on the 

know-how that the company has gathered from typical applications. 

How do you deal with and handle the immense 

amounts of data? 

Taking the example of the AI Controller, as it does not require a 

huge amount of data on unusual incidents, it is easier and faster to 

implement than other solutions. While cloud-based AI solutions 

place enormous demands on infrastructure and IT, and the processing 

of data volumes is a tedious and time-consuming undertaking, 

machine-level AI is ideal for predictive maintenance and machine 

control. It combines line control functions with real-time AI-based 

data processing. The advantage is that they can reliably identify and 

quickly respond to unforeseen situations in real time, improve 

quality, maintenance and machine lifecycles, and scale as needed. 

Sensors that collect the required information directly at the machine 


enable deeper and more up-to-date data analysis. In addition, the 

consolidation and compression of really necessary information is 

possible, further optimizing oversight and transparency. 

It is not always easy to reach high-quality zero-defect 

production with low quantity with frequent 

product changes or a high mix of complex products. 

How does the company help with this? 

Omron systems cover all parts of the production line, including 

quality inspection. Whether providing a complete system solution or 

a partial upgrade to an existing system, each component is geared 

towards ensuring the highest quality control. For inspection and 

quality control, the visual inspection units monitor production in real 

time and respond instantly to any defect. 

Data sent from the vision system is processed locally and sent via 

the cloud for powerful analysis that allow the system to take appropriate 

actions. The system is totally interlinked, with the improved 

connection between machines in a manufacturing line, delivering 

more accurate quality control and higher efficiency. If any error is 

detected, the system compensate automatically, allowing production 

to continue unaffected. The smart automation solutions are fast 

and possess lots of processing power, yet they are easy to use. This 

combination of speed, intelligence and user-friendliness delivers the 

most effective inspection and transparent quality control. 

Line set-ups can be changed quickly for new production runs, and 

the recognition pattern for quality inspection can be updated easily 

in the software. This ensures that different variants or even different 

products are produced and packaged correctly. The system is also 

future-proofed as it can be easily adapted to accommodate any 

changes to regulations. Therefore, manufacturers do not need to 

worry about what they might need to do to their production lines to 

meet future regulations. All that is required is to rollout a new firmware 

update for the existing solution. 

How strongly does the human factor manipulate a 

test result? 

Being able to catch a defective product before they are shipped to 

customers can bring significant savings in both time and money, 

preventing expensive product recalls, wasted production and potentially 

expensive legal costs. 

As an example, for perishable products, from food to pharmaceuticals, 

quality inspection of the packaging is also critical. An unreadable 

barcode or an incorrect expiry date could result in perfectly 

good products being discarded. And increasingly strict legislation is 

making clear marking a top priority for all types of product. 

As production lines become ever more automated, inspection and 

quality control also need to be more automated. Automated systems 

can improve a line’s effectiveness, by performing tasks quickly 

and accurately. The real benefits only truly materialize when ‘smart’ 

automation is implemented, utilizing such features as smart data. 

When this is applied to vision inspection systems, defects can be 

spotted and dealt with swiftly with minimal impact to the line. A 

smart vision inspection system can make any production line efficient 

and less wasteful, both in terms of produce and down time. 

TEST PROBES 

ARE HIGH- 

PRECISION 

PRODUCTS 

» For top quality 

standards 

» For a wide range 

of applications 

» Custom-made designs 

We combine precision, 

innovation and reliability 

for your benefit. 

VISIT US AT THE 

PRODUCTRONICA 

TRADE FAIR IN MUNICH 

FROM NOVEMBER 

12 – 15, 2019! 

Hall A1, booth 558 

PTR HARTMANN GmbH 

Gewerbehof 38 

59368 Werne (Germany) 

www.ptr-hartmann.com 



INTERVIEW 

Is there preventive quality assurance? 

Many pre and post SMT processes still utilize sample inspection by 

operators, the challenge is to achieve full inspection automatically in 

the production line to reach “zero defect”. 

For example, and along with the progress in the development of 

automotive technology, such as ADAS (Advanced Driver-Assistance 

System), self-driving, and EVs (Electric Vehicles), the installation 

rates of important electrical safety components have been increasing, 

such as millimeter-wave radar to detect vehicles and pedestrians 

with wireless connection, the electronic mirror that is 

mounted as replacement of the current sideview mirror and inside 

rearview mirror, and LED headlamps. These high-density and miniaturized 

automobile electric components require time to conduct visual 

inspection. Therefore, their current inspection process is the 

sampling inspection in each unit. 

As an example, Omron VT-M121 enables the detection of defects, 

which is similar to or more precise than the human eye, by using the 

sophisticated image-processing system, „FH series“ with the illumination 

pattern of the MDMC Light that can flexibly change the 

illumination color and the angle. Thanks to „NJ damping control“ 

that integrates the sequence control and motion control, it can also 

minimize the camera vibration, therefore, realize high-speed and 

high-accuracy inspection. By simultaneous dimension and visual inspection, 

the machine has reduced the inspection time and improved 

the dimension and inspection performance with high repeat 

accuracy. Our new system contributes to the safety and reliability of 

automobile manufacturing by achieving customers‘ „zero defect“ 

through full-scale guarantee and accumulation and management of 

inspection data in place of on-the-spot inspections within and 

beyond the SMT process. 

Can a complete automation of the test processes 

ensure the repeatability of the process chain? 

The company supports “manufacturing without defect”. Along with 

changes of trends within our world, „manufacturing“ has also 

undergone a major change with significantly increased quality level 

requirement. To support the principle of 4Ms „Man (worker)“, „Machine 

(facility)“, „Material (raw materials)“, and „Method (work 

method)“ and to continue manufacturing high-quality products, the 

company proposes a Q-up system that performs linking of data 

from facilities, collection and monitoring of the data, as well as making 

improvements, based on the quality information of inspection 

system. This allows real-time capturing of „changes that affect 

quality“ of 4Ms in production fluctuations and assisting efficient improvement 

activities. 

What does Omron do to protect the environment? 

Our energy management domain advances the adoption of renewable 

energy to reduce CO2 emissions and build a society in which 

people live in comfort. We work with our partners to promote the 

use of power conditioners and storage battery systems for the 

benefit of a clean environment. The Environmental Solutions Business 

and Field Engineering Co., Ltd. are the two entities through 

which we conduct most of our environmental business. 

We believe that building an environment for a sustainable society is 

part of improving lives and contributing to a better society, as stated 

in the company’s principles. In support of this ideal, we pursue initiatives 

under our Green Omron 2020 environmental vision. 

In July 2018, we set new environmental targets under Omron Carbon 

Zero, aligned with the recent Paris Agreement and the SDGs. Our target 

is to reduce Scope 1 and Scope 2 greenhouse gas emissions to 

zero by fiscal 2050. Our interim goal is to reduce emissions 32 % by 

fiscal 2030. Back casting from these targets, we have set a fiscal 

2020 goal to reduce emissions by 4 %. We are even starting to consider 

reducing Scope 3 gas emissions in the near future. 

We have built a global framework to achieve our environmental targets, 

and we are adopting energy conservation and renewable energy 

practices across our organization. 

What does a 100 % measurement mean to Omron? 

Since the company joined the PCB inspection system business in 

1987, it has maintained the highest level of integrity within industry 

due to reliable inspection performance and strong robustness of 

product. In PCB optical and X-ray inspection fields in the SMT process, 

we have guaranteed the highest quality of inspection capability 

for components and strength of the solder joint. In today’s 3D inspection 

world, we develop 3D-AOI and 3D-AXI systems for 100 % 

measurement, meaning all components and their solder joints on 

PCB assemblies are measured in 3D according to IPC guidelines. 

What is your USP? 

As a leader in industrial automation. In addition to 3D-inspection 

systems, Omron has extensive lines of control components and 

equipment, ranging from vision sensors and other input devices to 

various controllers and output devices, such as servomotors, as 

well as a range of safety devices and industrial robots. By combining 

these devices via software, the company has developed a variety 

of unique and highly effective automation solutions for manufacturers 

worldwide, able to provide a complete automation solution 

from a single source. 

What are your recommendations when integrating 

automated tools and processes into production 

line to reach Industry 4.0? 

Adopting Industry 4.0 into a manufacturing line can bring many 

benefits, from better data management to improved efficiency. But 

while the benefits may be clear, replacing a complete production 

line may not be an option for companies operating on already tight 

margins. While moving to a modern, flexible and smart line brings 

the most benefits, even small changes to existing facilities can deliver 

significant boosts to efficiency. 

Smart production lines can improve traceability, uptime, and quality, 

while reducing running costs and total cost of ownership. Most of 

the benefits come from having an integrated component and control 

platform, which allows seamless exchange of data between devices 

and the control system. Having access to this component 

level data is one of the key-enabling factors to realise the benefits of 

an Industry 4.0 system. 

productronica, Booth A2-331 + 505 

www.aoi.omron.eu 


Solutions for Electronic Assemblies and Systems 

Manufacturing together 

Meet the entire electronics manufacturing community at the 

SMTconnect and make contacts with international decisionmakers 

from industries such as industrial electronics, medical 

technology and automotive. 

Present your products and services and prepare business deals, 

for example at the special showcase areas EMS Park or PCB 

meets Components. 

Nuremberg, 5 – 7 May 2020 

SMTconnect in motion: smtconnect.com / film 

# smtconnect 



Source: Pink GmbH Thermosysteme 

Establishment of development 

department 

In regard to the future strategic direction and 

reorganization of internal departments, Pink 

GmbH Thermosysteme founded their own 

Development department for soldering and 

sintering technology in June 2019. Head of 

department is Mr. Christoph Oetzel, who has 

been working for the company since 2003. 

Mr. Oetzel successfully leaded the Engineering 

Department before and was primarily involved 

in many product developments. 

Together with his team, which consists of 

well experienced engineers, but also in close 

cooperation with the company’s Application 

department, Mr. Oetzel is intensively concentrating 

on the latest sintering projects. The 

goal is to interlink both departments, Development 

and Application, with their concentrated 

expertise to further push the area of 

sintering in particular, but also soldering. 

www.pink.de 

Mr. Christoph Oetzel 

is the head of the 

recently established 

Development department 

for soldering and 

sintering technology. 

First positive interim 

stockof technologies team 

To advance more in future developments 

in areas, including 3D technology and AI 

creatively and effectively, Viscom AG 

founded the New Technologies team 

It has established itself as a generator of 

new ideas and concepts. All members 

are well-versed in software development, 

enabling them to use rapid-prototyping 

methods to develop fast solutions 

and to assess their functionality. Despite 

this, the members have diverse educational 

backgrounds. This ensures that 

ideas come from various directions. 

A development that is already in the 

testing stage is AI-supported verification. 

The goal of this is to support the 

human judgment of machine operators 

on whether possible defective components 

and solder joints in the automatic 

inspection process fulfill all criteria. 

www.viscom.com 

Advantest joins UN Global Compact 

Semiconductor test equipment supplier Advantest 

Corporation has joined the Global 

Compact (UNGC), a global initiative of the 

United Nations, and the Global Compact Network 

Japan, a local network based in Japan. 

The UNGC is a special initiative of the UN 

Secretary-General which encourages companies 

to exert responsible social leadership 

and to participate in creating a global framework 

for sustainable growth. Companies that 

join make a commitment to universal principles 

in the areas of human rights, labour, 

and anti-corruption. 

The company is committed to contributing to 

a sustainable future and helping to solve 

problems within global society by delivering 

greater safety, security, and comfort through 

semiconductor test. The company’s participation 

aligns with its initiatives to promote 

ESG management at a higher level across by 

engaging with the Sustainable Development 

Business development manager 

joins Essemtec 

Essemtec AG, an assembly 

equipment 

manufacturer, has included 

Don Jeka to 

its US sales team. 

Jeka has assumed 

the role of Business 

Don Jeka has assumed Development Manager, 

where he will 

the role of Business Development 

Manager for 

work with the sales 

Essemtec AG. 

representatives in 

the US and Canada. He has been specifically 

tasked with growing the market for their 

products, including its Fox pick-and-place and 

Spider dispensing platforms. 

He is a sales and marketing veteran with 

more than 30 years of experience, including 

15 years selling capital equipment, plus developing 

and managing distribution and 

sales. He is proficient in all aspects of business, 

in part, on his experience owning and 

running a multi-million-dollar company. 

Jeka added, “I am extremely excited to join 

the Essemtec team and look forward to promoting 

their unique, high quality systems. 

Their commitment to customer service and 

satisfaction, combined with their ability to 

offer pick-and-place and dispensing in one 

system, clearly sets them apart from other 

manufacturers.” 

Source: Essemtec AG 

Source: Advantest Corporation 

Goals (SDGs) of the United Nations, which 

provide a framework for contributing to the 

resolution of social issues. 

There are ten principles of the UN Global 

Compact that businesses should follow and 

support. These cover a variety of challenges, 

including human rights abuse, forced and 

compulsory labour, extortion and bribery. 

www.advantest.com 

Advantest has 

joined the UNGC, a 

global initiative of 

the United 

Nations, and the 

Global Compact 

Network Japan. 

Recently appointed Western 

Regional Manager 

Kyzen, a producer of 

innovative environmentally 

friendly 

cleaning chemistries, 

welcomed 

Scott F. Cain to the 

team as the Western 

Scott F. Cain has recently 

been hired to be Cain will be respon- 

Regional Manager. 

Kyzen’s Western Regional 

Manager 

sible for the western 

United States and 

Canada, where he will help new and current 

customers optimize their cleaning processes 

with the company’s chemistries. 

Cain is a graduate of Furman University with 

a degree in Business Administration. As a 

veteran in the electronics assembly industry, 

he brings more than a decade of experience 

working with customers across the country 

for both InsulFab PCB tooling and Aqueous 

Technologies. He has served on numerous 

boards within the SMTA at regional and 

national levels. He is looking forward to sharing 

his knowledge and experience. 

“Scott is an excellent addition to our team,” 

said Fernando Rueda, Americas Manager. 

“His experience in multiple business areas of 

the electronics industry will be key to Kyzen’s 

growth in the Western markets of the United 

States and Canada.” 

Source: Kyzen 

www.essemtec.com 

www.kyzen.com 


MEETINGS & COURSES: February 1-6 

CONFERENCE & EXHIBITION: February 4-6 

SAN DIEGO CONVENTION CENTER | CA 

ELEVATE THE 

EXCELLENCE OF 

ELECTRONICS 

Join Us to Celebrate 20 Years 

of IPC APEX EXPO! 

The pursuit of excellence in electronics is year-round. But during IPC APEX 

EXPO 2020, the focus of the electronics industry will be on how collectively, 

we can elevate all aspects of our industry and the products we create. 

Together, we'll celebrate the 20th Anniversary of IPC APEX EXPO, explore 

innovative ideas and share our experiences, all with an eye toward a future 

driven by success. 

Plan now to elevate your excellence in San Diego at IPC APEX EXPO 2020. 

Register by December 19 to get your 

20% advanced registration discount! 

ipcapexexpo2020.ipc.org | #ipcapexexpo 


TRADE SHOWS + EVENTS 

Accelerating innovation 

Comprehensive international 

tradeshow: productronica 2019 

Every two years, productronica gives the entire electronics industry the opportunity to gather in 

one place, in order to see today’s advanced intelligent solutions and innovations. International visitors 

and exhibitors alike come to this tradeshow to share ideas, discuss trends, and create everlasting 

business relationships. As the market is constantly growing and changing, it has become a 

challenge to stay on top of all current trends and create the necessary solutions. Covering all the 

latest innovations, this event gives unique learning opportunities to stay well-informed. 

Occurring every two years, productronica 2019 will take place this year on 

November 12–15 in Munich, Germany. 

This year, the international tradeshow will take place on November 

12–15 in Munich, Germany. Messe München has organized 

a 4-day comprehensive tradeshow, to benefit all areas of electronics 

manufacturing and production. Discussions, forums, live demonstrations, 

product releases, and more, will take place covering the 

entire value chain. Networking opportunities will be available for all, 

including decision makers, experts, as well as students and new 

comers. 

Source: Messe München/ Thomas Koy 

3D AOI experts 

As miniaturization becomes more eminent, boards 

and components are becoming more complex. This 

means quality control and inspection is an important 

theme, as it is critical in this industry. The 3D 

AOI Arena is the perfect opportunity to measure 

multiple inspection solutions at once. Taking place 

in Booth A2–506, 10 top inspection manufacturers 

will display their unique automated optical inspection 

solutions, side by side, where visitors will be 

able to compare, evaluate, and decide based on 

their needs. Multiple guided tours will occur 

throughout each day, in both English and German. 

To gain even more knowledge and know-how, a 

roundtable will take place on Thursday, November 

14 at 1 p.m. at the Speakers Corner in Hall A1. 

Here, renowned inspection experts will discuss 

challenges and issues that 2D and 3D AOI systems 

manufacturers may face for PCB production. 

Start-up platform 

productronica Fast Forward, the global start-up platform, is beneficial 

for both participants and visitors of the tradeshow. In collaboration 

with Elektor, young companies will get the opportunity to 

Popular international tradeshow 

This tradeshow is incomparable to any other German event, solely 

based on its size. In 2017, 1,560 exhibitors occupied 7 Halls, while 

displaying solutions to almost 45,000 visitors. For easier navigation, 

the cluster structure aids with the organizational aspect of the 

show, as it gives a comprehensive overview of the industry. Each 

Hall is grouped into specific categories of the electronics production. 

These clusters include, SMT (A1–4), Cables Coils and Hybrid 

(A5), Semiconductor (B2), Future Markets (B2), PCB and EMS (B3). 

For easier navigation, the cluster structure gives a comprehensive overview of 

the industry, as each hall is divided into different aspects of the industry. 

Source: Messe München 


Source: EPP Europe/ Doris Jetter 

Source: EPP Europe/Charlene Hesse 

International exhibitors and visitors will gather in one place to discover 

current market trends and innovations. 

present their innovations to more experienced companies. Forums 

and discussions, pitches, lectures, and workshops will take place, to 

further expand opportunities for new companies. At the same time, 

visitors will get the chance to discover leading innovations, as well 

as, network with a variety of companies. 

Employment opportunities 

Finding qualified specialist employees in specific fields has become 

a challenge in this industry. The Career Center is dedicated to helping 

the job market evolve by bridging a connection between potential 

job seekers and employers. This platform not only gives an overview 

of job positions that are currently available, it is also a knowledge 

hub for those who are newly entering the job market and industry. 

Students are encouraged to stop by and ask questions, as 

well as, take a look at starting level positions or available training 

programs. 

Soldering competition 

The Hand Soldering Competition will occur again this year. This 

event gives the opportunity for companies to demonstrate the highlevel 

skills of their employees. Throughout the week, participants 

will first compete on a European level for cash prizes. The winner of 

this event will then compete at the World championship on the last 

day of the tradeshow. 

Gaining knowledge 

The focus of this tradeshow is not only to exhibit new products and 

technologies. There will also be a variety of learning opportunities, 

including special events, presentations, and forums. This also includes 

the Cleanroom, which highlights clean environments, showing 

tools and solutions to remove possible contamination. The 

Smart Maintenance Pavilion will focus on solutions for the electronics 

production. Covering all current topics, such as predictive 

maintenance, TPM, data analytics, remote services, mobile and 

computerized maintenance, thermography, and more. 

Accompanying shows 

Alongside productronica, two other tradeshows will also take place, 

detailing all aspects of the value chain. In Halls B1 and B2, SEMI- 

CON Europa will focus on the microelectronics industry, which includes 

semiconductors, LEDs, MEMs, printed, organic, and flexible 

markets. In Hall A6, printing technology industrial manufacturers 

and suppliers will gather at InPrint Munich. This event focuses on 

printing systems, printing inks and components, finishing equipment, 

and more. 

www.productronica.com 

Powerful and Compact 

The LPKF MicroLine 2000 Ci sets new standards in laser cutting of 

rigid, flexible and flex-rigid circuit boards. Discover the new benefits 

of using lasers. Find out more: www.lpkf.com/laser-depaneling 

productronica: 12 –15 November, Hall B2, Booth 303 



Source: EPP Europe/ Charlene Hesse 

SMTconnect connected both participants and exhibitors, following much like its name. 

Meeting manufacturing challenges together 

SMTconnect 2019: Solutions for 

electronic assemblies and systems 

The microelectronics tradeshow, that takes place on a yearly basis in Nuremberg, Germany, has gone 

through many changes this time around. With its new name, SMTconnect has become a meeting place for 

the industry. The focus was extended to the electronic manufacturing services industry, which brought a 

variety of companies from around the world. Exhibitors and visitors alike took advantage of this year’s highlights 

and events to discuss the happenings of the industry. With the help of forums, roundtables, competitions, 

and a range of special events, a strong opportunity for networking was available to all attendees. 

Much like its name, a connection was created for all involved in 

the industry. Not only was this year about displaying solutions, 

there was also a focus on creating a communication channel 

between all companies along the supply chain, in order to work 

better together. 

Interview with Klaus Gross, General Manager, Fuji Europe Corporation, 

discussing the importance of networking within the industry. 


“The sense of networking is within 

the new name, which means 

working with everyone, including 

machine suppliers and even our 

competitors. With this new 

wording, we should stay together, 

work alongside one another, 

and learn from each other.” – 

Klaus Gross, General Manager, 

Fuji Europe Corporation 




Interview with Matthias Müller, Public Relations, Goepel Electronics discussing 

the new markets the industry is facing. 

International tradeshow 

Over 400 exhibitors from 26 countries displayed technologies and 

solutions to 13,000 visitors that came from around the world, including 

the DACH region, China, Italy, France, Czech Republic, Hungary, 

Great Britain, and more. Not only were they globally based, 

they also came from a variety of fields and backgrounds. This included 

automotive electronics, aerospace and mechanical engineering, 

industrial electronics, and more. 

It was concluded that more than three-fourths of these visitors 

were in a decision-making role, including departments such as production, 

research and developments. All current market trends 

were also highlighted, including smart factory, automation, digitalization, 

5G, M2M communication, and robotics. 

“We think that the electronics 

industry is growing and facing new 

markets, especially in the automotive 

industry, such as connected 

cars or vehicle communication and 

smart factories or smart homes. 

This is why, this show has been 

very successful for us.” – Matthias 

Müller, Public Relations, Goepel 

Electronics 



“I think the new concept is working 

well. For Electrolube certainly, it 

seems to be sort of a bigger and 

more interesting show this year. 

I find the forum concept and the 

layout great. It definitely suited us 

better this year.”- Julia Vorley, 

Marketing Manager, Electrolube 

Presentations, forums, and discussions covered a variety of topics 

and trends. E-mobility, renewable energy, reliability were some 

themes that were presented, including software and hardware solutions 

for challenges throughout the value chain. Future developments 

and expectations of the industry were also explored, seeing 

which direction the market might lead to. 

Visitors were able to compete in the hand soldering competition for a chance to 

participate in the World Championship that will occur at productronica. 

Highlights of the show 

With its name and approach, the tradeshow provided an assortment 

of opportunities to discuss and learn techniques for specific situations, 

as well as to put sensible solutions into practice. 



Like every year, the Future 

Packaging Production 

Line included all 

parts of a line, where 

visitors were able to see 

it running live. 

“So now a days, we see at Parmi 

that regular SMT is trying to catch 

up with the backend semiconductor 

market. Therefore, we are 

adapting the curve on the portfolio 

for taking part in the backend 

semiconductor market.” – Walter 

von Dooren, Sales Manager, Parmi 

Corporation 

New beginnings 

Taking place for the first time, the Technology Days was a learning 

opportunity for 164 participants to gain more knowledge about different 

subjects, including mounting, substrates, the connecting of 

components and assemblies, and soldering. Presenters shared 

their knowledge and experience on developments and solutions for 

the industry. 

The Newcomer Pavilion also occurred for the first time this year. 

This platform not only gave the opportunity for startups to create a 

niche in the industry, but also for larger, more experienced companies 

to get a glimpse of new and innovative ideas. This was a 

great collaborative occasion for all who participated. Another innovative 

event that occurred was the EMS Park. In this area, 12 exhibitors 

were able to build connections with visitors in a park-like atmosphere. 

A Speakers’ Corner was also there to further share 

knowledge, best practices, and solutions. 

Reoccurring events 

As previous years, the IPC Hand soldering competitions took place 

again, for professionals as well as for students. This gave a chance 

for employees from a variety of companies to demonstrate their soldering 

skills. Participants competed for a chance to take part in the 

Hand soldering world championship, which will take place at the 

end of this year at the productronica show in Munich. 

The Future Packaging Production Line organized by Fraunhofer IZM 

was another success this year. With the motto “Get in the ring – 

Meeting the challenges of modern manufacturing”, visitors were 


able to see a live running production line. Tours were made throughout 

in both English and German to further explain each solution and 

its capabilities. 

Another great development offered this year was the career planning 

platform as it is a challenge for the industry to find well skilled 

employees. This platform was centered towards helping visitors 

that are interested in starting a career in the electronics industry to 

find available job openings. 

Focus on power electronics 

The PCIM tradeshow also took place alongside SMTconnect. This 

show focuses on the entire power electronics industry, including 

energy management, intelligent motion, thermal management, renewable 

energy, sensors, and more. 515 exhibitors displayed a variety 

of solutions to over 12,000 international visitors. This year’s 

highlights included conferences, lectures, and forums, which presented 

guidance and know-how on all market trends. Over 800 participants 

attended the conferences, with 333 lecturers. There were 

also 107 forums, which included short presentations covering a variety 

of topics. A main highlight was the e-mobility forum that examined 

the latest trends of power electronics and solutions to its challenges. 

Both shows will take place again next year on May 5–7, 2020 at the 

NurembergConvention Center. 

www.smtconnect.com 

Next year, the SMTconnect show will take place on May 5–7, 

2020 at the NurembergConvention Center. 


Industrie 

The network of expertise for industry 

3D AOI Arena 

Compare. Evaluate. Decide. 

12 – 15 November 2019 

9:00 a.m. – 18:00 p.m. 

productronica 2019, Munich, Germany 

Hall A2-506 

Measure the top AOI machines 

available in the market, all in one arena 

Compare - Evaluate - Decide 

10 leading 3D AOI manufacturers present 

their solutions, all in one booth. Find all you 

need to know about 3D AOI. 

Daily guided tours 

in Englisch: 10:00 a.m., 13:00 and 16:00 p.m. 

in German: 11.30 a.m., 14:30 p.m. 

Making it even easier for you to compare, 

evaluate, and make the right decision! 

Don`t 

miss out! 

Partner/Manufacturer: 

Further information can be found here 

http://hier.pro/TdC7B 

Cooperation partner: 


Source: EPP Europe 

The 3D AOI Arena 

will have multiple 

tours in English 

and German in 

Booth A2–506. 

Importance of accurate inspection 

3D AOI Arena- Compare. 

Evaluate. Decide. 

Following futuristic trends, including Industry 4.0, Smart Factory, and miniaturization, boards 

now need to have more capabilities and capacities. As a result, components are becoming 

more complex, boards are becoming overloaded, and with a fast-paced production, accurate 

inspection is needed more than ever before. Manufacturers are understanding the importance 

of high-quality production, in order to reduce production recalls and defects. 

Source: EPP Europe 

To best achieve and maintain a high throughput and high yield environment, 

all components and boards need to be thoroughly inspected, 

before leaving the production line. It can be applied several 

times throughout the manufacturing process, including pre reflow 

and post reflow. An AOI solution monitors printed circuit boards for 

defects, incorrect, missing or misplaced components, as well as, 

missing or overflow of solder paste, and electrode shift. As different 

AOI solutions have different capabilities, it can be a challenge to find 

a suitable solution for a specific application or process. 

Purpose of the 3D AOI Arena 

In collaboration with 10 inspection manufacturers and Messe 

München, the trade magazines EPP and EPP Europe have organized 

the 3D AOI Arena, which will take place throughout this year’s productronica. 

Ten AOI manufacturers will display their solutions alongside 

one another, to show their best features and advantages. The 

top Automated Optical Inspection manufacturers that are participating 

in the arena include: Cyberoptics Corporation, Goepel electronic 

GmbH, GPS Technologies with Parmi, Koh Young Technology, Mirtec, 

Omron Europe, Saki Corporation, Viscom AG, Vi Technology, Yamaha 

Motor Europe N.V. 

All in one place, visitors will get the opportunity to measure and 

compare different inspection solutions, stay up to date on a variety 

of the top features in today’s market, in order to be able to make informed 

decisions based on their needs. In both English and German, 

multiple live guided tours will occur to further inform visitors 

on each inspection solution, including machine introductions, details 

about hardware and software, Q&A rounds, etc. 

in Hall A1. The participating inspection professionals will exchange 

their expertise on today’s on-going themes, the challenges that can 

arise in the inspection industry, as well as a variety of techniques 

and solutions. 

As an extra bonus, on pages 26-##, a market overview is available 

that analyzes current inspection solutions on the market. This includes 

other AOI manufacturers, not only those participating in the 

3D AOI Arena. This research gives an overall insight about each solution, 

including details about the machine, image capturing system, 

and detectable defects. It also gives an overview of the software, including 

analysis and predictive capability, as well as, different off-line 

modes. 

The 3D AOI Arena will take place during the productronica tradeshow, 

from November 12–15, in Booth A2–506. 

www.epp-europe.eu/productronica-2019–3d-aoi-arena/ 

3D AOI tour schedule 

Date/Time 

10:00–11:00 

11:30–12:30 

13:00–14:00 

Tuesday 

12.11 

English 

German 

English 

Wednesday 

13.11 

English 

German 

English 

Thursday 

14.11 

English 

German 

Roundtable 

SC Hall A1 

Friday 

15.11 

English 

German 

English 

Automated Optical Inspection highlights 

To gain further knowledge, a roundtable discussion will take place 

on Thursday, November 14, 2019 at 1 pm at the Speakers Corner 

14:30–15:30 

16:00–17:00 

German 

English 

German 

English 

German 

English 

German 

N/A 


3D AOI MARKET SURVEY 

Company 

Name 

ALeader Europe 

Ltd. 

CyberOptics 

Corporation 

GÖPEL electronic 

GmbH 

Koh Young 

Technology 

Mek 

Mirtec 

Name and model 

ALD8720S 

SQ3000 3D AOI 

System 

Vario Line · 3D 

Zenith 2 Side 

Cameras 

Mek ISO-Spector M1A 

(with Artificial Intelligence) 

Alpha 

Size / weight 

1085 mm (L) 

1275 mm (W) 

1570 mm (H) / 920 kg 

1100 mm (W) 

1270 mm (D) 

1390 mm (H) / 965 kg 

1200 mm (W) 

1450 mm (D) 

1650 mm (H) / 950 kg 

L Size-1000 mm (W) 

1530 mm (D) 

1805 mm (H) / 850 kg 

1070 mm (W) 

1550 mm (D) 

1500 mm (H) / 800 kg 

1080 mm (W) 

1492 mm (D) 

1560 mm (H) 

Max. size of board 

510 x 500 mm 

(620 x 550 mm – model 

ALD8730S) 

Standard system 

510 x 510 mm 

Large PCB system 

710 x 610 mm 

510 mm 

(L Size) 

330 x 510 mm 

(XL Size) 

510 x 690 mm 

510 x 680 mm 

510 x 460 mm 

Max. # of inspected 

components 

Unlimited 

Unlimited 

Unlimited 

N/A 

Unlimited 

Unlimited 

Max. height of 

components 

40 mm top 

85 mm bottom 

Up to 24 mm 

Measured in full 3D & 

30 mm in 2D 

40 mm 

20 mm 

50 mm top clearance, 

measurable 25 mm 

34 mm 

Inspection machine 

Speed: low/high 

PCB clearance 

High speed inspection 

40 mm top, 

Conveyor height – 

870-970 mm 

44 sq/cm/sec @ 10 um 

+ 15 sq/cm/sec @ 

7 um 

50 mm 

up to 100 cm²/s 

40 mm 

N/A 

Top – 40 mm 

Bottom – 50 mm 

High speed inspection 

(FoV 69 x 69 mm) 

50 mm top clearance 

4,040 mm²/sec 

Top – 45 mm 


Monitor 

23.6” touch screen 

Touch screen operation 

24” multi-touch, nonreflective 

surface 

N/A 

24” touchscreen monitor 

mounted in the frame 

24” 

Operating system 

Windows 10 64 bit 

Professional 

MS Windows 10 

Windows 10 LTSC 

Windows 7 

Windows 10 Pro 

Windows 10 

Aspects of 

manufacturing line 

it covers 

Designed for after-reflow, 

but capable to 

inspect pre-reflow and 

after wave too 

3D SPI, pre-reflow 

AOI, post reflow AOI, 

post wave, wire bond, 

packaging, CMM, metrology 

All aspects can be 

covered 

Pre-reflow, post-reflow 

Pre-reflow, post-reflow 

and post-wave (solder) 

Pre-reflow, post-reflow, 

post wave 

(Other) 

System as benchtopversion 

with manual 

loading available 

Number of cameras 

in machine 

1 camera 

1 x multi function 3D 

MRS sensor 

4 cameras with 12 

MegaPixel technology 

(angled view), 1 camera 

with 28 MegaPixel 

technology (orthogonal 

view) 

1 (4 side – optional) 

5 cameras: 1 main 

camera, 4 side cameras 

5 cameras: 

1 main (top-down) 

camera & 4 side 

cameras 

Image capture system 

Type of camera(s) 

12 MegaPixel high speed 

intelligent camera, telecentric 

lens 

Programmable projector 

+ 4 x oblique 

cameras 

+ 1 x HR colour 2D 

camera 

4 angled-view cameras 

with 360 inspection 

directions and 1 

orthogonal camera 

12 m highspeed 

camera (top) 

(side 2 m) 

Main camera 25 

MegaPixel with Coaxpress 

interface, side 

cameras 2.5 MegaPixel 

each with Coaxpress interface 

Monochrome 

Capabilities of 

camera(s): HD/3D? 

N/A 

100 % 3D measurement 

+ statistical 

image analysis 

3D / 2D / 360 inspection 

directions / 360 

projection directions 

3D inspection 

Both HD and 3D 

Top camera 12 MP, 

side cameras 

18 MP, lens resolution 

alternatively 

available with 

10 μm or 15 μm 



Ltd. 

Parmi 

Corporation 

Pemtron 

Europe GmbH 

Saki Corporation 

TRI Test 

Research, Inc 

Viscom AG 

Vi Technology 

Yamaha Motor 

Europe N.V. 

VT-S730-HE 

Xceed 

Eagle 3D 8800 

3Di-LS2 

TR7500QE 

S3088 ultra gold 

5K 3D 

YSi-V; Type HS2 

1100 mm (W) 

1470 mm (D) 

1500 mm (H) / 800 kg 

850 mm (W) 

1205 mm (D) 

1525 mm (H) 

1190 mm (W) 

1370 mm (D) 

1600 mm (H)/970 kg 

1040 mm (W) 

1440 mm (D) 

1500 mm (H) 

1100 mm (W) 

1730 mm (L) 

920 kg 

800 kg 

1110 mm (W) 

1351 mm (D) 

1892 mm (H)/ 900 kg 

1252 mm (W) 

1498 mm (D) 

1550 mm (H) / 1300 kg 

510 × 460 mm 

Up to 1200 mm length 

and 610 mm width 

510 x 510 mm 

Possible up to: 

650 x 1500 mm 

Single lane: 

50 × 60 mm (min) to 

500 × 510 mm (max) 

Dual lane: 

50 × 60 mm (min) to 

320 × 510 mm (max) 

519 x 460 mm 

optional 510 x 590 mm 

508 x 508 mm 

533 x 609 mm 

610 x 560 mm 

Up to 10,000 

components per PCB 

Unlimited 

Unlimited 

Unlimited 

Unlimited 

Unlimited 

Unlimited 

12,800 components 

25 mm 

up to 50 mm 

60 mm 

Machine clearance: 

• Top: 40 mm / Bottom: 

50 mm • Max. measurement 

height: 25 mm 

50 mm 

up to 50 mm 

34 mm 

(40 mm optional) 

45 mm 

High speed full 3D inspection 


58.3 cm²/sec 

High speed: 57 sq.cn/s 

up to 50 cm²/sec 

High speed 


in full 3D 

32.94 cm²/sec 

40 mm top/bottom 

Top – 40 mm 


3 mm 

Machine clearance 

Top – 40 mm 


Top – 50 mm 


50 mm 

Top – 34 mm 

(40 mm optional) 


3 mm front and rear 

Touch panel 

24” 

24” 

• Screen Size: 24” LCD 

monitor 

• Screen Resolution: 

WUXGA (1920 × 1200) 

24-bit full color 

Touchscreen 

Yes 

22” LCD 

Full HD 

Windows 10 

Windows 10 

Windows10 

Windows 10 

Windows 

MS Windows 

Windows10 

Windows 7 embedded 

64 bit 

Post-reflow and 

wave solder 

All test gates in the 

manufacturing line 

(pre-/post-reflow, postwave 

with bottom side 

inspection head, 

Underfill, Die, IGBT, 

CCOD, etc. 

Pre-/post reflow 

and post-wave 

All: pre-reflow, post-reflow, 

post-wave and 

special application 

Pre-reflow, post-reflow, 

post-wave 

Pre-reflow, postreflow, 

post-wave, 

solder paste 

inspection 

All: Pre-reflow, 

post-reflow, post-wave 

All: pre-reflow, 

post-reflow, 

post-wave 

1x direct view 

4x angle view 

Color textured range 

scan camera, side 

cameras for 360 ° 

inspection 

up to 5 cameras 

5 cameras: 

1 for orthogonal 

4 for side view 

5 high resolution 

cameras and 4 digital 

fringe pattern 

projectors 

9 cameras 

3 cameras 

5 cameras 

• Direct view is the 

eye of the system, to 

capture images of a 

PCB using12MCMOS 

camera. 

• Angle view to capture 

the PCB oblique 

image using CCD 

UHS image sensor with 

FPGA real time image 

processing 

Telecentric high 

resolution / high 

speed camera 

CMOS area camera 

Mpix 

Viscom 

1 orthogonal color 

camera 8 Megapixel, 

12-bit CCD + 2 angled 

cameras for laser 

triangulation 

1 top looking, 

4 angled cameras 

CMOS Camera. Full 

3D capabilities with 

unique patented 

technology 

High resolution 3D 

TRSC sensor head 

2D/3D algorithms 

for full 3D images 

3D 

3D fringe pattern 

HD and 3D 

HD and 3D 

2D and 3D 



Company 

Name 


Ltd. 

CyberOptics 

Corporation 


GmbH 

Koh Young 

Technology 

Mek 

Mirtec 

Quality of image: 

Judged by pixel 

size 

15 micron 

10 μm + 7 μm HR option 

up to 10.5 μm per pixel 

15 μm - 20 μm 

15 μ/pixel resolution 

4,096 x 3,072 pixel 

Image capture system 

Illumination unit: 

LED/infra-red/etc… 

LED 

LED 

Multispectral, multidirectional 

(infrared/visible/ultra 

violet), can 

be adjusted in intensity 

and direction 

3D Projectors (8), 

IR_RGB LED, Dome 

styled Illumination 

Two stage, 

omnidirectional RGB 

LED lighting 

2D: RGB color LED 

3D: white LED 

source 

Projector unit 

4 digital projector units 

N/A 

Multi fringe projection, 

360 projection directions 

8 

4x multi-frequency 

Moiré projectors (total 

12 projectors) with 80 ° 

projection angle 

Digital projector 

Filet (height/length) 

Yes, height, volume and 

area measurement 

Yes measured 

Yes 

Yes 

Yes, also volume 

Yes 

Wetting angle 

Fillet shape 

Yes 

Yes 

Yes 

Yes, full profile meniscus 

shape analysis 

Yes 

End/Side 

connection 

(width/length) 

Yes 

Yes measured 

Yes 

Yes 

Yes, including bridges 

detection in both 2D and 

3D 

Yes 

Footprint Inspection 

Missing solder 

Foreign material 

Footprint error 

Yes, no solder and 

insufficient solder 

Yes 

Yes 

Yes 

Yes full FOD capability 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes, also lack of solder 

Yes, full range foreign 

material in both 2D and 

3D 

Yes, confirmation of 

width, length and height 

Yes 

Yes 

Yes 

Types of defects 

(Other) 

Contamination on 

pads 

All others for body 

and lead 

IPC 610 classes I, II and 

III tolerance value 

checks in addition to 

regular measurements; 

IC lifted lead measurement, 

bent leads defects, 

excess solder defects, 

hair solder bridges 

• Cold solder 

• Insufficient and 

excessive solder 

• Void 

• Wave solder 

• Selective solder 

• Laser solder 

• Robot solder, etc. 

Component height 

Yes 

Yes measured 

Yes 

Yes 

up to 25 mm 

Yes, up to 25 mm 

Component body inspection 

Component 

missing/ wrong 

Polarity 

Reverse front/back 

Component 

shift, lift, tilt 

Missing inspect., OCV, 

OCR, component color inspection 

Yes 

Yes 

Yes – automatic 

tolerance definition 

according to IPC level 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes, including OCR/OCV 

text inspection 

Yes, in both 2D and 3D 

Yes, dedicated front/ 

back check algorithms 

Yes, in steps of 1 μ resolution 

in X,Y, Z. Tilt in 

length and width directions 

of the component 

(4 corners are measured) 

Yes 

Yes 

Yes 

Yes 



Ltd. 

Parmi 

Corporation 

Pemtron 



TRI Test 

Research, Inc 

Viscom AG 

Vi Technology 

Yamaha Motor 


High quality 3D 

imagery using CMOS 

camera 

50 MPix/s 

HD 

XYl Resolution: 

7 μm/ 12 μm/ 18 μm 

Height (Z) resolution: 

1 μm 

12 MPix top, 6,5 MPix 

side cameras 

up to 10 μm 

4.75 μm X,Y resolution + 

laser triangulation with Z 

constant resolution 1 μm 

from -5 to + 20 mm 

12 micron 

Omron proprietary 

color highlight illumination 

consisting of 

red, green and blue 

LEDs 

Multi-LED, RGB 

LED and UV available 

• 2D lighting system: 

6 stage lighting ring 

(Coaxial Toplight: Red 

LED, Toplight: Red LED, 

Sidelight: Blue LED, 

Green LED, Red LED, 

and Lowlight: Red LED) 

• 3D lighting system: 

white high power LED 

(for profilometry) 

Multi-phase true 

color LED, Coaxial 

lighting 

LED 

Axial and peripheral LED 

with holographic diffuser 

White LED + 

infrared 

DPL phase shift projector 

units that project 

stiped lighting 

for 3D imagery 

Shadow-free, Dual 

Laser Triangulation 

10 projector Moire 

technology 

4 height projection: 

multi-frequency digital 

projectors 

4 digital fringe pattern 

Yes 

Red laser with 2 angular 

cameras 

4 projectors 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes: height, length & 

width 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

• End solder in 3D (wetting 

angle/concavity) 

• Side solder in 2D 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

• Contamination inspection 

• Underfill-fillet 

• SIP-inspection 

• Die • Underfill 

• CCOD 

• Solder paste 

• Solder ball 

• Excessive solder 

• Solder bridge 

• Soldering volume 


• Lifted lead 

• Bridge 

• Contamination 

• Solder balls 

None or 

insufficient wetting 

Yes 

Yes, up to 25 mm 

Yes 

Yes 

Up to 20 mm 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 



Company 

Name 


Ltd. 

CyberOptics 

Corporation 


GmbH 

Koh Young 

Technology 

Mek 

Mirtec 

Component body inspection 

(Other) 

• Component co-planarity 

• Component type 

(OCR) 

• Component colour 

• IPC 610 classes I, II 

and III tolerance value 

checks in addition to 

regular measurements. 

• Component absence 

verification (make sure 

a component is not 

placed) 

• Tombstone 

• Upside down 

• OCR • Double 

chip • Lift 

• Shift (X, Y offset) 

• Angle of 

component 

• Manhattan 

• Height • Tilt 

• Scratch •Crack 

• Misalignment 

• Dimension 

Electrode shift 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Electrode inspection 

Electrode posture 

(Other) 

Yes 

All inspection related to 

TH – missing, insufficient 

and no solder, 

short, flag, hole, etc.. 

Yes 

Yes 

N/A 

Yes 

Yes 


(over electrode) 

• Component shift 

according to IPC 

610 • Slope 

(height diff. between 

electrodes) 

Types of defects 

Peripheral inspection 

Foreign object 

Solder ball 

Solder bridge 

(Other) 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes full range (across 

the whole PCB) in both 

2D and 3D 

Yes, with solder “ball” 

shape verification in 3D 

Yes in both 2D and 3D 

• THT pin height 

• Solder meniscus 

measurement 

Yes 

Yes 

Yes 

• Shortage of 

leads 

• IC-lead fillet 

• Lead lift 

• Lead shift 

• Lead bent 

Board inspection 

Foreign object 

(Other) 

Yes 

Yes 

Yes 

• Distance measurements 

between components 

and/or pad 

Yes 

• Critical distance 

Yes full range (across 

the whole PCB) in both 

2D and 3D 

• Warpage compensation 

up to 10 mm 

Yes 

• PCB warpage 

compensation 

Software 

Ease of use 

Very easy, auto programming 

Easy simple intuitive 

GUI 

Very easy 

Medium difficulty 

depending on algorithms 

used 

Easy: Semi-automatic 

components programming, 

100 % automatic 

solder measurement 

strategy programming 

using Artificial Intelligence. 

Programmer 

level independent results 

Easy to use 

Program creation 

Fast and easy, intuitive 

interface, auto programming 

On line / Off line 

from CAD, Gerber, 

ODB++ 

Automatic test program 

generation and 

optimization 

Easy 

By importing Gerber 

and CAD (centroid) 

data files 

Automatic programming 

function 

based on deep 

learning provided 



Ltd. 

Parmi 

Corporation 

Pemtron 



TRI Test 

Research, Inc 

Viscom AG 

Vi Technology 

Yamaha Motor 


• Bond-Line-Thickness 

(BLT) 

• Die-tilt • Diemisalignement 

• Die-chipping 

• Die-crack 

• Epoxy coverage 

• Fillet height & runout 

• Resin bleed out 

(RBO) 

• Coplanarity 

• Color 

• Test 

• Billboard 

• Tomb stone 

• Tombstone 

• Broken component 

• Text (OCV & OCR) 

• OCR 

• OCV 

• Foreign component 

• Component damage 

• Lifted leads 

• Coplanarity 

• Lifted leads detection 

• Billboard detection 

• Tombstone detection 

• Upside down components 

Yes 

Yes 

Yes 

Yes 

N/A 

Yes 

Yes, possible 

Yes 

Yes 

Yes 

Yes 

Yes 

N/A 

Yes 

Yes 

Yes 

• Electrode presents 

• Offset inspection 

• Twist inspection 

• Electrode height 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

• SPI • Solder paste/ 

ball coplanarity 

• Copper Clip On Die 

(CCOD) • IGBT 

• Wire Loop 

• Bridge • Stitch 

• Text and 1D/2D 

bar code 

• Scratch on the PCB 


• Flux • Residue 

• Wrong silk print 

• Wrong drilling/routing 

• PCB damage 

Yes (Full view 

window) 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

Yes 

• Contamination inspection 

• Board warpage 

• Board shrink 

• Stretch 

• Scratch on the PCB 


• Flux 

• Residue 

• Wrong silk print 

• Wrong drilling / routing 

• Bending 

• Warpage 

• ID code 

• Metrology: specific 

distance between components, 

or to any reference 

point 

Easy 

Very easy 

Clear structured 

GUI – easy and 

fast to use 

Easy and simple but 

flexible: Saki Self Programming 

5 step programming 

Easy 

Medium, very high 

flexibility to inspect 

exotic components 

Easy 

QupAuto Process 

Software using AI 

control function 

ePM (Gerber, BOM, 

CAD) 

Offline or by using 

the system 

Automatic program 

creation complied with 

IPC standards: Saki 

Self Programming 

Menu controlled 

Easy 

Fast and intuitive GUI 

Yes 



Company 

Name 


Ltd. 

CyberOptics 

Corporation 


GmbH 

Koh Young 

Technology 

Mek 

Mirtec 

Off-line mode for 

programming/ 

teaching/repair 

Yes 

Yes 

Yes 

Yes- Medium difficulty 

Yes, offline programming, 

offline debugging 

during production, 

100 % automatic debugging 

of solder joints 

Yes 

Analysis software 

Real time and history 

SPC 

Full traceability + 

SPC solution for machine 

& factory 

Yes 

Yes- Medium difficulty 

Analyzer software for 

extensive SPC reports 

and feedback 

Yes 

Predictive 

capability 

Process analysis 

No 

Yes 

Yes 

Yes, Artificial Intelligence: 

the systems 

learns process variables 

based on 

measurements and 

gets better over time 

for excellent detection 

of solder joint defects 

Yes 

Software 

Software for CAD 

conversion 

Included into the system 

SW 

Yes 

Yes, completely integrated 

in system 

software 

Easy- EPM, 3 rd 

party software 

Not included 

Yes 

(Other) 

• Direct import of 

Mentor/Valor files 

• Multi-line verification 

• Central failure 

verification 

• Central failure 

verification without 

inline verification 

equipment 

• Presentation of 

corresponding SPI-, 

AOI- and AXI-failures 

at verification station 

• Presentation of 

corresponding SPI-, 

AOI- and AXI-failures 

at verification 

station, as well as 

from third-party-suppliers 

Software for Artificial 

Intelligence management 

and monitoring 

Demo board 

Regular board is enough 

to create the program 

Yes 

Yes, but not mandatory 

Yes 

Available 

For optimization, 

Golden board is 

helpful but not 

necessary 

Use of Golden board 

Test board 

Other 

Regular board is enough 

to create the program 

Yes 

Yes, but not mandatory 

Yes 

Available 

For optimization, 

Golden board is 

helpful but not 

necessary 



Ltd. 

Parmi 

Corporation 

Pemtron 



TRI Test 

Research, Inc 

Viscom AG 

Vi Technology 

Yamaha Motor 


Yes, off-line teaching 

and repair 

station for program 

creation and optimization, 

In-line 

verification software 

Yes 

Yes 

• Full offline programming 

capability 

• Auto tuning function 

in offline teaching system 

• Judgementstation 

(repair/verification) 

Yes 

Yes 

Yes 

Yes 

Yes, SPC and process 

improvement 

software, QupNavi 

SPI analysis software 

Yes 

SPC and customized 

solutions 

• SPC Software available 

• Reporting software 

available 

SPC 

Yes 

Yes 

VT-S730-H machine 

with AI based predictive 

maintenance 

function 

Yes 

Yes 

• Self-diagnostic function: 

system status 

health check including 

data base, preventive 

and predictive maintenance 

check 

• Inspection result and 

process warning system 

Yes 

Yes 

Cycle time simulator 

Yes 

ePM software for 

CAD conversion 

Yes 

Yes 

• Full support: ODB++, 

OPM and custom 

formats • Optional 

ePM 

Yes 

Yes 

Fast and intuitive GUI 

Yes 

• Veriworks (Real 

Time Defect Analysis, 

Cross-Section Profile 

Analysis, Defect History) 

• SPC 

• xNET (correlation to 

SPI, multiple machine 

management & remote 

control, web 

browser based (PC & 

mobile), library management) 

• Close loop software 

between SPI 

and AOI 

• Library validation 

• Golden/Silver 

sample board verification 

• Shop floor/ traceability 

connection system 

• History management 

system (a program version 

control) 

• Multi-Language support 

• GPU calculation 

• New production introduction 

support (Programming 

without PCB 

in-hand) 

• Advanced user privilege 

/ access rights 

control 

• Gerber input 

• Statistical Process 

Control 

• Viscom Quality 

Uplink 

• Closed Loop 

• Analyses data combined 

with mounter and 

SPI data 

N/A 

No 

Not necessary 

Not required for programming 

or tuning 

however, those are 

used for library validation 

feature for inspection 

capability 

check. 

Not necessary 

Yes 

Not needed 

N/A 

N/A 

No 

Not necessary 

Not required for programming 

or tuning 

however, those are 

used for library validation 

feature for inspection 

capability 

check. 

Useful, but not 

necessary 

Yes 

Not needed 

Yes 

Golden board 

Bare board 


CyberOptics Corporation 

Providing Maximum Versatility 

with Multi-Function SQ3000 

for AOI, SPI and CMM 

Improve your Inspection and metrology processes with CyberOptics’ SQ3000 

Multi-Function system – the ultimate combination of speed, resolution and accuracy. 

There is an increasing need for 100% 

2D & 3D inspection and measurement 

to identify critical defects and 

measure critical parameters. Customers 

want more than inspection and a pass/ fail 

report. They want X Y Z measurements to 

determine what it means for their process 

if the measurements are not right. They 

are considering what they feed back to 

their process and how they can control 

their process better. The SQ3000 Multi- 

Function system can effectively find critical 

defects and measure critical parameters, 

in order to fix what can be found and 

control what can be measured. The technology 

excels, particularly in challenging 

applications. 

Deemed best-in-class, the SQ3000 has 

been widely used for 3D Automated Optical 

Inspection (AOI) and can be used for 

3D Solder Paste Inspection (SPI) for the 

best accuracy, repeatability and reproducibility 

– even on the smallest paste deposits. 

The SQ3000 can also be used to attain 

highly accurate coordinate measurements 

faster than a traditional Coordinate Measurement 

Machine (CMM) – in seconds, 

not hours. Additionally, the world’s first inline 

CMM includes a comprehensive software 

suite for use in SMT, semiconductor 

and metrology applications. 

The SQ3000 offers a combination of unmatched 

accuracy and speed with the industry-leading 

Multi-Reflection Suppression 

(MRS) sensor technology that meticulously 

identifies and rejects reflections 

caused by shiny components and surfaces. 

Effective suppression of multiple reflections 

is critical for highly accurate 

measurement, making the proprietary 

MRS technology an ideal solution for a wide 

range of applications with exacting requirements. 

Cyber Optics proprietary 3D MRS sensing 

technology comprises four multi-view 3D 

sensors and a parallel projector delivering 

metrology grade accuracy at production 

speed. The unique sensor architecture simultaneously 

captures and transmits multiple 

images in parallel while proprietary 

3D fusing algorithms merge the images 

together. The result is ultra-high quality 3D 

images and high-speed inspection. 

The ultra-high resolution MRS sensor enhances 

the SQ3000 3D CMM platform, delivering 

superior inspection performance 

Automated Optical Inspection 

Solder Paste Inspection 


Advertorial 

COMPANY CONTACT 

Sean Langbridge 

European Sales Director 

slangbridge@cyberoptics.com 

44–1423–871411 

CyberOptics Ltd. 

15a, Hornbeam Park Oval 

Hornbeam Park 

Harrogate HG2 8RB 

North Yorkshire, England, UK 

SQ3000 with Multi-Reflection Suppression (MRS) Sensor Technology 

for socket metrology, microelectronics, semiconductor 

and other challenging applications 

where an even greater degree of 

accuracy and inspection reliability is critical. 

Faster and smarter software simplifies the 

process with a powerful, yet simple software 

that is designed with an intuitive interface, 

reducing training efforts and minimizing 

operator interaction. In addition to 

3D AOI software that includes full SPI capability, 

the Multi-Function system includes 

expanded coordinate measurement 

capabilities. 

CyberCMM, a comprehensive software 

suite of coordinate measurement tools provides 

highly accurate, 100% metrology grade 

measurements on all critical points much 

faster than a traditional CMM, including coplanarity, 

distance, height and datum X, Y to 

name a few. A fast and easy set-up can be 

performed in less than half an hour for programming 

complex applications as compared 

to a slow, engineering resource intensive 

set-up that typically requires multiple adjustments 

with traditional coordinate measurement 

machines (CMMs). Add on Cyber- 

Report for a full-fledged machine-level to 

factory-level SPC capability. 

ABOUT CYBEROPTICS 

CyberOptics Corporation (www.cyberop 

tics.com) is a leading global developer and 

manufacturer of high precision sensing 

technology solutions. CyberOptics’ sensors 

are used in SMT, semiconductor and metrology 

markets to significantly improve 

yields and productivity. By leveraging its 

leading edge technologies, the company 

has strategically established itself as a 

global leader in high precision 3D sensors, 

allowing CyberOptics to further increase 

its penetration of key vertical markets. 

Headquartered in Minneapolis, Minnesota, 

CyberOptics conducts worldwide operations 

through its facilities in North America, 

Asia and Europe. 

Coordinate Measurement 

Firma 

CyberOptics Corporation 

(Headquarters) 

5900 Golden Hills Drive 

Minneapolis, MN 55416 

Phone: 763–542–5000 

Info@cyberoptics.com 

www.cyberoptics.com

Incomparably fast and versatile: 

Your System. 3D-AOI all-rounder 

Vario Line · 3D with automatic test 

program generation and SPI function 

Flexibility is an important competitive advantage in electronics manufacturing. 

Many EMS service providers often don‘t even know one day which projects could 

be received on the following day. Projects with exotic or unknown components, 

larger assembly series or very small runs of less than 10 pieces are often part of 

everyday life. Accordingly, inspection systems must also be dynamically adaptable. 

The Vario Line · 3D from GÖPEL electronic combines maximum fault detection with 

high speed. Combined 3D and 2D inspection as well as angled view cameras in 

360 1° steps meet the highest quality requirements. Fully automatic creation and 

optimization of inspection programs can save a lot of time in the production process. 

In addition, the Vario Line · 3D can also be used for solder paste inspection (SPI). 

The Vario Line · 3D is the flagship of 

the GÖPEL electronic inspection systems. 

All projectors, angled view cameras, 

orthogonal cameras and numerous 

illumination systems are combined 

under the hood of the module 3D · ViewZ. 

The 3D measurement is carried out areawide 

with high resolution and at highest 

speed. In some cases, however, 3D inspection 

reaches its physical limits. When 

testing a J-lead pin, for example, it is not 

possible to measure below the edge of the 

component. The combination with angled 

view provides a remedy: The rotation of 

the camera module enables projection 

and inspection from a total of 360 angles. 

So if a solder joint is hidden, the scene can 

be viewed step by step from different directions 

and a possible solder defect can 

be detected. 

Creating AOI test programs is a time-consuming 

everyday task for EMS service 

providers with a large variety of products. 

MagicClick was developed to reduce the 

cost factor time by up to 80 percent. The 

software tool creates and optimizes test 

programs for SMD assemblies fully automatically 

within a few minutes. Only Gerber 

and placement data are required, unlike 

library entries. Thus, even users without 

component knowledge can take over 

the programming. In addition, 

MagicClick learns 

over time: the more frequently 

a repetitive project 

is run, the more optimally 

the parameters are 

adapted. As a result, time 

savings of up to 80 percent 

can be achieved in 

the long term for the creation 

and optimization of 

test programs. 

With the Vario Line · 3D, 

all 3D inspection tasks in 

the inline process can also 

be carried out on assemblies 

printed with solder 

paste. In addition to the 

classic AOI tasks, the system 

can also be used to 

check paste volume, paste height, offset 

and short circuits, making the Vario Line · 

3D a true all-in-one system. 

A simple MES connection is necessary for 

the smooth integration of an inspection 

system. In spite of many efforts, no MES 

has been able to establish itself as a standard 

today, which means that a large 

number of systems exist. Individually 

adapted MES connections often take up a 

3D AOI System Vario Line · 3D 

lot of time. With the software PILOT Connect, 

GÖPEL electronic ensures that the 

Vario Line · 3D is connected to the MES 

with the delivery. Standard interfaces such 

as ZVEI, iTAC, Aegis, SECS/GEM, GEP, 

CAM and most recently IPC CFX are supported. 

Nevertheless, the systems can also 

interact with customer-specific MES 

communication systems. The fast connection 

is possible by a sophisticated 

plug-in system of the GÖPEL electronic 

Fotos: GÖPEL electronic GmbH 


Advertorial 

The GÖPEL electronic Inspection Solutions: AOI, AXI and SPI for SMD and THT 

software PILOT Connect. With a ready-made 

framework, connections can also be 

realized at short notice by an in-house development 

team in exchange with the customer. 

This also allows individual wishes 

and requirements of the electronics manufacturer 

to be met. 

In the PILOT Connect interface to the MES, 

data exchange takes place on a pure result 

level (unidirectional), with product-specific 

control and process interlocking (bidirectional) 

or with production data acquisition. 

Extensive statistical evaluation options 

for all connected systems are available, 

as are central repair or verification 

stations with display options for all inspection 

results involved. In addition to 

AOI, SPI or AXI systems from GÖPEL 

electronic, machines from other suppliers 

as well as electrical test systems can be integrated 

into PILOT Connect. 

The Inspection Solutions from 


Every electronics production is different – 

GÖPEL electronic offers solutions for all 

requirements, from the smallest producer 

to large-scale production. The AOI systems 

Basic Line 3D and Vario Line 3D are 

proven stand-alone and inline solutions. 

Since THT components are still indispensable 

today, the THT Line and the Multi- 

Cam Line offer reliable inspection of plugin 

components. The SPI Line – 3D is a reliable 

inspection partner to counteract 

faults in solder paste, sinter paste and 

DCB substrates as early as possible. And 

in order to detect hidden defects of highly 

complex assemblies in mass production, 

the X-ray system X Line – 3D allows detailed 

views into the hidden parts of the assembly. 

GÖPEL electronic thus offers inspection 

systems for the entire production 

process. 

GÖPEL ELECTRONIC GMBH IN PROFILE 

With advanced test and inspection 

systems for electronic assemblies and 

assembled printed circuit boards, GÖPEL 

electronic supports demanding customers 

in keeping their quality promises. Various 

inspection technologies detect manufacturing 

faults at every stage of the product 

life cycle – from design to end-of-line. 

The goal is an impeccable end product to 

avoid expensive complaints or even recalls 

that damage the reputation. The test and 

inspection systems are used in all industries 

related to electronics, but mainly in 

the automotive and medical technology, 

aerospace and industrial electronics 

sectors. All systems and technologies are 

developed and manufactured at the main 

site in Jena. The seal „Made in Germany“ 

goes beyond national borders: With more 

than 240 employees, worldwide subsidiaries 

and a global service network, GÖPEL 

electronic is always close to its customers. 

GÖPEL ELECTRONIC GMBH 

Jens Kokott 

Göschwitzer Straße 58/60 

07745 Jena 

Use of Vario Line · 3D as island solution 

Tel.: +49 (0)3641–6896–0 

Fax: +49 (0)3641–6896–944 

www.goepel.com

Next generation 3D AOI – PARMI XCEED 

Reliable 3D AOI with 

superior High-Speed-Laser- 

Technology 

A future-proof 3D AOI system must combine robustness, accuracy, speed 

and economy. However, ease-of-use and integration capability in a modern 

manufacturing environment play at least as important a role for the user. 

First 3D AOI systems, which were 

brought to market, were based on 

Phase Measurement Profilometry 

(PMP) or Moiré technology. In the process, 

3D data in a field-of-view (FOV) are determined 

and evaluated. The large amount of 

data requires appropriate high performance 

computers to get to acceptable inspection 

speeds. 

The next generation of 3D AOI systems 

relies on high-speed laser technology 

(HSLT). These systems are immune to interference, 

provide the highest accuracy and 

are ultra-fast. The real 3D measured values 

are measured by an intelligent 

3D sensor head. The 3D head moves continuously 

over the printed circuit board 

PARMI XCEED – Next generation 3D AOI system inspection from 0201M 

to components up to 50 mm high 

and evaluates the data of the laser line in 

real time – to 100%. Due to the superior 3D 

laser technology, significantly lower data 

volumes are necessary for the evaluation. 

The demands on the computer performance 

also decrease significantly. 

Robust 3D laser technology and highest 

reading quality 

In every SMT production, the colors, 

brightness, reflectivities and surface 

roughness of printed circuit boards vary 

considerably. Component sizes from 

0201M to large power components can 

be found on one and the same printed 

circuit board with increasing packing 

density. High components such as capacitors 

and connectors also 

do not really facilitate the 

testing tasks. As a carrier, 

the circuit board also plays 

an important role: very 

thin circuit boards or multiple 

panels with many and 

large cutouts do not provide 

a clear „measurement 

plane“. 

3D high-speed laser technology 

ideally fulfills all of 

these requirements that 

every one of us in electronics 

manufacturing knows 

only too well. The 3D sensor 

head is able to measure 

components up to 50 mm 

high and also has the ability to detect 

the warpage of the PCB in real time. This 

ensures a very decisive factor: the highest 

quality of the 3D measured values 

determined. Side cameras additionally 

support demanding test tasks. 

As a valuable „waste product“ even foreign 

particles and contaminants are recorded 

during the test – in the sense of supplier 

evaluation and technical cleanliness. 

Horizontal and vertical integration – 

interfaces and software 

An integral part of a forward-looking solution 

for 3D inspection is the horizontal integration 

(SMEMA, HERMES, IPC CFX, ...) 

and the vertical integration (MES) of the 

systems into the production line or environment. 

The creation of a test plan and the usability 

of the system are very simple and comfortable, 

since this is largely automated. 

These are two key requirements from 

the HighMix / LowVolume manufacturing 

environment and therefore provide significant 

added value for the user. 

Communication with upstream and 

downstream processes (printers, mounters, 

etc.) is also automated. Bad Marks 

are inherited and shared when multiple 

are used to avoid unnecessary checks. The 

same is true for correlations between 3D 

SPI and 3D AOI metrics to support the 

operating personnel purposefully in the 

continuous process improvement. 


Advertorial 

Author: Dipl.-Phys. Andreas Gerspach 

Andreas Gerspach is managing partner 

of GPS Technologies GmbH in Bad Vilbel. 

After completing his studies in physics, 

he gained extensive experience in the fields 

of project planning, sales, marketing and 

corporate management in the fields of laser 

and optoelectronics, semiconductor and 

coating technology as well as in printed 

circuit board manufacturing. 

PARMI XCEED – Next generation 3D AOI system with superior High-Speed-Laser-Technology (HSLT) 

Via xNET all evaluations run in the web 

browser (PC & mobile). There, the component 

libraries are also managed centrally. 

Range of applications 

In addition to the basic inspection tasks 

such as, presence, offset, polarity, etc., 

which must be met reliably and accurately 

in line timing for each SMD and THT printed 

circuit board, the 3D laser technology 

offers a superior range of applications: 

Underfill, Conformal Coating, System-in- 

Package (SIP), Die, Bond Line Thickness 

(BLT), IGBT, solder paste, solder balls, and 

much more. 

Many manufacturers use the inspection 

of the manufactured PCBs in a test island. 

Here, the PARMI XCEED also offers a 

variety of options for initial sample inspection. 

In addition to the 3D AOI test, 

the system also allows 3D solder paste 

testing. 

In terms of resolution, the laser technology 

is clearly superior to other measuring 

methods and thus a future-proof investment. 

PROFIL 

PARMI Corp. Ltd. is a global leader in 3D 

inspection systems. These include 3D Solder 

Paste Inspection (SPI), 3D Automated 

Optical Inspection (AOI) for SMT and THT, 

Inspection of Conformal Coated assemblies 

(CCI), Semiconductor Packaging (SP), Post 

Wire Bond Inspection (PWBI), and Wafer 

Bump Inspection (WBI). PARMI‘s customers 

include world-leading manufacturers 

in the automotive, industrial, EMS, display, 

package & memory, medical, aerospace, 

military and mobile devices sectors. PARMI 

is headquartered in Daejeon, Korea. With 

more than 35 offices and representations 

worldwide, PARMI ensures the qualified 

service and support of its 3D Inspection 

system. In Germany and Austria GPS 

Technologies GmbH from Bad Vilbel near 

Frankfurt is the partner of PARMI and 

responsible for sales and service in that 

territory (www.gps-tec.eu). 

PARMI XCEED – Next generation 3D AOI system inspection of white LED on white substrate 

GPS Technologies GmbH 

Dipl.-Phys. Andreas Gerspach 

Theodor-Heuss-Str. 31–33 

61118 Bad Vilbel, Deutschland 

Tel.: +49(0)6101/40600–0 

Fax: +49(0)6101/40600–99 

Email: info@gps-tec.eu 

www.gps-tec.eu

AOI Arena 

Meeting of the Giants 

or David vs. Goliath 

„After a decades-long slumber with 2D dreams, the entire squad of 

inspection system suppliers in the real 3D world has now woken up. 

The 3D AOI Arena certainly offers a good opportunity to get an overview 

of the different technologies and possible applications. 

Electronics manufacturing in Europe 

is becoming increasingly demanding 

and every board has its own challenges. 

The assembly manufacturers, whether 

OEM or EMS, are forced to equip 

themselves with state-of-the-art technologies 

to meet the demands of quality and 

competitiveness in Europe as well as in a 

global comparison. 

It is clear, the key to a high quality and reliable 

product is a solid automatic inspection. 

Whereby you have to clearly distinguish 

between inspection (2D), inspection 

based on 3D information or real 3D measurement 

technology. Only with this full 

coverage you can overcome the demand, 

to measure really all relevant characteristics 

of the dimension of a component, the 

placement and its solder joints in true 

3D measurement technology. Elemental 

is to use results not only for tolerance 

assessment, but to serve via smart tools 

for process optimization. 

Koh Young‘s product portfolio includes 3D 

SPI systems, pre- and post-reflow 3D AOI 

systems, as well as new and very successful 

Press Fit / Pin Inspection program. 

With 15,000 systems installed worldwide, 

the company is demonstrating its success. 

Since 2005 – more than 10 years – as a 

market and technology leader in the field 

of 3D measuring technology, the international 

company has been supplying knowhow 

and innovative systems for electronics 

manufacturing. All Koh Young systems 

meet the highest demands of SMT 

Koh Young Testboard 

electronic production as well as front and 

back end applications. 

the 3D AOI Arena 

On the way to invest in decision-making 

in the latest generation of measuring 

systems, the focus is usually initially on 

the technical specifications of manufacturers. 

The infinite variety of listed specifications, 

camera resolution, FOV, processing 

speed etc. just to name a few, makes it 

difficult to evaluate the real performance 

in the manufacturing operation of an AOI. 

So how much 3D AOI does modern production 

need? 

Here at the 3D AOI Arena we want to 

show you what is absolutely necessary 

and useful and not to confront you with 

even more technical details, but rather 

to show what a 3D AOI really should be 

capable of. With the benchmark board 

Ver.8 on our system Zenith 2 with side cameras, 

we want to prove the efficiency, 

the flexibility as well as the usability. 

Which 3D AOI system can really deliver 

measurement data precisely for the entire 

board and how can the quality of the 

system be checked? 

In the real world of electronics manufacturing, 

every single employee has to make 

decisions that are driven by a wide variety 

of influencing factors. These decisions 

must be based on reliable data. A 100% 

data acquisition without compromise is 

an absolute must. 

The miniaturization virtually excludes that 

the operator can still recognize these 

ultra small differences in real time. The 

exact measurement and recording of the 

individual Paste deposits (area, volume, 

shape) and the placement accuracy (rotation, 

offset, coplanarity) before the soldering 

process but also the final result, the 

parameters of each solder joint (volume, 

joint height, slope angle), are therefore 

elementary to uphold the manufacturing 

quality. 

Smart Factory also stands for the precise 

analysis of collected data, from different 

perspectives such as: error avoidance, sta- 


Advertorial 

ANSPRECHPARTNER 

Harald Eppinger is the Managing Director 

of Koh Young Europe GmbH in Alzenau, 

he joined the Company in 2009 and is 

working for more than 30 years in the 

field of Automated Optical Inspection. 

Zenith 2 

tus of process steps and their deviation 

from normal value is now the logical step 

of a real-time process optimization. 

With the help of “artificial intelligence“ 

clear instructions can be provided to make 

decisions in real time. Only then employees 

and companies can meet the high 

standards expected from them. 

This use of AI is already common practice, 

but if you use these artificial intelligence 

now first to improve the measurement 

accuracy is new attempt to the AOI area. 

PROFIL 

Koh Young Technology Inc. is one of the 

leading suppliers of 3D measurement 

and test equipment systems found in 

the manufacturing industries of leading 

PCB and semiconductor companies. For 

example, in the automotive electronics, 

telecommunications, military, medical 

and semiconductor industries. 

The headquarters of the international 

company is in Seoul, Korea. The European 

(European-wide) base is in Alzenau with 

Koh Young Europe. Other sales and 

support centers are located in the US, 

Japan, Singapore, China and Korea. 

Koh Young Europe GmbH 

Industriegebiet Süd E4 

63755 Alzenau 

Germany 

www.kohyoung.com 

Koh Young Technology Headquarter, South Korea

The New Hybrid 3D AOI 

“ALPHA_AOI” Is A Game Changer 

The stunning revolution of 3D AOI systems has been driven by the ever-increasing demands of the 

electronics industry. As the pioneer of advanced 3D AOI systems and the market leader in new technology, 

MIRTEC explains here how market demands can be exceeded and the target of 0–0 can be achieved. 

[How innovative is your 3D AOI?] 

The 3D Automated Optical Inspection 

(AOI) market has seen accelerated growth 

over the last four years due to the rapid increase 

in demand for quality in the SMT 

industry. PCB population density has increased, 

components have become smaller, 

and the composition of materials is 

constantly evolving. This phenomenon is 

the driving force behind the growth of the 

3D AOI market, and at the same time, a 

challenge for 3D AOI manufacturers. 

Components have become smaller out of 

necessity to have smaller and more densely 

populated PCBs, thus creating a difficult 

inspection environment to capture all 

possible failures. As the number of components 

to inspect increases, the density 

increases, and the visual interference between 

components increases. The increased 

use of unique components leads to 

the need to independently inspect high 

and low components placed directly next 

to each other with very high accuracy. In 

High component brings 3D shadow on environment 

addition, due to the various materials 

used in the components, it is necessary to 

inspect both reflective and absorbing materials 

posing new challenges to the inspection 

process. 

To meet these market demands, AOI 

equipment manufacturers have improved 

the performance of their systems over time. 

But, in fact, because the technology 

has not principally changed, there is little 

difference between the current 3D AOI 

systems and the first ones introduced 4 

years ago. 

Most current 3D AOIs measure 3D with 

Moiré fringe pattern projection technology 

(Moiré). This technique obtains several 

long wavelength fringe pattern images 

and short wavelength fringe pattern 

images of a test object, combines them, 

analyzes them, and restores them in 3D. 

Although widely used due to its ease of 

implementation and precision of measurement, 

there are fundamental limitations 

to this technology. 

If the Fringe pattern image used for 3D 

measurement with Moiré technology is replaced 

with data, a sine wave graph is displayed. 

The accurate 3D shape can be restored 

only when the measured data can 

be expressed by the curve of the sine wave 

without distortion. Recently, however, 

the components used in electronic products 

are of various materials, so the degree 

of reflection or absorption of light is 

very different. Therefore, when the Fringe 

pattern is projected on the board on which 

the component is mounted, light distortion 

noise (scattering, saturation, loss) easily 

occurs, leading to distorted sine waves 

and measurement data, making it difficult 

to restore the true 3D shape. 

Nevertheless, the 3D AOI you use displays 

the 3D image of the component normally 

because the system manufacturer filters 

the noise in software. Of course, noise filters 

are advanced techniques that require 

sophisticated software, and that can predict 

data to reduce false calls. However, 

since the noise filter is a method of altering 

the raw 3D measurement data 

through software, it is difficult to avoid the 

distortion of the true raw data, thus creating 

the risk of false defect detection and 

escapes. 

[Hybrid 3D Technology] 

In order to avoid data distortion, it is necessary 

to minimize the generation of noise 

when acquiring the raw data. MIRTEC‘s 

revolutionary ALPHA_AOI system introduces 

an innovative 3D measurement method 

that eliminates this ambiguity. 

Moiré projection is a recognized technology 

for precise measurement. So, it is not 

wise to replace this proven technology – 

despite its limitations in difficult imaging 

situations. Through extensive research, 

MIRTEC has identified that by combining 

different, but complimentary, 3D Moiré 

measurement technologies, a synergistic 

effect can be created to overcome the traditional 

hurdles. This new technology is 

called Hybrid 3D Technology. 

The biggest advantage of 3D measurement 

technology added by Hybrid 3D 

Technology over standard Moiré technology 

is that it is effective in suppressing optical 

noise such as light saturation, scattering 

and loss. Unlike the Fringe pattern 

used in Moiré technology, there are no 

areas with ambiguous optical measurements. 

In addition, the range of height 


Advertorial 

AUTHOR INFORMATION 

Holger Hansmann 

MIRTEC Germany 

Director of Sales & Marketing 

Working since 25 years in the SMT industry 

on different positions like: Manager 

of production; Project Manager; Product 

Manager; Sales Manager Europe; 

Business Development Manager 

3D AOI with ALPHA_AOI Hybrid 3D Technology 

measurement is wide, and more accurate 

3D measurement results can be obtained. 

The core of Hybrid 3D Technology is to 

reinforce the precision of existing Moiré 

technology and finally obtain true raw data 

without noise. 

Hybrid 3D Technology is superior in solder 

joint inspection due to its freedom from 

light saturation or shadowing, and it also 

performs very well when inspecting tightly 

populated PCB areas where high components 

overshadow smaller ones. It also 

demonstrates the reliability of obtaining 

the same results all the time, independent 

3D image & profile of cold solder inspected by AL- 

PHA_AOI Hybrid 3D Technology 

of PCB colors, component colors and material 

composition. 

Hybrid 3D Technology also excels at the inspection 

of high components. Even when 

measuring high components, the precision 

repeatability is unsurpassed. The proprietary 

3D projectors developed by MIR- 

TEC can measure and inspect components 

in a large area with up to 34mm 

height by default – without the need for 

additional equipment. 

[Conclusion] 

Market demands have pushed advances 

in 3D AOI, but at the same time caused 

new challenges. In the 3D AOI market, we 

have come to the point where a paradigm 

shift is required to face these new challenges 

and MIRTEC has created that shift 

with its ALPHA_AOI system. 

The ALPHA_AOI system can be seen at the 

productronica in the 3D AOI Arena, which 

runs from Nov. 12–15 located in Hall 506 

A2, at Neue Messe München in Munich, 

Germany. 

COMPANY DESCRIPTION 

A global leader in inspection technologies, 

Mirtec is a vision inspection solution company 

founded by experts in the field of FA 

(Factory Automation). Mirtec is the leading 

technology pioneer for 3D and 2D optical 

inspection systems advancing productivity 

in the SMT, semiconductor, and LED manufacturing 

markets. The company has supplies 

its high-performance inspection devices 

to cutting edge IT industries and automobile 

electronics fields, which require 

great reliability and precision. 

We take great pride in solving the problems 

of our customers with the technology 

we have developed. To continue on our 

path of excellence, we devote ourselves to 

continuously developing new technologies 

and offering the best services. Our mission 

is to be the leading Total Quality Solution 

provider for the markets we serve by 

providing innovative and technologically 

advanced integrated solutions. 

Company 

MIRTEC Germany 

Babenhäuser Str. 50, 

Gebäude 5 

63762 Grossostheim 

Germany 

Mobile: +49 (0)171 783 4456 

hhansmann@mirtec.com 

www.mirtec.com 


Zero-defect solutions 

Omron presents VT-S730-H 

in the EPP 3D-AOI Arena 

Without reliable sensor-, camera- and computer systems, mobile and fully autonomous 

processes will not function in a world of the future. But what happens if these electrical 

systems fail or have been manufactured with undetected faults? 

Omron is already addressing this problem today. 

High-speed automated X-ray CT inspection system VT-X750 

is no question about it, that 

unmanned vehicles, e-Mobility 

„There 

and artificial intelligence will become 

technical normality. It is therefore all 

the more important to exclude residual 

risks, in order to avoid possible damage. 

For this reason Omron developed the Zero 

Defect concept, that is applied precisely 

there“, stated Kevin Youngs, European Sales 

Manager at Omron Europe B.V., Automated 

Inspection Systems Division Europe. 

the Zero Defect concept includes a 100% 

inspection of assemblies within and beyond 

the SMT process. 3D-AOI high-speed 

systems are also integrated in this concept, 

such as the VT-S730-H, that Omron 

will present in the EPP 3D-AOI arena at the 

Productronica 2019. The VT-S730-H is a 3D 

inspection machine for the authentic 3D 

inspection of components and soldering 

joints. It enables the quantification of soldering 

joint forms with a greatly improved 

accuracy and reduced number of pseudo 

defects. 

For the most part the Post Reflow inspection 

systems of the VT-S730 series are used 

in production lines for quality control, in 

particular in the automotive industry. The 

series is based on a combination of phaseshift 

and the color image processing technology 

„Color Highlight“ developed by 

Omron, 3D form-reconstruction technology. 

Furthermore the VT-S730-H is equipped 

with the 3D-SJI technology. In addition the 

inspection system has been equipped with 

a fast image acquisition module, through 

which the VT-S730-H works twice as fast as 

the predecessor VT-S730. 

„As an AOI system, the VT-S730-H is part 

of a Zero Defect production. It involves 

the complete inspection of the electronic 

assemblies as well as the associated 

components, which contributes towards 

satisfying the quality requirements of the 

automotive industry to the fullest extent. 

For instance, in today‘s vehicles but also 

in those of the future more and more 

electronic safety components are being 

integrated, that are necessary for autonomous 

driving. The number of components 

and sub assemblies are becoming 

more and more extensive, from camera 

systems, sensor systems and wireless 

communication interfaces through to intelligent 

light systems and navigation 

aids. A 100% inspection of these assemblies 

are too time-consuming and are 

therefore currently still avoided. At the 

moment one works with random samples, 

which increases the risk of nondetection 

of a faulty component. We are 

convinced, that a complete automated 

inspection strategy is urgently needed 

and have therefore worked on necessary 

machines and implementations“, stated 

Youngs. 

High-speed-3D-AOI inspection system VT-S730H 


Advertorial 

IoT-Solution on SMT 

In order to ensure a complete inspection 

of a process, especially in the automotive 

industry, inspection systems must work 

fast and reliably. The cycle times of the 

production processes must not change 

negatively due to the inspection. Besides 

the VT-S730-H, Omron also offers AOI, SPI 

and AXI systems, as well as AVI systems, 

such as the VT-M121. The VT-M121 is the 

first system in the world developed for an 

industry-wide 2D dimensional inspection 

of measurement and visual inspection, 

that enables a complete 100% inspection. 

„As a result 100% inspections in the specified 

high-speed cycle times are possible 

from now on“, assured Youngs. 

Thanks to the Omron software environment 

the data collected by the inspection 

systems and process equipment are made 

usable for the operator. Consequently the 

software Q-upAuto warns of errors or 

deviations in real-time. For this the data 

of the inspection systems and the production 

data from all upstream production 

steps are compared and analyzed. Furthermore, 

the quality control and the improvement 

of the entire inspection process can 

be realized with the software Q-upNavi. 

For this, data from every step of the inspection 

process are linked, evaluated 

and presented in graphical form. „Our inspection 

systems as well as the associated 

software landscape can replace processes 

that were previously based on random 

sample inspections. With the complete 

automatic inspection a zero-defect result 

can be achieved, which fulfills in particular 

the requirement of the automotive industry 

for high quality and a high degree of 

reliability. This is necessary, especially with 

regard to the subjects of e-Mobility and 

unmanned systems“, elaborated Youngs. 

Omron has already successfully introduced 

the Zero Defect concept in Japan in 

2018, in cooperation with local EMS service 

providers. 

ANSPRECHPARTNER 

Kevin Youngs 

European Sales Manager 

Inspection Systems Division 

Industrial Automation Business 

kevin.youngs@omron.com 

Mobil: +44 (0) 7767 406092 

PROFIL 

Omron is a world leader providing innovations and solutions for the production sector. A 

constantly growing number of companies employ intelligent sensing devices and control 

technologies to ensure a high level of production quality as well as robots for product 

transport and order picking. The movement towards IoT in the production industry is 

unstoppable. The high rate of advancement in the AOI sector leads to the discovery of 

production beyond the influence of humans. As the global market leader of Automatic 

Optical Inspection systems, Omron has over 30 years of experience in cooperation with 

leading manufacturing companies and employs its core technologies for the benefit of the 

global Electronics Manufacturing Sector. 

Omron Europe B.V. 

Zilverenberg 2 

5234 GM‘s – Hertogenbosch 

Netherlands 

Tel: +31 (0) 73 648 18 11 

Fax: +31 (0) 73 648 18 79 

Internet: inspection.omron.eu 


Proven 3D Measurement Systems in the Market 

Saki’s SPI, AOI, and AXI in 3D 

Drive the Smart Factory 

Saki has always created the trends in inspection technology. In 1994, Saki developed the first line-scan 

technology and in 2010, released a fully automated 3D planar CT x-ray inline machine. Since 2012, Saki 

has developed 3D measurement technology for AOI and SPI, leading the industry in innovation. 

Saki’s motto is, “Challenging the creation 

of new value,” and Saki continues 

to be known for its innovation 

firsts--the first with true 3D AOI and 3D automated 

CT x-ray inspection (AXI), the first 

2D both-side AOI, and the first self-programming 

inspection software. Saki Self- 

Programming (SSP) software doesn’t require 

programming or a golden board 

and, in a matter of minutes, completely 

programs and verifies the inspection process 

in real time, eliminating variables 

and operator error. 

Saki has a complete line of automated inspection 

equipment, including 2D and 3D 

AOI, 2D bottom-side AOI, 3D SPI, and 3D 

AXI. Built on the foundation of Quality 

Driven Production (QDP) which is based 

on quality, reliability, consistency, and ease 

of use, Saki’s systems are used to inspect 

electronic assemblies that operate 

in high-reliability environments like medical, 

automotive, military, and aerospace 

where failure is not an option. 

QDP has propelled Saki to be a leader in 

machine-to-machine (M2M) communication, 

the Smart Factory, and Industry 4.0. 

Saki has established relationships with 

many of the leading companies in the 

electronics assembly industry and was the 

first company to receive Panasonic APC- 

MFB2 certification for all its 3D AOI and 

SPI systems. Other partnerships include 

Fuji Machine Manufacturing’s Smart 

Factory with Nexim, the ASYS PULSE 

community, Cogiscan, Ersa, and more. Saki 

adheres to the standards set forth by the 

SMT equipment communication protocol 

standardization subcommittee (JARA), the 

Hermes Standard, and CFX. 

One Of The Fastest Machine In The Market 

QDP improves inspection process stability, 

maximizes line first-pass yield, minimizes 

operating and quality-related costs, 

and provides full traceability of the inspection 

process. Additionally, Saki is focusing 

on having the same software platform 

for all Saki inspection systems to facilitate 

user operation and programming. 

A rigid frame and proprietary software ensure 

that the vertical axes are parallel and 

keep the system running smoothly in order 

to minimize wear of parts, maximize 

the equipment’s lifetime, and reduce cost 

of operation. Tests prove that Saki’s systems 

maintain position accuracy after 

hours of continuous operation. This is essential 

for M2M communication because 

it ensures that the data and information 

communicated to third party systems are 

valid and accurate. 

Saki’s 3D AOI and SPI systems are some of 

the fastest and most accurate 3D inspection 

and measurement systems in the 

world. They offer a choice of three resolutions—7μm, 

12μm, and 18μm—and come 

in both single and dual lanes with platforms 

that handle board sizes up to 

870mm width and inspect and measure 

components up to 25mm in height with 

1μm resolution, practically eliminating escapes 

and false calls. An optical head and 

6-stage ring lighting provide seamless illumination 

for all types of components, side 

cameras provide multiple vision angles, 

and circular lighting gives consistent illumination 

throughout the field of view. The 

system captures extremely clear, detailed 

images with no shadowing for inspection 

of the most challenging defects, such as 

non-wetting solder, lifted leads, tombstones, 

reverses, and height variations. 

To ensure PCB quality after dip, selective, 

and wave soldering and to completely automate 

bottom-side inspection including 

pin through-hole fillets, Saki introduced its 

2D bottom-side AOI system. Fast, cost-effective, 

and eliminating PCB flipping and 

manual handling, it uses proprietary 2D 

high-speed imaging technology to scan an 

entire 460x510mm PCBA in many kinds of 

lighting, in one pass, while inspecting the 

board on-the-fly. 


Advertorial 

CONTACT 

Hisami Ide 

Saki Corporation Head Quarter 

global-marketing@sakicorp.com 

Ikumi Sugawara 

Saki Europe GmbH 

sales.eu@sakicorp.com 

Satoshi Ohtake 

Saki America, Inc. 

ohtake.satoshi@sakicorp.com 

Andy Zhang 

Saki Shanghai Co., Ltd. 

andy.zhang@sakicorp.com 

Proven 3D Measurement System In The Market 

Saki’s 3D AXI system is the most accurate 

AXI system available. Defects are identified 

and classified, including 100% of 

head-in-pillow defects, voids, and dry 

joints, and enabling land grid array (LGA) 

inspection and measurement. It has been 

chosen as one of the best systems to identify 

voids inside the solder joints of insulated 

gate bipolar transistor (IGBT) modules, 

which is especially important in the 

automotive industry. 

Saki‘s Inspection Systems Reduces Cost And Improves Efficiency 

Saki Corporation has a global network of 

sales and support covering 50 countries. 

Headquartered in Tokyo Japan, there are 3 

research and development centers and 16 

direct branch offices in Japan, China, the 

Czech Republic, Germany, Korea, Mexico, 

Singapore, Thailand, India and the United 

States. 

Saki‘s Quality Driven Production 

Jayson Moy 

Saki Asia Pacific Pte Ltd 

moy.jayson@sakicorp.com 

www.sakiglobal.com 

Saki Corporation was started in 1994 to 

solve the challenge of SMT inspection of 

printed circuit board assemblies (PCBA) in 

electronics manufacturing for the Sony 

Walkman. The result was Saki’s line-scan 

technology, the first technology to rapidly 

capture a PCBA in one pass with a seamless 

image. The advantages and applications 

of line-scan technology are still being 

implemented today as Saki continues to be 

a leading innovator of image capture, including 

high quality 3D topology image acquisition. 

This expertise contributes to making 

Saki’s automated optical inspection 

(AOI) and solder paste inspection (SPI) 

systems among the best performing in the 

industry. 

www.sakicorp.com 


Saki‘s Smart Factory Solution

Advertorial 

A new platform for 

K series 3D AOI 

At the upcoming Productronica, ViTECHNOLOGY will exhibit the new 

platform which will prefigure next models of its renowned 3D AOI K series. 

The new design, only unveiled at the show, embeds a machine learning 

based technology that drastically reduces the programming time while maintaining 

the high level of performance and flexibility for which it is renowned. 

At Productronica 2019, Vi TECHNO- 

ALOGY will unveil its new 3D AOI 

platform. Visitors to the 3D AOI 

Arena will have the privilege of discovering 

the new design of the proven K series 

3D AOI, which will prefigure future models 

of the range. This new generation naturally 

integrates with other equipment from the 

Mycronic product range, clearly affirming 

its belonging to the MYPro Line concept 

designed to enable the smart factory. 

2x faster programming 

The K series 3D AOI range has been adopted 

worldwide by leading companies in 

the most demanding industries such as 

medical, aerospace, automotive and defense, 

regardless of production volumes. 

Based on a customer-centric approach, 

Vi TECHNOLOGY thrives to optimize the 

return on investment of its inspection 

equipment by reducing its total cost of 

operation and by increasing the value 

created for its customers. This has led the 

R&D department to accelerate the programming 

time by a factor of 2, by taking 

the software to a new technological level. 

Machine Learning inside 

This new platform embeds breakthrough 

algorithms based on Machine Learning 

technology, a subset of Artificial Intelligence, 

aim at automating programming 

tasks thanks to autonomous component 

recognition and assisted model creation. 

This will represent a major step forward 

for low volume/high mix EMSs with a 

high pace of new product introduction. In 

practice, it will only take a few clicks to 

program the inspection of a completely 

new board with thousands of components. 

These new features will be available to 

K 3D AOI PLATFORM! 

existing and new K 3D customers by the 

end of 2019. 

Unrivalled reliability and flexibility 

The hood of this revamped version hides 

all the hardware and software evolutions 

recently introduced by Vi TECHNOLOGY. 

By combining its latest high-speed laser 

3D scanning head with the new Smart 

Scene Analysis algorithm, this K3D features 

an inspection time up to 50% faster 

than on previous generation. We can also 

mention the extension of the test coverage 

with foreign material detection, a 

powerful Optical Character Verification 

and a new IPC component overhang test. 

This completes a list of features already 

popular for its efficiency and flexibility, 

such as the inspection of custom components, 

or the metrological measurement 

with 10μm accuracy. The new K3D AOI 

platform will be on demo at both the 3D 

AOI Arena booth and at the Mycronic 

booth (Hall A3 #341). 

CONTACT 

Tarak Charfi joined Vi TECHNOLOGY 

as Sales Director EMEA 4 years ago. 

Tarak oversees sales for the whole Europe, 

Middle East and Africa Region. His team 

and himself will be happy to advise and 

assist you about your SMT inspection 

projects. If you are located outside Europe, 

Tarak will be able to direct you to the 

right person in our organization. 

ABOUT VI TECHNOLOGY 

Based in France in the Grenoble area, 

Vi TECHNOLOGY is a pioneer in AOI and 

SPI 3D systems, providing solutions to 

the SMT industry worldwide since the 

mid-1990s. Its equipment is operated by 

leading manufacturers in the aerospace, 

industrial, automotive and consumer electronics 

sectors, known for their high-quality 

standards, regardless of production volume 

and mix. Vi TECHNOLOGY‘s inspection 

solutions offer a unique, precise and scalable 

integrated architecture. 

As a member of the Mycronic group, 

Vi TECHNOLOGY‘s range of inspection equipment 

ideally complements the Mycronic 4.0 

intelligent factory. For more information, 

visit our website: www.vitechnology.com 

ABOUT MYCRONIC 

Mycronic AB is a Swedish high-tech company 

engaged in the development, manufacture 

and marketing of production equipment 

for the electronics industry. For more 

information, visit: www.mycronic.com 

Vi TECHNOLOGY 

Phone: +49 173 206 0510 

Email: tcharfi@vitechnology.com 


Dreaming of a zero-defect future? 

We help you get there. 

In tomorrow’s intelligent factory, product quality is fully within your control. With Vi TECHNOLOGY’s 

fleet of state-of-the-art inspection solutions, the actionable information you need to boost yield, 

quality and repeatability is never more than a few clicks away. Thanks to a combination of 

high-precision metrology and powerful process management tools, you can predict and prevent 

more defects, and get paid for more boards at the end of every day. 

Visit booth A3 341 at Productronica to learn how our fully integrated 3D SPI and AOI solutions 

help put the future in your control. 


Highly informative results with 3D AOI 

Quality from all 

perspectives 

In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established 

component of quality control. From image quality and analysis of results to the networking of 

inspection data in order to optimize production processes, the technologies used continue their 

relentless development. 

Acompany purchasing a 3D AOI 

system wants to ensure that it is 

manufacturing its electronic prod - 

ucts in the very best quality and it wants 

to guarantee they will have a long service 

life. The machine should offer superlative 

3D and software features, excellent measurement 

accuracy and exceptional image 

quality as well as a robust construction. 

An EMS (electronic manufacturing services) 

provider who is manufacturing for a 

range of customers and markets is going 

to be interested in easy programming and 

the highest level of adaptability. He wants 

to be able to cope with different products 

in large or small quantities and yet always 

be in a position to identify any manufactur - 

ing defects rapidly and without fail. When 

dealing with high volume, throughput is 

of prime importance. And if the electronic 

product is to be used, for instance, as a 

distance warning system, lane departure 

alert or a parking assistant in a motor 

vehicle, safety becomes a very important 

quality factor. 

One reason why the image quality of a 

3D AOI system is an important item in 

the priority list is that the components on 

the circuit board are continually becoming 

smaller. If you take the size 03015, for instance, 

the component is only 0.3 mm 

long and has a microscopic width of 

0.15 mm. Moreover, packing density on 

the circuit board is increasing all the time, 

where the smallest hairline bridge be - 

tween the solder joints can cause a short 

circuit. The resolution of the inspection 

system must therefore lie in the range of 

a very few micrometers, and the image 

processing must also be consistently reliable 

at very high production speeds. In 

Viscom‘s S3088 ultra gold 3D AOI system, 

for example, the XMplus sensor module, a 

very powerful frame grabber and intelligent 

control software ensure optimal results 

and inspection speeds. The image 

field size is 50 mm x 50 mm and the image 

data rate goes as high as 3.6 gigapixels 

per second. This is how inspection speeds 

of up to 65 cm² per second are achieved. 

Very precise height values 

Inspection in 3D is being increasingly 

used in practical applications and has 

proved its worth against the background 

of miniaturization, for instance in presence 

checks. Different colors of the various 

components and circuit boards are irrelevant 

in this examination step and there is 

no longer any need to adjust the lighting 

at any stage. The component is positively 

identified with the aid of a 3D grid. As for 

misalignment and coplanarity, there are, 

for instance, very strict limits with regard 

to LEDs, particularly if they are used in the 

automotive sector. The diodes must be 

precisely positioned and they must lie 

exactly flat on the circuit board within a 

very few micrometers. Staying with the 

example of the S3088 ultra gold, very 

precise height calculation is possible 

thanks to a z resolution of 0.5 μm. This can 

be used with component heights of up to 

30 mm. 

The best image information all round 

If there are any abnormalities which are 

not clearly identifiable during automatic 

defect detection, the verification station 

keeps the findings accessible for a final 

decision. A team member classifies these 

results and Viscom provides particularly 

intuitive aids to help. It is no longer neces- 

Rapid access to different views in Viscom‘s 

vVision operating software 

3D view of a circuit board section with soldered 

components 

Tombstone effect with 01005 capacitors 


Advertorial 

Viscom‘s 3D AOI system S3088 ultra gold features an impressive sensor system 

for maximum throughput 

CONTACT: 

Florian Martin is head of product devel - 

opment at Viscom AG, where he is 

responsible for the success of the optical 

inspection systems now used around 

the globe for reliable defect detection in 

the production of electronic assemblies. 

Using his experience, he works with 

external partners on various futureoriented 

issues, particularly in the field 

of digitalization. 

sary for dodgy circuit boards to be re - 

moved from the line and assessed manually. 

Instead, informative color images of 

critical parts viewed from different angles 

are available on the screen. Edge enhance - 

ment, zoom and gamma correction make 

the inspection easier. The microscope is 

practically superfluous. 

The ability to examine relevant areas in 3D 

from freely selectable viewing angles has 

also been developed with the verification 

station in mind. The texture in the 3D 

images exhibits no lateral inaccuracies. 

The angular cameras used by Viscom as 

standard are particularly useful for this 

purpose. 

Classification supported by AI 

A further major advantage is that today 

the verification data of several lines or sev - 

eral inspection gates can be consolidated 

at a single workstation. Manufacturing 

and classification can therefore be spatially 

completely separate from each other. 

State-of-the art verification aided by artificial 

intelligence (AI) is also gaining 

ground. The objective of this novel solu - 

Height profile with color coding of a solder joint and 

volume assessment 

tion for electronics manufacturing is to provide 

machine operators with intelligent 

assistance during classification. The idea 

is that the operator on the production line 

and a Viscom software solution based on 

artificial neural networks should combine 

forces to arrive at a completely safe and 

reliable decision. The artificial intelligence 

system learns, gains experience, and can 

increasingly be given more responsibility. 

Networking and traceability 

Inspection systems also provide important 

information to inline monitoring systems 

and the manufacturing execution 

system; they also communicate with other 

machines in the production line. If, for 

example, a potential defect is detected dur - 

ing the solder paste inspection (3D-SPI), 

the 3D AOI system S3088 ultra gold can 

be automatically instructed from there 

to take high-resolution color images with 

its cameras from all nine angles. Viscom‘s 

own proven software solutions such as 

Quality Uplink are supplemented by interfaces 

that are realized together with 

cooperation partners, for example Fuji 

Smart Factory with Nexim, the Panasonic 

iLNB solution or OIC and PULSE provided 

by ASYS. The IPC Hermes Standard is 

making headway in machine-to-machine 

communication as a modern alternative to 

the SMEMA protocol. This relatively new 

and open protocol based on TCP/IP and 

XML is independent of any manufacturer 

and Viscom is progressively integrating 

it into its systems. In the field of 

the Industrial Internet of Things (IIoT) 

Viscom has partnered with the IPC CFX 

(Connected Factory Exchange) initiative. 

COMPANY PROFILE: 

Viscom AG is one of the world‘s leading 

providers of automatic inspection systems 

for electronic assemblies. The model 

range extends from high-performance 

3D AOI systems for inspecting solder 

paste, placement and solder joints, to 

inspection systems for MID, wire bond 

and conformal coating inspections. The 

X-ray inspection area covers the complete 

bandwidth from microfocus X-ray tubes 

through offline inspection islands with 

μCT functionality, up to fully automated 3D 

in-line X-ray inspection. Viscom systems 

are leading-edge technological products 

used successfully around the globe by 

renowned companies in varied industries, 

including the automotive, electronics 

and semiconductor industries, aerospace 

technology and medical technology. 

With branch offices in Europe, Asia and 

the USA, as well as a tight network of 

representatives, Viscom is present 

around the globe. 

Viscom AG 

+49 511 94996 863 

Florian.Martin@viscom.de 



AOI Unleashed in Yamaha’s Total Line Solution 

Powerful AOI Drives Optimum 

Process Performance 

High-resolution image capture, the combined strengths of advanced 

2D and 3D algorithms, and powerful high-level communication between 

all inline machines and power management software define the 

pinnacle of today’s inline automated-inspection capabilities 

The full power of Automatic Optical Inspection (AOI) comes 

to the fore in today’s data-driven smart factories – both inhouse 

and outsource – supporting real-time diagnostics 

that quickly eliminate the causes of defects, as well as providing 

guidance for rework operators and informing continuous process 

improvement. 

AOI is most powerfully deployed after component placement as 

well as after reflow, to capture data that can show exactly where 

any problems are occurring. Leveraging the unique software 

platform shared by all machines in Yamaha’s Total Line Solution, 

inspection data combines with feeder and nozzle information 

from all YS and G5S mounters in the line. If there are problems 

such as a blocked nozzle or stencil aperture, or feeder or tape issues, 

the operator is notified immediately. The QA Options productivity 

package, part of the Yamaha Factory Tools 4.0 management 

suite, pinpoints the origin to help fix the problem quickly. 

If the operator is away from the line, the Mobile Judgement app 

sends the information to their smartphone for a quick decision 

whether to continue production if the issue is not serious, or 

halt the line and await corrective action. 

This real-time defect handling, leveraging closed-loop feedback 

of inspection data, is an extremely powerful feature that can eliminate 

the lag in troubleshooting, ultimately ensuring higher 

end-of-line yield. 

State of the Art AOI 

Yamaha’s YSi-V inspection machines come with up to 12Mpixel 

camera resolution to capture clear images of today’s smallest 

solder joints, high-density interconnects, and chip components. 

YSi-V systems offer standard and optional features for multimode 

AOI that combines the best aspects of 2D, 3D, and other 

inspection techniques including laser height checking. Highspeed 

3D inspection – now 25% faster in the latest release – can 

detect slope gradients to assess solder-joint quality and make 

accurate pass/fail contour judgements. In addition, 3D moiré 

phase-shift pattern analysis quickly identifies coplanarity problems 

and floating components that challenge ordinary 2D inspection. 

On the other hand, innovative 2D-inspection modes 

are great for isolating features such as exposed copper and, 

with full-colour camera and white illumination at various angles, 

can extract slopes quickly and effectively to analyse solder-joint 

shapes. Optional infrared lighting enables YSi-V systems 

to catch defects that visible light sources cannot distinguish. 

Such a wide range of capabilities lets users create a comprehensive 

inspection strategy to achieve reliable defect detection 

with low instances of false calls and fast tact time. 

There is also an optional four-direction angular camera that 

provides additional views of the sides of components. This feature 

provides valuable support to the operator at the repair station 

by making enlarged images and wide-area images available 

and including several built-in test routines. 

3D Solder-Paste Inspection 

Leading electronics manufacturers are also adding inline 3D 

solder-paste inspection to make high-speed, high-accuracy assessments 

that regular in-printer 2D inspection typically cannot 

provide. The Yamaha YSi-SP inline solder-paste inspection machine 

integrates fully into the Total Line Solution and measures 

surface area and height, adjusting its own focus to correct for 

board warpage. Yamaha’s hybrid 2D/3D expertise combines 2D 

contour extraction with phase-shift analysis to eliminate noise 

from captured images, thereby ensuring extremely high accuracy. 

The YSi-SP automatically loads board data and conveyor width 

and can feed back printing information and cleaning instructions 

to improve print results. In addition, bad marks are supported 

to help avoid unnecessary processes downstream. Optional 

features include ultra-high resolution to inspect solder paste for 

0201 (0.25 mm × 0.125 mm) to 03015 (0.3 mm × 0.15 mm) chips, 

as well as bonding inspection to check the integrity of dispensed 

adhesive and detection of foreign substances on the board 

surface. 

More Power for Process Improvement 

Further extending the benefits to be gained from 3D inspection 

leveraging the Yamaha Total Line Solution, Image Viewer Is a 

new tool that provides an important and powerful boost to historical 

analysis. Accessed through the new Dashboard feature 

recently introduced to the Factory Tools 4.0 software suite, 

Image Viewer helps analyse and improve processes by storing 

and organising the inspection images from any assembly. From 


Advertorial 

Controlled white lighting enhances solder-joint analysis 

Fotos: YAMAHA MOTOR EUROPE N.V 

Clear, high-resolution images are essential for process analysis 

within the history file for each unique board ID, the user can 

click directly on the defect flags to access all the images related 

to the selected location. This includes not only AOI and SPI 

images, but others such as pickup alignment images captured 

by the mounter. 

It’s yet another fast and powerful way for users to gain valuable 

insights and improve processes more quickly and efficiently. 

The YSi-V inline AOI machine integrates fully in Yamaha’s Total Line Solution 

Yamaha Motor IM SMT Section, a subdivision of Yamaha Motor Corporation, has a complete line of high-performing, compact, and flexible 

surface-mount placement machines, screen printers, flip-chip hybrid placers and dispensers, and optical inspection machines including the 

YSi-V and YSi-SPI series that leverage state of the art imaging technologies and advanced 2D and 3D inspection algorithms. Most importantly, 

inspection machines integrate fully in the Yamaha Total Line Solution to share data with screen printers, mounters, and software 

productivity tools, on a level that industry-standard interfaces cannot achieve. The result is faster, more precise diagnostics that can pinpoint 

the causes of defects and drive continuous process improvement. Customers worldwide trust the combination of Yamaha’s Total Line 

Solution, united by the Factory Tools 4.0 suite and productivity tools like QA Options and Mobile Judgement, to keep raising productivity, 

quality, and business performance. 

Company contact 

Andreas Grünewald, Application Engineer, Inspection Solutions at Yamaha supports our customers throughout Europe 

and handles training and demonstrations of our AOI systems. He has over 10 years’ experience in measuring and inspection-systems, 

including more than five years working with AOI-machines. He shares our commitment to maximise 

the value of optical inspection by delivering superior technical support for every customer. 


COVER 

3D Automated Pin Inspection is the Solution 

Ultimate improvement 

for backend 

process reliability 

The automotive safety system has gained attention in the electronics 

manufacturing sector, owing, in part, to the rapid electrification of vehicles. 

Manufacturers are introducing new safety electronics safety systems 

and solutions with a higher focus on quality, reliability, and environmental 

responsibility. Consequently, finding a harmonious balance between 

cost and quality challenges every manufacturer in this market. 


COVER 

What are some ways to resolve these issues while 

improving profit margins? One answer lies with 

defining ways to increase backend process efficiency. 

During this final stage, manufacturers typically add highvalue 

components and packages to create the final assembly. 

This is the area where the press-fit operation 

truly shines. Press-fit technology is a lead-free solderless 

electrical assembly process, whereby mechanically-compliant 

pins are “pressed” into a plated through hole (PTH) 

opening in a printed circuit board (PCB). Although this 

technology offers many advantages over soldering, it is a 

challenge to minimize defects due to typical board complexity. 

Since a single automotive defect can result in 

fatal vehicle accidents or costly recalls, it is essential for 

manufacturers to eliminate defects before products 

reach the field. Koh Young Technology designed the KY-P3 

API (Automated Pin Inspection) solution for SPF (Single 

Press-fit), C-PFT (Conventional Press-fit), and FOI (Final 

Optical Inspection) using its expertise with highly-reliable 

3D measurement innovations. 


Press-fit vs. soldering 

The industry adopted the soldering process years ago because 

it is a cost-effective, reliable method to connect 

components onto a PCB. However, the shift towards 

lead-free soldering placed a substantial economic burden 

on manufacturers. The new process requires manufacturers 

to use more expensive plastics like liquid crystal 

polymer (LCP), p-phenylene sulfide (PPS), and polyphthalamide 

(PPA) to cope with higher soldering temperature 1) . 

The press-fit connection has a failure rate of 0.005, which 

is at least ten times more reliable than soldering. As 

such, the pin-insertion machine market CAGR is forecasted 

at 4.9 percent between 2016 and 2022. It is expected 

to reach 276.7 million USD by 2022 2) . 

The KY-P3 automated pin inspection 

solution combined with KSMART software 

is designed for single press-fit, 

conventional press-fit, and final optical 

inspection. 


COVER 

Table showing reliability of different electronic assemblies according to the 

IEC 1709 3) . 


Koh Young’s KY-P3 M3 overview and close-up images. 


Need for accurate inspection 

Pin connection assembly for electronic modules often occur near 

the end of the final assembly process. Yet, if manufacturers identify 

defects at this stage, the PCB must undergo arduous rework or, in 

some cases, scrapped altogether. Therefore, manufacturers must 

accurately inspect the boards beforehand. Various testing methods 

such as manual inspection, electrical test, x-ray inspection, and 

more are available. However, some techniques are becoming obsolete 

as board complexity continues to increase. For example, manual 

inspection of a board with over 100,000 connector pins is not efficient 

and will likely allow failures to escape. Even worse, these pins 

are becoming shorter and thinner, so traditional methods cannot detect 

crushed and bent pins. Enter Automated Optical Inspection 

(AOI), which is a machine-based visual inspection process for the 

entire PCB. The camera autonomously scans the board and detects 

production faults, including critical defects (e.g., missing pins) and 

quality concerns (e.g., deviated pins, bent pins). An AOI solution is 

the best choice to achieve the assembly quality requirements. 

Various pin applications with 3D AOI capability 

Realizing the growing importance of accurate inspection, Koh Young 

has developed the KY-P3 pin inspection solution. Using its proven 

True 3D inspection innovations, the company designed the KY-P3 to 

identify defects like missing pins or pin offset, as well as co-planarity 

and position by accurately measuring the pin-to-pin pitch. Like its 

sister AOI systems, the KY-P3 uses the Koh Young patented 


KY-P3 defect 

detection 

examples. 

Missing: Defective 

when 

the pin is 

absent from 

its expected 

location. 


Dimension (Height): 

Defective when 

height dimension 

varies from the 

reference. 


Pad Overhang 

(Offset-x/y, 

Center Distance): 

Defective when 

the center point 

exceeds the programmed 

reference 

center. 


Odd Shape – 

Shoulder Coplanarity: 

Defective 

when the height 

gap between two 

shoulders is out 

of tolerance. 


COVER 

shadow-free Moiré technology to measure the z-axis profilometry 

across the entire board. The company uses the height threshold to 

extract the pin body and pin tip information. This dataset allows the 

KY-P3 to provide a reliable pin height and offset measurement with 

CAD dimensions. It simply locates the pin body accurately during 

the very first stage of the inspection process. 

Superior flexibility combined with proven accuracy 

Among the many inspection items, the KY-P3 strength is in its 

height measurement capabilities, which guarantees 0.75 percent 

accuracy for pins up to 25 mm height. When measuring pin height 

on an angled or pointed tip, the challenge is complicated compared 

to pins with the more common flat tip. The KY-P3 exercises a height 

range algorithm, which sets the minimum and maximum heights, 

and then calculates the average height. Using this height range, 

manufacturers can obtain accurate height information for sharp pin 

tips with the KY-P3. 

Sources 

1) Joakim Mattsson, Thorsten Callies, Bart Kerckhof ed. Press-Fit 

Technology. TE Connectivity, July 2014, Publication. Print. 

2) HOME › Press Releases › Pin Insertion Machine Market worth 276.7 

Million USD by 2022. (n.d.). Retrieved. 

3) Sauveplane, J. B., & Mindreci, G. C. (2016). Connector Press-Fit 

Technology for space-flight applications. ESA/ESTEC, 1–8. Retrieved 

July 20, 2018. 

Accurately extracting the pin tip translates to an accurate pin offset 

measurement. Manufacturers often use a specific distance below 

the pin tip to locate a suitable measurement plane reflecting the full 

pin length. Then, the manufacturer calculates the center point of the 

measurement plane as a reference point to measure the absolute 

and relative pin-to-pin distances. The KY-P3 helps manufacturers ensure 

maximum alignment accuracy, which is essential in producing 

high-quality PCBs. 

Increased efficiency, reduced costs 

The drive to improve profitability is constant. The synergy between 

the KY-P3 pin inspection solution and the KSMART software of the 

company allows manufacturers to improve the overall process and 

drive costs down. For example, manufacturers can track the pin-insertion 

machine performance in real-time using RTM@KSMART. The 

software module allows manufacturers to monitor and manage 

Cpk data by part, job, or fixture in real-time. Going further, 

The KY-P3 can generate a significant 

set of reliable measurement 

data to help manufacturers optimize 

the pin-insertion machine 

and adjust tolerances to meet 

customer Cpk expectations. 



COVER 

Chart showing typical calibration target results as measured by the KY-P3. 

SPC@KSMART instantly visualizes analyzed data with relevant indicators 

like yield rate, failure (NG) analysis, PPM analysis, Gage R&R, 

offset analysis, and more. The KY-P3 can generate a significant set 

of reliable measurement data to help manufacturers optimize the 

pin-insertion machine and adjust tolerances to meet customer 

Cpk expectations. Combining KSMART with the KY-P3 can help 

manufacturers accelerate productivity improvements, minimize 

ROI, and realize a Smart Factory. 

Conclusion 

The press-fit operation is becoming much more prevalent in the 

market, thanks in part to its advantages over traditional soldering 

methods. However, board complexity and shrinking pin dimensions 

make the inspection process more challenging. The industry needs 

a high-precision inspection solution to overcome these challenges. 

Koh Young, the leading 3D measurement-based inspection solutions 

provider, is delivering new levels of repeatability and accuracy 

for press-fit operations with the KY-P3. Ultimately, the KY-P3 

will “pin down” defects in the press-fit operation, while improving 

the entire process. 

productronica, Booth A2-361 + 377 

www.kohyoung.com 


Zusammenfassung 

Der Einpressvorgang gewinnt immer mehr an Bedeutung, auch 

dank seiner Vorteile gegenüber herkömmlichen Lötverfahren. Um 

die Herausforderungen Miniaturisierung sowie Komplexität zu 

bewältigen, wird eine innovative und exakte 3D-Messlösung mit 

hoher Wiederholgenauigkeit für den Einpressprozess benötigt. 

Résumé 

Le processus d‘insertion prend de plus en plus d‘importance, notamment 

grâce à ses avantages par rapport aux procédés de brasage 

conventionnels. Pour relever les défis de la miniaturisation et 

de la complexité, une solution de mesure 3D innovante et précise 

avec une grande précision de répétition est nécessaire pour l’insertion. 

Резюме 

Технология соединения методом запрессовки набирает 

популярность, в том числе благодаря своим преимуществам 

перед традиционными методами пайки. В целях соответствия 

требованиям по миниатюризации и облегчению процесса для 

соединения методом запрессовки требуется инновационное и 

высокоточное решение в области трехмерных измерений, 

обеспечивающее высокую точность повторения. 


Pin offset measurement using the KY-P3 system. 


Connecting Global Competence 

November 12–15, 2019 

Your visions. 

Our connections. 

productronica 2019. The world’s leading trade fair 

for electronics development and production. 

Accelerating Your Network. 

co-located event 


PCB + ASSEMBLY 

PCB cleaning 

Process and result assurance, 

data acquisition and traceability 

When cleaning electronic PCBs, demand is increasing for the collection of process data 

and the assurance of its traceability. This not only entails advantages for customers of 

electronics manufacturers, but also for the manufacturers themselves, who will then be 

able to improve their processes on the basis of the data raised. 

Stefan Strixner, Principal Engineer, Zestron Europe 

Sequence of a 

cleaning process 

and important 

process data for 

bath control. 

Numerous forms of process data can be recorded during a 

cleaning process. The two general parameters that can be assigned 

to each of the above-mentioned process steps are time and 

temperature. 

Producing cleaning process data 

Each process step has unique monitorable parameters: 

1. Cleaning step: 

• Chemistry type and batch number 

• Cleaner concentration on the items to be cleaned 

• Bath loading 

• Ultrasonic energy & frequency 

• Spray pressure, filter pressure, and/or differential pressure 

• Flow rate (filter loading) 

2. Rinsing step: 

• Quality of rinse water or rinsing medium (fresh water and rinsing 

tank) 

• Ultrasonic energy & frequency 

• Spray pressure, filter pressure, and/or differential pressure 

• Flow rate (filter loading) 

3. Drying step: 

• Air blowing pressure 

• Filter pressure 

• Volume flow 

• Negative pressure (with vacuum drying) 

Depending on the specific data type, a wide range of offline (manual) 

and online (automated) procedures can be used for recording 

the above-mentioned process data. Many cleaning machine manu- 

Source: Zestron Europe 

facturers have already integrated automated data gathering tools 

into their systems. However, some procedures are either very specific 

or cannot be automated. (See table on next page) 

Whilst offline methods generally suffice to provide snapshots of 

process states, a continuous process and result assurance cannot 

be guaranteed, let alone any true traceability or substrate-specific 

assignment of the process data. In addition, not all the data that can 

be collected is critical to the results so that it only makes limited 

sense to record it in its entirety. 

The most important data to be monitored is that which is subject to 

temporal variation or continuous change. The most obvious in a 

cleaning process is the concentration of cleaner, which can fluctuate 

due to over-dilution or over-concentration. 

This is not just applied to cleaners administered as concentrates 

and diluted down to a defined concentration, but also “ready to 

use” mixtures, which may also fluctuate during the process as they 

are usually composed of more than a single chemical component. 

Concentration measurement in particular is a parameter that 

requires more concern than just measuring a single value. Since 

The use of the Pulse system will reduce downtime due to its optimised task 

planning. 

Source: ASYS Group 



and monitored parameters. To improve traceability even further, it is 

also conceivable and possible to record the goods carrier, operator, 

and even the type and batch of cleaner used. This data could then 

also be used to release or block the process in case of misuse. 

Most cleaning machine manufacturers now include digital connection 

interfaces to view or export data to a hardwired or networked 

operation workstation for production line monitoring. Within the Industry 

4.0 concept, the data can then be passed on to subsequent 

processes (e.g. a coating process) triggering their release. In the 

case of PCBs for which cleaning is planned prior to coating, if the 

data indicate that they are insufficiently clean, the coating process 

will be unable to start, and an error message will be displayed instead. 


Process parameters of a 

cleaning process – Assessment 

regarding automation 

potential and relevance. 

many aqueous systems have holding tanks that see density-related 

segregation and have varying abilities to homogenize the mixture, 

there is the potential that the concentration measurement in the 

tank differs from the actual concentration level in the cleaning material. 

For measurement and tracking purposes, the actual level of 

concentration in the cleaning material is the relevant measurement 

for the cleaning process. Therefore, it is important to think about the 

nature of the process data and install measurement sensors in locations 

suitable for data capture. For measuring the cleaner concentration, 

a flow sensor in the spray circuit of a spray-in-air cleaning 

machine is preferable to a submersible sensor in the holding tank. 

By default, the recording of process-relevant parameters is used for 

the alarm display or a process interruption, whenever these surpass 

the set thresholds. Even if little used in practice, data recording is 

also useful for process control. Here, for example, the parameters 

temperature and cleaner concentration should be mentioned. For 

example, monitoring the cleaning temperature is often used simultaneously 

to control itself, so that any undershooting or overshooting 

of the switching on-and-off of the media heating process can be 

controlled. Online monitoring of the cleaner concentration can also 

be coupled with a dosing system for the cleaner concentrate and 

the water, in order to ensure that the working concentration always 

remains constant. 

Improving traceability 

As already mentioned, most of the measuring methods mentioned 

are already included as standard in many cleaning machines or are 

at least relatively easy to integrate where this is desired. However, 

traceability of the prevailing process conditions with respect to the 

cleaned substrates is still absent at this point. Nevertheless, there is 

a clear trend towards realising that this is becoming an increasingly 

important feature and is being offered as an option by more and 

more equipment manufacturers. At the core of such a traceability 

concept is the scanner-based acquisition of items marked with a 

barcode or QR code, as well as their assignment to the selected 

Statement 

There is a broad range of monitorable process parameters that can 

be recorded and traced using standard or optional hardware. When 

implementing a process, carefully consider which variables are truly 

relevant for operability and traceability, and use these to control the 

process. 

Exported data can connect to and trigger follow-up processes, 

though lack of standardization of data formatting can complicate this 

and represents, in this context, one of the greatest challenges 

facing the market. 

Also, as far as the feedback of information from the steps downstream 

of the cleaning, such as the offline cleanliness checks or reliability 

data, etc., serving as the completion of the feedback control 

loop of the cleaning process (e.g. information on upcoming cleaner 

or filter changes at elevated residual contamination levels), optimisations 

can still be envisaged. 


www.zestron.com 


Bei der Reinigung elektronischer Baugruppen steigt die Nachfrage 

nach der Prozessdaten-Erfassung sowie der Sicherstellung ihrer 

Rückverfolgbarkeit. Dies bringt Vorteile für die Kunden der Elektronikhersteller 

und auch für die Hersteller selbst, die dann auf Basis 

der erhobenen Daten ihre Prozesse verbessern können. 

Résumé 

Dans le domaine du nettoyage des composants électroniques, la 

demande ne cesse de croître en termes d‘acquisition de données 

process et de traçabilité. Les clients des fabricants d‘électronique 

mais aussi les fabricants eux-mêmes peuvent ainsi améliorer leurs 

processus sur la base des données collectées et en tirer des avantages 

majeurs. 

Резюме 

В сфере очистки электронных узлов возрастает потребность в 

системах сбора и отслеживания технологических данных. Это 

выгодно как заказчикам производителей электроники, так и 

самим производителям, которые на основе собранных данных 

могут совершенствовать свои процессы. 



Prerequisites for staying competitive 

Selective soldering of 

challenging components 

The selective soldering process has evolved to become a standard production process within the 

electronics assembly industry, and now accommodates a wide variety of through-hole component 

formats in numerous applications. Most through-hole components can be easily soldered 

with this process; however, some types of challenging components require additional attention to 

ensure optimum process control is maintained. 

Bob Klenke, Technical Consultant, Nordson Select 

Numerous high thermal mass components place demands on 

the selective soldering process, while the use of specialized 

fixtures and pallets often places an additional thermal demand on 

the preheating process. Fine-pitch through-hole components and 

connectors place a different set of demands on the selective soldering 

process and require special attention to lead projection and traverse 

speed to minimize bridging between adjacent pins. 

Dual in-line memory module (DIMM) connectors, compact peripheral 

component interface (cPCI) connectors, coax connectors and 

other high thermal mass components as well as fine-pitch microconnectors 

can present challenges when soldered into backplanes 

or multilayer printed circuit board assemblies. Adding to this challenge, 

cPCI connectors can present additional solderability issues 

due to their beryllium copper termination pins. 

Choosing a flux 

Liquid fluxes for selective soldering are available in many types including 

alcohol-based fluxes, water-soluble fluxes, rosin-based 

fluxes, low pH fluxes and fluxes with high solids content. The selection 

of a particular type is generally specified for the end application 

of the product and is critical regarding the resulting solder joint integrity. 

Flux chemistry selection criteria should be based on the solderability 

of the base metal surfaces being soldered. Base metals that are 

easy to solder, including platinum gold, copper, tin-silver or palladium 

silver, can typically be soldered with either a no-clean flux, a 

non-activated rosin flux or a mildly activated rosin flux. Ones that 

are not as easy to solder, such as beryllium copper, require either a 

fully activated rosin flux, a water-soluble organic flux or a water-soluble 

inorganic flux, with these latter flux types requiring post-soldering 

cleaning of the board assembly. 

Process control essentials 

It is known that liquid flux must be present and active in order to 

clean and protect solderable surfaces before they encounter liquidous 

solder flowing from a selective soldering nozzle. Since the func- 

Source: Nordson Select 

X-ray image of 132-pin 

cPCI connector plated 

through-hole fill mounted 

in HDI board assembly. 



Multiple 240-pin dual in-line memory module (DIMM) connectors mounted in 

22-layer printed circuit board assembly. 

tion of a liquid flux is to raise the energy level and promote wetting 

of the solderable surfaces, proper thermal activation is essential to 

dry the flux vehicle and activate the flux solids. High melting point 

solder alloys require robust fluxes capable of surviving higher preheating 

temperatures needed for these specialty high melting point 

alloys. 

Preheating is required to ensure proper thermal activation of a given 

liquid flux chemistry with the thermal aspects of flux activation, 

such that the topside temperature of a PCB at the end of the preheating 

cycle is generally specified for proper condition of specific 

flux type. The total heat cycle consists of the preheat time and temperature 

as well as the dwell and contact time with the liquidous 

solder. This time-temperature profile is affected by the thermal 

mass differential of the PCB assembly, as well as the rate of heat 

dissipation of high thermal mass components or fixtures and/or 

solder pallets. 

When selective soldering high thermal mass board assemblies, the 

solder nozzle alone is not always a sufficient heat source to overcome 

the thermal mass of large through-hole component leads 

without preheating the board. Topside and bottom-side preheating 

in combination with sustained preheating may be required for 

boards with high thermal mass through-hole components in order 

to achieve Class 3 topside fillets. 

Flux migration often occurs since flux spread is influenced by the 

surface tension and temperature of the board. Alcohol-based fluxes 

have a lower surface tension than water-based fluxes while waterbased 

fluxes spread more rapidly as alcohol-based fluxes tend to 

dry faster. While drop-jet fluxing produces a narrow spray pattern 

compared to aerosol spray heads with minimal deflection of flux 

droplets, flux satellites can occur and should be mitigated. They will 

not be directly exposed to liquidous solder and can result in iconic 

contamination and potential electro-migration issues, if the board 

assembly has to function in a high humidity product environment. 


Design considerations 

Design for manufacturing and assembly (DFMA) is defined as designing 

a product to be produced in the most efficient manner possible 

in terms of cost, resources, and time, taking into consideration 

how the product will be processed, utilizing the existing skill base 

and minimizing the learning curve, to achieve the highest yields attainable. 

DFMA is a major concern since many PCB assemblies are designed 

by those who have little manufacturing experience. This is especially 

true for original equipment manufacturers who operate in a virtual 

manufacturing business model, designing, marketing and selling 

electronic products while outsourcing the manufacturing to external 

parties. 

With respect to selective soldering of challenging through-hole 

components, it is recommended that design guideline attention be 

given to adjacent component clearance, lead-to-hole aspect ratio, 

lead projection and thermal reliefs. Adjacent component clearance, 

or the distance between a though-hole pad and an adjacent SMT 

pad, is key since under most conditions it is essential the selective 

soldering nozzle be allowed to over-travel the last rows of component 

pins to prevent bridging. 

Proper consideration should be given to lead-to-hole aspect ratio to 

ensure complete vertical hole fill of through-hole components. An 

accepted best practice allows for a maximum aspect ratio of 1.5:1.0 

of the plated through-hole (PTH) diameter verses the component 

pin diameter. It is also imperative that consideration be given to 

component lead projection to prevent bridging between adjacent 

though-hole solder joints. The maximum lead projection should be 

equal to, or less than, one-half the pitch between adjacent throughhole 

components leads. 

Thermal relief design elements should also be incorporated into 

PCBs, whenever high thermal mass through-hole components in 

combination with heavy ground planes are employed. Recommended 

thermal relief design guidelines should include: inside diameter 

= drilled hole size plus 2x annular ring, outside diameter = 

inside diameter plus 0.5 mm, spoke width = 0.02 mm minimum, 

0.4 mm preferred, and rotate thermal reliefs of alternate layers in 

multilayer boards by 45 degrees to minimize internal board stress in 

the Z-axis direction. 

Challenging components 

Among the many different types of challenging components are 

1.0mm pitch staggered row dual in-line memory module (DIMM) 

connectors, particularly when soldered into multilayer PCBs with 

heavy ground planes. Attention should be given to lead projection 

and solder nozzle traverse speed to minimize solder bridging of 

these connectors. 

Another challenging component is the 2.0 mm pitch six row compact 

peripheral component interface (cPCI) connector that requires 

special attention due to the solderability issues of its beryllium 

copper base metal and gold-plated pins. Since these connectors are 

often mounted in high density interface (HDI) boards, or into heavy 

backplanes, they are often held in place with specialized fixtures or 

pallets which places an additional thermal demand on the selective 

soldering preheating process. 

Other high thermal mass components, including coax connectors 

and ceramic pin grid array (PGA) devices commonly used in military 

and aerospace applications, can place additional demands on the 

preheating process if sustained preheating is not employed. Finepitch 

through-hole components, such as 1.27 mm and 1.0 mm pitch 



Solderability test results of 

through-hole component leads 

before and after re-tinning. 

micro-connectors, place a different set of demands on the selective 

soldering process and typically require special attention to lead projection 

and traverse speed to minimize bridging between adjacent 

pins. Ribbon connectors with a pitch of 1.27 mm, and as fine as 

0.5 mm, can be selectively soldered with the assistance of a nitrogen 

de-bridging knife. 

Mitigation of gold embrittlement 

Immersion gold over a copper base metal is highly resistant to the 

effects of corrosion since gold does not oxidize and provides a protective 

layer with a highly solderable surface that is bondable for 

both gold and aluminum bonding wires. However, since gold melts 

at a relatively low temperature, it can result in gold embrittlement 

when combined with other metals to form a solder joint. 

As the gold plating dissolves rapidly during soldering, the remnant 

gold within a solder joint can weaken the integrity of the interconnection. 

If this gold dissolution is excessive during the solder alloy’s 

liquidous phase formation, the composition and mechanical properties 

of the solder joint will change. Gold embrittlement within tinlead 

(SnPb) solder joints is a well-known failure mechanism. Leadfree 

solder alloys such as SAC305 are more capable of maintaining 

mechanical properties when combined with gold partially due to its 

additional tin content, however lead-free solder joints will also degrade 

with increased gold content. 

Beginning with the IPC J-STD-001 Rev F requirements in 2014, and 

continuing with the current Rev G, it has been stated that gold shall 

be removed from: at least 95 % of the surfaces to be soldered of 

through-hole component leads with 2.54 μm or more of gold thickness, 

from 95 % of all surfaces to be soldered of surface mount 

components regardless of gold thickness, and from the surfaces to 

be soldered of solder terminals plated with 2.54 μm or more of gold 

thickness. With this, gold removal is therefore required for all highreliability 

Class 2 and Class 3 electronic products. 

The removal of gold plating from component leads can be facilitated 

by a pre-tinning process which removes the gold as it is solubilized 

in the molten solder during the re-tinning process. A double tinning 

process or dynamic solder wave may be used for gold removal prior 

to soldering the components into a board assembly, as improper removal 

on leads and terminations prior to board level assembly can 

result in solder cracks and/or field failures. 


Solderability testing 

The wetting balance tester, also known as a meniscograph, is an instrument 

used to access component solderability. This test method 

uses a strain gage to measure the buoyancy of a component lead 

when immersed into a bath of molten solder. The resulting force 

verses time wetting curves measures solderability with component 

leads having good solderability exhibiting rapid buoyancy, and oxidized 

or un-solderable leads displaying slow buoyancy, or retarded 

wetting. 

Through-hole and surface mount components that exhibit poor solderability 

can be reconditioned using a component re-tinning procedure 

after which a major improvement in solderability can be confirmed, 

since an improved intermetallic is achieved during the component 

re-tinning process. 

Legacy components used for end-of-life (EOL) product builds, may 

be decades old having been stored in uncontrolled conditions leaving 

them generally oxidized with poor solderability, which can result 

in poor quality solder joints. Refurbishing these components will replace 

oxidized, plated finishes that are deemed un-solderable with 

an intermetallic homogeneous finish that is impervious to oxide 

growth and will mitigate possible tin whisker growth. 

Conclusion 

Solderability is no longer an option for many high reliability segments 

of the global electronics assembly industry. With implementation 

of the recent Rev G of IPC J-STD-001, solderability testing, 

gold removal and component re-tinning have become prerequisites 

for doing business and remaining competitive in the global electronics 

marketplace. 


www.nordsonselect.com 


THT-Bauteile können mit dem Selektivlötprozess leicht gelötet werden; 

einige Arten von anspruchsvollen Bauelementen erfordern 

jedoch zusätzliche Aufmerksamkeit, um eine optimale Prozesskontrolle 

zu gewährleisten, wie der Artikel zeigt. 

Résumé 

Les composants THT peuvent être facilement soudés à l‘aide du 

procédé de brasage sélectif, mais certains types de composants 

plus exigeants nécessitent une attention supplémentaire pour assurer 

un contrôle optimal du processus, comme le montre l‘article. 

Резюме 

Компоненты для сквозного монтажа в отверстия (THT) можно 

легко паять с использованием метода селективной пайки, 

однако некоторые типы особенно чувствительных 

компонентов требуют дополнительного внимания при 

осуществлении контроля процесса. Этому и посвящена данная 

статья. 


PRODUCT UPDATES 


Seho to show innovations at productronica 

Seho Systems GmbH, a manufacturer 

of complete solutions 

for soldering processes and 

automated production lines, will 

exhibit at productronica. They 

will showcase innovative features 

for its product range. The 

new functions are designed to 

bring process reliability to a 

higher level and further improve 

production sequences in electronic 

manufacturing. 

After the successful introduction 

of the preheat option for 

wave soldering systems using 

pulsar emitters that allow costefficient 

production from a lot 

size of one up to large series, 

the soldering area has been 

further optimized. 

An automatic nozzle height adjustment 

system has been developed 

for the MWS 2300 

wave soldering system that 

allows the optimal distance between 

a PCB and the nozzles. 

The system operates independently 

from the carrier design, 

without negative influence on 

cycle time. The first automatic 

wave height measurement system 

will also be introduced, 

which will be integrated in the 

soldering area of the MWS 

2300. Based on the measuring 

results, the wave height is automatically 

regulated within adjustable 

tolerances. The system 

ensures the same height across 

the wave width at all times. 

Seho will show for the first 

time, the THT AOI system 

PowerVision in a configuration 

designed for in-line use with 

wave soldering systems. It can 

be configured depending on the 

requirements. In Munich, the 

system will be installed in front 

of the MWS 2300 and will be 

equipped with an automatic 

placement control at assembly 

belt level. At the return conveyor 

level, an automatic solder 

joint inspection unit will be integrated 

to test soldered assemblies 

for typical defects, 

such as insufficient solder 

joints. Both systems are independent 

from each other and 

are integrated into the same 

module to save space. 

When it comes to the increased 

requirements for the production 

of LED technology, 5G antennas 

and other products, an innovation 

for the SelectLine selective 

soldering system provides 

the solution. This feature allows 

processing of long assemblies 

while they are passing through 

the system with automatically 

optimized cycle time. 

With the aim to make the production 

process more efficient, 

the range of automation solutions 

of the Streamline product 

line has been extended. This 

ranges from board handling 

with conveyor systems, paternoster 

and buffer stations, turn 

and lift stations, to transfer 

stations and ergonomically designed 

work places. 

productronica, Booth A4–578 

www.seho.de 

Active tip technology 

Features a built-in sensor and perfect heat transfer, for the 

fastest heat-up and recovery time. Reduce your downtime 

for a faster workflow and better results. 

Patented tip and grip design 

Fast and hassle-free tip changing without needing any tool. 

One intelligent WX platform 

Run any active tip from one WX station, meeting all 

operational hand soldering needs such as motion 

sensing or traceability with digital data storage in 

the soldering tool and station. 

Precise control, ergonomic grip 

The boomerang handle design allows for precise handling 

while providing an ergonomic and secure grip. 

November 12 – 15, 2019, 

Messe München 

hall A4, stand 241 

Seho will showcase the THT AOI 

system PowerVision in a configuration 

designed for in-line use with 

wave soldering systems, which 

will be equipped with an automatic 

placement control at assembly 

belt level. 

Source: Seho Systems GmbH 

Learn more at: 

weller-tools.com/nocompromise/ 



Removing contamination to enhance performance 

Cleaning for PCB reliability 

Today’s PCBA (printed circuit board assembly) customers are requiring 

maximum performance from miniature-sized printed circuit boards. Their 

growing demand for smaller electronics assemblies is forcing manufacturers 

to squeeze even more micro components onto each PCBA. This transition 

to tinier, denser boards is making circuit board cleaning more difficult 

and is sometimes leading to reliability issues. If not properly cleaned, contaminated 

PCBAs can fail in the field, resulting in malfunctioning devices, 

extensive product recalls and costly warranty replacements. 

Emily Peck, Senior Chemist, MicroCare Corporation 

an issue. However, for other more long-lived devices, like a fetal 

monitor, an electric train motor, or an elevator controller, the possibility 

of a failure is more of a concern. 

White residue is a common PCB contaminant. 

Some complex, modern PCBAs are used in critical applications 

where failure is not an option. They need to work reliably each 

and every time without exception. These PCBAs are typically used 

in products that must endure a long, hard life under harsh circumstances. 

This includes prolonged exposure to humidity, constant vibration, 

or extreme temperatures and climates. For instance, GPS 

satellites, air bag sensors and heart pacemakers all operate under 

extreme conditions and rely on flawlessly performing PCBAs to help 

them operate perfectly. If they don’t work, then something very expensive, 

very bad or maybe very deadly could possibly happen. 

Time-delayed failures 

PCBAs are often used in applications where replacing the PCBAs 

can be difficult or nearly impossible. For instance, an underground 

traffic light controller, a space station communication system, or a 

cochlear implant all require major time, effort or sacrifice to access. 

Therefore, it is critical that the PCBAs inside these devices work 

long-term, and continue to work, without interruption, indefinitely. 

Unfortunately, some failures are intermittent in nature and may not 

be immediately revealed during initial testing. Even under normal 

working conditions, some PCBA defects may not appear until a year 

or more later. In some instances, the products affected, like mobile 

phones, are replaced often enough (every 2 or 3 years), so it is not 


Cleaning enhances reliability 

Contamination is one of the primary causes of PCBA field malfunctions. 

Dirty PCBAs are vulnerable to a number of problems including 

parasitic leakage, electrochemical migration, delamination, dendrite 

growth and shorting. 

Modern PCBAs are small and densely packed with bottom termination 

components, such as BGAs, CSPs, MLFs, QFNs, and 

D-Paks. This poses a cleaning challenge since it is difficult to clean 

under and around these tightly-spaced components. The reduction 

in pitch between conductors collects and traps contaminants like 

solder balls under them, making cleaning even more complicated. 

In some instances, active fluxes or flux residue may stay on the 

PCBA after reflow in wave machines or after hand-soldering. In addition, 

other contaminants like ink and fingerprints need to be removed 

for optimal circuit board reliability. 

One of the most common types of PCBA contamination directly impacting 

PCBA performance is flux residue, especially from no clean 

fluxes. When the salt activators in the fluxes come in contact with 

heat or other chemicals, they leave behind a white residue that may 

corrode fragile circuits and enable dendrite growth. This can potentially 

create noise on the board, interfering with signal transmission, 

especially on high-voltage systems. Therefore, it is essential to thoroughly 

clean PCBAs prior to subsequent coating or final packaging. 

Three ways to clean 

There are three common ways to clean PCBAs. In-line aqueous 

cleaning, vapor degreasing and benchtop scrubbing. No matter 

which method used, it is imperative that the PCBAs come out clean 

and dry to ensure optimum performance, functionality and reliability 

while increasing the lifespan of the devices they occupy. 

In-line aqueous cleaning 

Aqueous PCBA cleaning uses deionized water and a detergent in a 

series of washing and rinsing cycles in large machines. A second 

operation, using heat or air, dries the PCBAs. Aqueous systems are 

considered by many to be environmentally friendly however, they 

do require continuous water monitoring and stringent waste water 

management. 


CONTACT 

TECHNOLOGIES 

AT THE 

HIGHEST 

LEVEL 

PCBs cleaned in a vapor degreaser come out clean, dry and cool. 


Vapor degreasing 

Vapor degreasing uses an environmentally sustainable cleaning 

fluid, instead of water, inside a vapor degreaser to batch clean parts. 

Each batch of PCBAs comes out clean, dry and cool enough for immediate 

coating or packaging. Vapor degreasers recycle and reuse 

the cleaning fluid for hundreds of hours before the fluid needs to be 

refreshed, saving on fluid costs and making the cleaning environmentally 

sound. 

Benchtop cleaning 

Sometimes manufacturers have to build circuit boards with a skip in 

their pick and place machine due to a missing surface mount component 

and will hand-solder the missing component onto the PCBA 

later. Other times, there may be a fragile or moisture-sensitive component 

that can only be hand-soldered in place after the initial PCB 

cleaning to prevent damaging the component. 

In either instance, the selectively soldered PCBAs usually undergo a 

secondary hand cleaning at the benchtop using an aerosol flux remover 

and a brush. Successful secondary benchtop cleaning is de- 

Singapore Downtown, 

Contact Probes and 

Probe Card ViProbe®. 

Best Contacts Worldwide. 


Die steigende Komplexität und Miniaturisierung der Baugruppen 

erschwert die Leiterplattenreinigung zusehends und kann zu Zuverlässigkeitsproblemen 

führen. Der Artikel stellt drei gängige Methoden 

zur Reinigung vor, um Produktrückrufe auszuschließen. 

Résumé 

La complexité et la miniaturisation croissantes des composants 

rendent le nettoyage des circuits imprimés de plus en plus difficile 

et peuvent entraîner des problèmes de fiabilité. L‘article présente 

trois méthodes de nettoyage courantes pour exclure les rappels de 

produits. 

Резюме 

Тенденция к усложнению и миниатюризации компонентов 

делает очистку печатных плат все более сложной и может 

приводить к проблемам с надежностью. В статье 

рассматриваются три распространенных способа очистки, 

которые позволят избежать отзыва продукции. 

Yamaha True Total Line Solution is the industry leading portfolio in the 

market for entry level, high-mix low/medium-volume up to high-mix high-volume 

and ultra-mass production. 

The Yamaha Intelligent Factory Solutions offer the most complete software solution 

for Industry 4.0. 

In the Yamaha Intelligent Factory we focus on the 4M connection by digital technology 

inside electronics manufacturing: MACHINE – MATERIAL – HUMAN – METHOD. 

Maximize line productivity & factory efficiency with 4 x M2M connections: 

Machine to Machine, Material to Machine, Method to Machine 

and Machine to Human. 

www.yamaha-motor-im.eu 

VISIT 

US! 

12. – 15.11.2019, Munich, Germany 

Get your free visitor ticket 

EPP Code: EUROPE Yamaha_prod19 November 2019 67 

HALL A3, STAND 323 

www.productronica.com


A dispensing system helps eliminate waste. 


pendent upon two factors: properly trained operators and good 

tools. 

Ideally, the PCBAs are selectively soldered without an overabundance 

of flux. This improves the chance that all the flux is completely 

heated and deactivated, leaving as little residue on the board 

as possible. Less residue makes the boards easier to clean. Typically, 

well-trained operators choose to clean the entire selectively 

soldered board, not just the hand soldered area. This ensures the 

whole board is contaminant-free, including under the components 

adjacent to the hand soldered area, where the soluble flux might 

have traveled. 

Wet, scrub, rinse, dry 

To successfully remove flux residue and other contaminants from 

PCBAs manually, well-trained operators use the four-step process of 

wet, scrub, rinse and dry. Wet the board with a pure cleaning fluid. 

Scrub it using a good quality scrubbing brush. Rinse it off with more 

clean fluid. Finally, dry the cleaning fluid with a lint-free wipe, a highquality 

air duster, or a combination of both. Hand cleaning a PCBA 

using the four-step process is effective because it allows the operator 

to adjust the amount of cleaning fluid delivered, how much 

scrubbing and rinsing takes place, and how well the boards are 

dried. 

Eliminate waste, improve safety 

Since many operators clean the entire PCBA after secondary soldering, 

it is important for them to control the amount of cleaning fluid 

used. Adding a cleaning fluid dispensing system to their process 

helps eliminate waste and improves worker safety. Mounting a fluid 

dispensing system onto an aerosol can of flux remover is fast and 

simple. It replaces old-style pump bottles and brushes, and keeps 

the flux remover fluid fresh and pure for each use. The cleaning 

power of the flux remover is amplified by the mechanical scrubbing 

action of the brushes. A secondary shot of the flux remover thoroughly 

rinses and washes away contaminants so they are not left 

on the board. 

As PCBs get smaller, they are more difficult to clean. 

The dispensing system controls the flow and volume of the fluid to 

deliver the right amount to wet the PCBA completely, but without 

overspray or waste. The dispensing system allows operators to use 

50–60 % less fluid, cutting cleaning costs. Plus, the dispensing system 

helps limit the operators’ exposure to the flux remover by reducing 

fumes and minimizing the odor. 

For benchtop cleaning effectiveness and safety, a cleaning fluid dispensing 

system is a simple, yet effective way to help protect 

workers and deliver consistently clean circuit boards for long life and 

optimum reliability. 

Ask for help 

As the trend in circuit board miniaturization continues, complexity 

and high density cause a greater likelihood for cleaning challenges 

and reliability problems. If the PCBAs are not properly cleaned, the 

contamination left behind may result in unpredictable performance, 

costly board failures, and product recalls. Therefore, it is imperative 

that PCBAs are perfectly clean and dry for the best dependability 

and performance. 

No matter what cleaning method used, it is recommended that 

PCBA manufacturers work with a critical cleaning partner that 

specializes in PCBA cleaning fluids. They can help choose the best 

cleaning process and cleaning fluids to deliver quality cleaning results 

along with the PCBA performance, reliability, and longevity 

they expect. 


www.microcare.com 



PRODUCTRONICA 2019 

12 – 15 November, Hall A3 / Stand 316 

Mastering electronics 

automation 

Make the switch to consistent output. 

From processing through assembly & test to final packaging. Stäubli’s range 

of clean, consistent high performance Robots provide flexible manu facturing 

solutions, even in the most sensitive electronic environments. 

Stäubli – Experts in Man and Machine 

www.staubli.com 

Stäubli Tec-Systems GmbH, Tel. +49 (0) 921 883 0, sales.robot@staubli.com 



Telux location in Trebatice, Slovakia. 

All about automation 

Pushing production with high 

quality and flexibility 

Shortly after its foundation in 1994 in Pieštany, Slovakia, Telux started with the production of electrical 

ballasts with power ratings from 9 to 72 W. Eleven years later, the company started SMT production 

by upgrading its machinery and then moved to a new location in Trebatice in 2010. Due to continuous 

growth, the next technology update was due five years ago – that is when system supplier Ersa came 

into play, who since then has supported the Telux business a variety of soldering technology – including 

selective soldering technology and stencil printing. 

INFO 

Telux Electronics for different environments: 

• Explosion-proof equipment for the mining industry 

• Railroads 

• Dental equipment and dental chairs 

• Dental and medical compressors 

• Automation 

• Lighting engineering 

Bratislava, High Tatras and Petra Vlhová (2019 Giant Slalom World 

Champion) – Slovakia could be reduced to this triad. But this 

would not do justice to the Central European landlocked state with 

its approximately 5.5 million inhabitants, created on January 1, 1993 

after the peaceful division of Czechoslovakia. After the end of the 

socialist ČSSR, the young Slovakia quickly acquired an excellent 

economic reputation, which was politically accompanied by membership 

in the European Union and NATO (2004), the abolition of 

border controls with EU states in accordance with the Schengen 

Agreement (2007) and entry into the Eurozone in 2009. Industrial 

focal points of Slovakia, which is strongly export-oriented, include 

the diversified automotive industry, mechanical engineering, metal 

processing and electronics. 

In the period of upheaval in the 1990s, Jozef Sadlek founded his 

electronics manufacturing company, TE-VEV, in 1994 with initially fifteen 

employees. The engineer, who had studied radio and television 

technology at the Technical University of Bratislava, found premises 

in an industrial area in Pieštany, 90 km from the metropolis of Bratislava. 

Initially, the business consisted of manual soldering and assembly. 

After five years, the company was so well established as an 

EMS service provider that it became more visible to potential customers 

– it changed its name to the handier Telux. With the acquisition 

of the first pick & place machine, business picked up considerably, 

and in 2005 the first SMT line was installed, increasing sales 

year after year. Production was becoming increasingly cramped, so 

that Jozef Sadlek, after careful consideration, decided to build a new 

plant in nearby Trebatice – also in order to process the incoming 

orders on time and in the required quality. The move to the new location 

with a production area of 1,260 m 2 was completed in 2010, 

the will for further growth had a visible and tangible counterpart – 

the basis for a real leap in sales was starting: in 2011, the company 

recorded a full growth of 67 percent. 

High quality, high productivity, high flexibility 

With continuously increasing sales within the following years, the 

next technology update became imperative five years ago – in 2014, 

Ersa system supplier came to the fore. With 40 employees, Telux 

mainly produces customer-specific industrial electronics, while its 

customers come from the railway technology, mining, dental and 

medical technology sectors. 60 percent of production goes to the 

Slovakian market, to the Czech Republic, components for mining 

and explosion-protected assemblies. Other interesting customers 

are also located in Germany, including the Adam Hall Group for professional 

music equipment based in Neu-Anspach in Hesse. 

Wherever the components are used, high-quality standards are applied, 

which made it clear that only top soldering systems that are 

able to produce at this level could be considered. The company assembles 

around 700 different types of printed circuit boards– with 

individual lot sizes from 50 to 2,000 pieces. On some days, the production 

program has to be changed twice a day – unlike with some 


Source: Kutrz Ersa 

big players who run a product 24/7 on one line for 365 days. 

“We were looking for soldering machines that combine high quality 

with high productivity and high flexibility – we had a good feeling 

about the Ersa systems right from the start, so they ended up right 

on our benchmarking list,” says Jozef Sadlek. After extensive market 

observation, the company opted for a Versaflow 3/45 selective soldering 

system. Previously, there were extensive tests to verify whether 

the Ersa soldering systems could actually deliver the desired results. 

This included a visit to the Enics site in Nova Dubnica, Slovakia (an 

Ersa customer with headquarters in Switzerland), to inspect the system. 

This included analyzing possible layouts and configurations in 

real production and developing a feeling for the best solution. 

Bringing productivity leaps 

At the same time, PBT Rožnov, the Czech Ersa representative for 

many years, who is also responsible for Slovakia, calculated how to 

optimally design the processes in the direction of productivity. The 

PCBs to be produced were examined in detail to determine what the 

ideal soldering process should look like. Shortly after installation of 

the Versaflow 3/45, the orders went through the ceiling in such a way 

that one shift was no longer sufficient. The company switched to 

2-shift operation – which became problematic from the production organization´s 

point of view. The logical consequence was for management 

to follow the first soldering machine with a second Versaflow 

3/45, in order to return to a 1-shift operation. Parallel to the first selective 

soldering machine, Telux also ordered a Versaprint B1 stencil 

printer “on the side”, which the Ersa technicians subsequently gave a 

3D-SPI – a feature that did not yet exist at the time as an integrated 

function in a stencil printer. In the meantime, the second Versaprint 

generation has been established on the market and can be ordered 

ex works with integrated 100 % inspection in 3D. Last year, the company 

again added to its list and at the same time acquired two further 

Telux Managing Director, Jozef Sadlek, and PBT Sales Manager, Michal Duda, 

at the Ersa Versaprint stencil printer with integrated 3D SPI. 

Source: Kurtz Ersa 

Telux electronics production in Trebatice. 





Double Versaflow 3/45 in the Telux electronics production. 

Future on the basis of automated production concepts firmly in view: 

Telux Managing Director, Jozef Sadlek. 


systems for its electronics production – a reflow soldering system, 

Hotflow 3/14e, for energy-efficient, resource-saving reflow soldering 

with maximum soldering quality and performance, as well as, a full 

tunnel wave soldering system, Powerflow eN2, ideally suited for 

cost-optimized wave soldering in a nitrogen atmosphere. 

Service and support 

Communication between Telux and Ersa is handled by the Czech 

partner company. “PBT Rožnov´s service and support are on a very 

professional level. Their technicians are well trained and the response 

to our questions takes place within 24 hours. The installation 

and commissioning of the new equipment was also carried 

out absolutely professionally and smoothly. There have been no significant 

incidents during the five years that we have Ersa systems in 

operation,” praises Managing Director, Jozef Sadlek. From today´s 

point of view, the company can even say that five years ago, they 

chose the Versaflow selective soldering technology for the perfectly 

fitting system – especially in view of the urgently needed flexibility. 

“We have made great efforts to find the best solution. Telux is one 

of my favorite customers – not only because we were able to place 

five machines there, but also because of the very good partnership 

and close relationship between the companies involved,” says Michal 

Duda, PBT Rožnov´s Sales Manager, who has been friendly 

with the company for 15 years. As a recipe for success for this cooperation, 

PBT sees the downstream support by the dynamic service 


Aufgrund des kontinuierlichen Wachstums war bei einem Slowakischen 

Hersteller elektronischer Geräte das nächste Technologie- 

Update fällig, wofür ein Systemlieferant mit einer Vielzahl von Löttechnologien 

unterstützt – darunter Selektivlöttechnik und Schablonendruck. 

Résumé 

Suite à une croissance continue, une nouvelle mise à niveau technologique 

était à l‘ordre du jour chez un fabricant slovaque d‘appareils 

électroniques pour lesquels un fournisseur de systèmes apporte 

son concours à diverses technologies de brasage – y compris 

la technologie de brasage sélectif et la sérigraphie. 

Резюме 

В связи с непрерывным ростом один из словацких 

производителей электронных устройств принял решение 

провести очередное технологическое обновление. Системный 

поставщик оказал ему значительную поддержку, предложив 

на выбор множество технологий пайки, включая технологии 

72 селективной EPP EUROPE November пайки и 2019 трафаретной печати. 

Strong trio (from left to right): Jozef Sadlek (Telux, Managing Director), 

Radek Lauer (Ersa, Sales) and Michael Duda (PBT, Sales). 

team in addition to the advisory support on the way to the installation 

of powerful systems. “If there should be a problem, one of 

our colleagues is on site within a few hours to solve it – often we 

solve things via a TeamViewer call,” adds Michael Duda. Every year, 

the PBT team carries out 20 new installations in the region – in addition 

to the existing machines in the field. The increasing market 

share in Slovakia and the Czech Republic is probably due to the firstclass 

support provided by PBT´s service technicians all over the 

country. New service colleagues are trained directly through the 

Ersa qualification program and then go on tour with the experienced 

service technicians until they can be self-sufficient themselves. 

Strong demand for top quality 

“First: With the Ersa systems, we have succeeded in automating 

production to a greater extent – an important step, since it is not 

easy to find qualified specialist personnel. And secondly: the soldering 

quality and the overall quality of the placement have increased 

dramatically. Important prerequisites for our industrial electronics 

production with a pronounced need for very high quality,” is how 

Telux Managing Director sums up the cooperation over the past five 

years. Telux has a production facility that is as pretty as it is efficient. 

Product planning is always one year into the future, and the demand 

for hardware and machines is determined accordingly. Should there 

be a gap here, they know how reliable and in what quality the machines 

perform their service – there is a very good chance that 

further systems will be delivered to Trebatice via PBT Rožnov. 

productronica, Booth A4-162, A4-171 

www.kurtzersa.com; www.telux.sk 

Radek Lauer, Ersa Area Sales 

Manager Soldering Systems & 

Printing Machines. 


Source: Kurtz Ersa


Electrification, ADAS and connectivity at productronica 2019 

Automobile industry drives 

demand for advanced packaging 

According to forecasts, electronics worth €1,300 will be installed in the average car by 

2021. Electrification, assistance systems and Car2X communication are driving this trend – 

a growth market with location advantages for European electronics manufacturers and 

Tier 1 suppliers. Accordingly, technology supplier ASM will dedicate a large part of its 

booth at this year’s productronica to the automotive and advanced packaging sectors. 

As a supplier to the electronics industry, the company uses its 

market position and process knowledge in the areas of SMT/ 

electronics production and backend/chip assembly to strengthen its 

role in the advanced packaging segment. Since automotive electronics 

are demanding in terms of robustness and reliability, advanced 

packaging technologies are driven to large extent by electrification 

and other automotive trends. As a result, divisions of labor 

and supply chains that were established over many years in the 

automobile industry are changing, and deliveries from OEMs and 

Tier 1 suppliers to OSATs (Outsourced semiconductor and test providers) 

are expected to increase by more than 30 percent annually. 

The company stands ready to meet the dramatically rising demand 

of OSATs and new manufacturers for advanced packaging technologies 

and the associated manufacturing equipment. 

Solution clusters at the booth: electrification, ADAS, 

and connectivity 

In addition to SMT solutions, the company’s 800-square-meter 

booth will feature innovative process solutions for advanced packaging 

applications in the automobile industry from a strong technology 

partner that can implement fully integrated process solutions with 

synchronized equipment. ASM has in its portfolio a multitude of solutions 

for a wide range of process steps, such as laser-based wafer 

separation, fan-out processes, bonding, SiP assembly, testing and 

packaging. This is all paired with in-depth process knowledge and 

many years of experience in the automotive sector. 

Getting everything from a single source makes for lower investment 

costs, project times and risks. The company presents the solutions 

at its booth in three clusters: Electrification, ADAS (Advanced 

Driving Assistance Systems), and Connectivity. 

INFO 

At the 2019 productronica, the company will dedicate a special area 

of its booth to advanced packaging in the automobile industry. In 

three clusters – Electrification, ADAS and Connectivity – they will 

feature integrated process solutions and its latest innovations in the 

field. 

SilverSam – the flexible and scalable press for sintering of silver- or coppercontaining 

pastes with SiC or GaN dies as the basis for temperature-resistant 

composites in power electronics (IGBTs, etc.). 

Electrification 

Electrically powered vehicles need more components containing 

power electronics. The high currents and electric outputs result in 

higher temperatures during switching operations and a significantly 

higher heat input at the contact points between electronics and 

substrates. The challenge for automotive electronics: due to the 

longer duration of high temperatures in the individual components, 

the different heat expansion coefficients of the surrounding materials 

and – last but not least – the vibrations in a moving vehicle, traditional 

solder joints become unreliable. 

Nano-silver for more stable connections 

One solution is to employ more temperature-resistant materials, 

such as SiC substrates and nano-silver pastes. The high melting 

point of silver, however, prohibits the use of a melting process to 

create the conductive connections, because the electrical components 

would not survive the high temperatures. 

The solution: With silver sintering, nano-silver particles can be 

shaped to form stable connections without melting. The booth will 

feature a machine for this process, the SilverSAM (Silver Sintering 

Automated Machine). This highly automated solution, which can be 

combined with other of the company’s solutions for paste printing, 

die-attach and encapsulation, enables component manufacturers to 

produce more durable IGBT modules with improved electrical and 

thermal properties very efficiently. 

Source: ASM Assembly Systems GmbH & Co. KG 




Automobile industry: The driver of new processes. 


Autopia – the solutions 

for the active alignment 

of lenses in optical 

systems in car cameras. 

Lots of pressure: The sintering process 

For starters, the paste with nano-silver particles is applied to the 

DBC (direct-bond copper) or substrate with a DEK printer. This is followed 

by the pre-sintering process, which requires higher bonding 

forces as well as bonding heads for temperatures of 100 °C or more 

to firmly connect the die to the substrate and keep it from shifting 

later in the process. The basic sintering process uses pressure, heat 

and time in material-specific combinations to permanently join the 

silver particles in the paste at temperatures that are far below the 

silver’s melting point. 

SilverSAM operates with pressures of more than 15 MPa and temperatures 

between 200 °C and 300 °C. The maximum sintering surface 

is 270 mm by 205 mm – enough for two 5-by-7-inch panels and 

perfect for carriers with singulated substrates. The innovative tooling 

in this solution can be configured to exert pressure only to the 

desired areas (dies, chips, etc.) while keeping cavities or grooves on 

the substrate untouched. A special film between the die and the 

tooling protects the components. After being sintered, the packages 

are assembled on the base plate via pick-and-place with SMT 

placement machines. Next, a wedge bonder like the ASM Hercules 

creates the strong wire connections within the modules. Finally, the 

components can be encapsulated with the Idealmold 3G. 

Active alignment for the manufacture of CMOS image 

sensors 

Automotive assistance systems require radar, lidar and opto-electronic 

sensors that must be robust, reliable and precise. One 

example of this technology are cameras with lenses that must be 

aligned perfectly over the sensor dies during their production. 


Die Automobilindustrie treibt die Nachfrage nach Advanced-Packaging 

an. Insofern widmet ein Technologie-Lieferant einen großen 

Teil seines Messestandes auf der diesjährigen productronica 

diesem Thema. 

Résumé 

L‘industrie automobile stimule la demande d‘emballages à la pointe 

de la technologie. A cet égard, un fournisseur de technologie consacre 

une grande partie de son stand au salon productronica de 

cette année à ce thème. 

Резюме 

Автомобильная промышленность стимулирует спрос на 

современную компоновку. В связи с этим один из 

поставщиков технологий посвящает данной теме в этом году 

значительную часть своего стенда на выставке productronica. 

74 EPP EUROPE November 2019 

One innovative solution for this process that will be unveiled at this 

year’s tradeshow in Munich is the company‘s Autopia. With its Active 

Alignment feature, it reads the image signal of the CMOS sensor 

and compares it with reference image values while it positions the 

lens. This ensures the perfect optical alignment of the entire system 

before it is fixed in place. This feature aligns the sensor and the lens 

with 11 degrees of freedom – individually, automatically and with exceptional 

precision for tasks like wide-angle or near-field applications. 

After they have been aligned, a placement solution like the Siplace 

CA (Chip Assembly) can combine the sensors with SMT components 

to form SiPs (Systems-in-package). 

Autonomous driving will generate a flood of data 

Automotive advances will also place new demands on electronics 

outside of the vehicle. Autonomous driving requires Car2X communication, 

i.e. the vehicles must communicate with other vehicles 

and services. The basis for this is the 5G mobile data network that is 

currently under construction, and the vehicles themselves must 

have powerful and highly miniaturized communication modules installed. 

This degree of integration is achieved by combining many heterogeneous 

active and passive components into a SiP (System-ina-Package) 

with technologies like active embedding or multilayered, 

three-dimensional structures. For these processes, the 

company offers in addition to high precision solutions like the Nucleus 

and the Siplace CA – machines that combine the precision of 

chip assembly with the speed of SMT technology. Without these 

productivity leaps, neither the required quantities nor the cost targets 

of the automotive industry could be realized. 

But the communication needs go beyond the vehicle itself. To ensure 

speedy data communication, transmission stations along the 

roads and a dense network of decentralized data centers are 

required. These data centers are linked to each other as well as to 

Amicra CoS – the high-precision chip-on-substrate bonding. 

Source: ASM Assembly Systems GmbH & Co. KG



The Siplace CA – high accuracy for advanced packaging. 

larger data centers. The required data rates of 100 to 600 Gbps between 

the data centers and between servers can only be achieved 

by building photonic networks and a new generation of opto-electronic 

transceivers for fiberoptic networks. 

Building these transceivers requires the placement of optical components 

with a precision of below 1 μm. Designed especially for the 

efficient production of these high-precision transceivers, the company 

offers the Amicra Nano. Instead of building and aligning transceivers 

from many components for the conversion of electrical signals 

into light (and back again), it creates PICs (Photonic Integrated 

Circuits) with a lithographic process. This requires far fewer components, 

reduces the complexity of the alignment process, and increases 

the yield. 

Siplace TX 

micron – high 

accuracy and 

high performance 

placement 

for SiP and 

WLSiP advanced 

packaging. 

Growth opportunities for electronics manufacturers 

The extensive ASM portfolio with its advanced packaging solution 

clusters reflects the growth opportunities being offered by the automotive 

sector for OSATs and electronics manufacturers. 


www.asm-smt.com 

David Felicetti, 

Product Marketing Manager, 

ASM Back End Systems. 



Your Ideal Solution for High-Viscosity 

Applications: Our SuperHi Jet 

High-precision jetting of materials 

up to 1.000.000 mPa/s 

Contact: 

MUSASHI ENGINEERING EUROPE GmbH 

Marcel-Breuer-Str. 15, D-80807 München 

Tel: +49(0) 89 321 996 06 E-Mail: sales@musashi-engineering.de 




Stable, predictable cleaning solutions at productronica 

Kyzen, a provider of environmentally 

friendly cleaning chemistries, will exhibit 

at productronica. Cleaning experts will 

offer one-on-one cleaning assessments 

and discuss the Aquanox A4727 next generation 

aqueous assembly cleaner. 

Aquanox A4727 is engineered to be effective, 

stable and predictable. It is designed 

for reliable production and assembly operations. 

The chemistry provides a stable 

pH and predictable compatibility throughout 

its long bath life. 

Environmentally responsible, the cleaner 

is non-hazardous and biodegradable. It 

contains no CFCs or HAPs and can be 

used at low concentrations to effectively 

remove even the toughest soils, and rinse easily and completely. It 

is easy to control and cost-effective, and works well in both in-line 

and batch cleaning systems. This stable chemistry is compatible on 

a wide variety of components, coating, labels and equipment. 


www.kyzen.com 

Source: Kyzen 

Aquanox A4727 is a nonhazardous 

and biodegradable 

solution, which is 

engineered to be effective, 

stable and predictable. 

Fume extraction solutions at productronica 

2019 

Processes in electronics manufacturing, such as soldering, welding 

or bonding, produce airborne contaminants, which need to be sustainably 

removed. Fume extraction technology from ULT AG helps 

to solve this problem. For more than 25 years, their air handling solutions 

protect employees and products from the impact of particulates 

of any size, meeting health and safety obligations. 

At productronica, the company will exhibit the mobile device series 

ULT 200.1. It provides extraction and filtration solutions 

for laser and fume, dusts, gases or vapors. 

Depending on the application, there is a 

variety of fume extraction devices. 

In addition to lownoise 

operation, they all 

share a set of accessories, 

such as panels 

for extraction arms and 

hoses, a foot switch or 

various tube elements. 

productronica, 

Booth A4-549 

www.ult.de 

Modular ULT 200.1 fume extraction system 

series for various applications. 

Source: ULT AG 

Sustainable cleaning solutions at productronica 

The Tergo family of cleaning products, that boasts ‘green’ 

credentials, will be displayed at productronica. 

Source: MicroCare Europe 

MicroCare Europe BVBA, a manufacturer of cleaning, 

coating and lubrication products, will exhibit 

sustainable cleaning solutions at productronica. A 

highlight will be the Tergo family of cleaning products 

which boasts impressive ‘green’ credentials. 

As manufacturers become aware of the importance 

to find sustainable practices, the company 

will present its cleaning products, which have 

been developed to not only clean effectively but in 

an economically and environmentally way. 

“When it comes to selecting cleaning solutions, 

we are seeing a change to the approach in choosing 

cleaning processes,” said Scott Wells, General 

Manager. “An important consideration is its sustainability. 

Cleaning processes must minimise any 

negative environmental impact, whilst also conserving 

resources. Another factor is ensuring the 

safety of the workers. The Tergo products upholds 

regulatory compliances with excellent toxicity profiles, 

making them safer for the environment and 

people. 

Tergo flux remover is a non-flammable fluid engineered 

for cleaning PCBs in vapour degreasers. It 

has a non-volatile additive to clean challenging 

high-temperature solder pastes and flux residues, 

and water-soluble (OA) fluxes. This flux remover is 

a replacement for many older chemistries that are 

being phased-out under environmental, health, 

safety or economic pressures. It is also a replacement 

for aqueous cleaning machines, therefore 

helping to conserve natural resources. 

The company will also exhibit Tergo chlorine-free 

cleaning fluid, a non-flammable cleaner, which has 

no harmful chlorine-containing elements. This ensures 

it is within strict regulatory and environmental 

boundaries. It is a degreaser that offers reliable 

cleaning for challenging contamination. 

As regulatory demands change, and environmental 

concerns grow, finding a cleaning solution for 

complex electronic components can be challenging. 

This chlorine-free cleaning fluid is helping to 

answer these requirements and improving manufacturing 

processes. 


www.microcare.com 


Inspect X-ray 

Inspection 

Find hidden defects as small as 100 nm, non 

destructively. Failure analysis and production QC. 

Bond and Materials Test 

Test 

Characterize PCBA and device integrity. 

Identify latent defects before they occur. 

Count 

Guarantee the right material quantity at the right time. 

Keep your SMT line running, minimize stock costs. 

X-ray Component Counting 

Inspection, Test and 

Counting Solutions for SMT 

Find out more: Productronica Stand A2:445 

www.nordsondage.com


Utilizing protection materials 

Improving long-term performance 

and reliability of LED systems 

LED applications are becoming increasingly more diverse; design requirements, location 

or the function of the product are all elements that prove the challenges that face LED 

designers are continually evolving. Correct product selection is imperative to ensure LED 

performance and lifetime. The use of LEDs in various environments is an important factor 

to consider, as well as, specifying the appropriate protection under such conditions. 

Jade Bridges, Global Technical Support Manager, Electrolube Ltd. 

Source: Electrolube 

LEDs, like most electronic devices will perform well until external 

influences start to deteriorate performance. Such influences can 

include the electrostatic attraction of dust, humid or corrosive environments, 

chemical or gaseous contamination, as well as many 

other possibilities. It is therefore extremely important that the end 

use environment is considered in detail to ensure the correct products 

can be chosen. 

Different environmental conditions 

The LED lighting market is expected to grow into a $ 70 billion industry 

by 2020, taking a 70 % market share in just 5 years (Forbes). 

This growth is attributed to the advantages LEDs offer over traditional 

lighting forms in terms of adaptability, lifetime and efficiency. 

It is therefore easy to understand why LED lighting is being used in 

a vast array of applications including domestic lamps, industrial 

lighting for factories, lighting for marine environments, architectural 

lighting and designs, to name just a few. 

Comparing the environmental conditions in a standard architectural 

lighting application with that of a marine environment can help us to 

understand the potential causes of LED deterioration. In an architectural 

lighting application, it is possible that the LED itself is covered 

due to the design of the unit, or that the orientation of the LED is 

such that it is only likely to be exposed to general changes in ambient 

temperature and humidity. In a marine environment, it is possible 

that an LED light may be splashed or immersed in saltwater and 

in all cases, it will be in a salt mist environment for the majority of its 

operating life. Conditions with high salt can cause corrosion on 

PCBs and thus dramatically reduce performance, much faster than 

general conditions of varying humidity. Typically, conformal coatings 

and encapsulation resins are used to offer a high level of protection 

in each of these environments. 

Acrylic conformal coatings 

Conformal coatings are thin lacquers which conform to the contours 

of a PCB, allowing good protection without adding any significant 

weight or volume to the board. They are typically applied at 

25–75 microns and are easy to apply by spraying or dipping techniques. 

To protect the top of LEDs, it is crucial that the coating used 

has good clarity and that it remains clear throughout the lifetime of 

the product in the desired environment, i.e. the coating may be 

required to have good UV stability if the product is outdoors. Thus, 

the best type of conformal coatings is based on acrylic chemistry, 

offering both the clarity and colour stability combined with excellent 

humidity and salt mist protection. 

Typically, acrylic conformal coatings are solvent-based products, 

where the solvent used is a carrier fluid to allow a thin film of resin 

to be deposited on the substrate. The solvents used are 

classified as VOCs (Volatile Organic Compounds); as this 

solvent is only present on the LED for a few minutes during 

the application stage, it is not considered a long-term 

issue for most systems. In some cases, LED manufacturers 

do have specific requirements regarding the use of 

products containing VOCs, as well as other specific 

chemicals, and these will be listed in the LED literature. In 

general, a chemical compatibility check will assist in confirming 

if a solvent-based conformal coating is suitable for 

use with the desired LED; conformal coating manufacturers 

can assist with such testing. 

Comparison of conformal coating performance in a salt mist environment. 




Typical colour temperature bands for LEDs. 


Colour temperature shift 

As well as considering the effect of the coating applied on 

the LED, it is also important to understand the effect on colour 

temperature. Colour temperature shift has been an ongoing 

issue when considering the type of protection media 

to use and it is understood that no matter what material is 

placed directly over the LED, it will cause an interaction that 

leads to a colour temperature shift. This shift is typically 

from a warm temperature to a cooler temperature and will 

vary between different LED types and colour temperature 

bands. In addition, it will also differ depending on the protection 

material applied. This is another area where acrylic conformal 

coatings, such as the company’s AFA, offer advantages over 

other chemistry and product types. 

For example, the company has tested the colour temperature shift 

of a ‘warm’ light LED. They utilized different thicknesses and cure 

mechanisms, in order to highlight the possible changes in colour 

temperature. This included setting boundaries of the particular type 

of LED used; i.e. the colour temperature could be anywhere between 

these boundaries when the LED is purchased. The thin and 

thick coatings represented the typical minimum and maximum 

thickness that conformal coatings are applied, i.e. 25 and 75 

microns. The results show that by applying such a thin film, the colour 

temperature shift is minimised, and in turn is manageable within 

An examle of colour temperature shift – Electrolube AFA. 

Comparison of standard resin chemistries after 1000 hours exposure to UV light. 

the same boundaries given by the LED manufacturer. 

In an ideal world, conformal coatings would be applied to all LED applications 

due to their ease of application, minimal effect on volume 

and weight of the unit, versatility in use and finally, their effect on 

colour temperature shift. As we all know, it is often not possible to 

have one solution for all applications, however. Conformal coatings 

offer an excellent level of protection in humid and salt mist environments, 

however they do not provide the highest level of protection 

in environments with frequent immersion in water, chemical 

splashes, as well as, corrosive gas environments. It is in such situations 

that the consideration of an encapsulation resin is advised to 

offer the increased level of protection. 

Encapsulation resins are also available in a number of different 

chemistry types, including epoxy, polyurethane and 

silicone options. Typically, epoxy resins offer tougher 

protection in terms of mechanical influences, but they 

do not offer the flexibility of the other chemistries, 

which can lead to problems during thermal cycling, for 

example. In addition, standard epoxy systems do not 

offer the clarity and colour stability of other systems. 

Silicone resins do offer excellent clarity and perform 

well in temperature extremes, whereas polyurethane 

resins offer a combination of good flexibility, clarity 

and a high level of protection in harsh environments. 

The clarity differences of three resin chemistry types 

was examined by the colour differences of the resins 

after 1000 hours UV exposure, which highlighted the 

stability of each resin in outdoor conditions. It was evident 

that the silicone and polyurethane resin outperformed 

the standard epoxy system in this case. 




Comparing the performance of various products in harsh environments 

can also highlight preferential product choice, based on the 

end-use conditions. For example, the effect of corrosive gas environments 

on an acrylic conformal coating, a polyurethane resin 

and a silicone resin was also examined by the percentage reduction 

in luminous flux of the LED, after exposure to a mixed gas environment. 

These results clearly illustrated the importance of choosing the correct 

product for the environment. Although the conformal coating 

does not deteriorate in terms of its surface insulation resistance in a 

corrosive gas environment. It is not an adequate protection for 

LEDs, as it allows the gas to pass through the thin coating and penetrate 

the LED, thus degrading its performance over time. A similar 

effect is also seen with the silicone resin, however in this case, despite 

the protection layer being considerably thicker (2 mm vs. 

50 microns), the gas is still able to pass through the resin and affect 

the LED. When you compare the result of the silicone resin to the 

polyurethane material, it is evident that there is a difference in performance 

exhibited by these two chemistry types, as 

the silicone resin is permeable to the gas whereas the 

polyurethane resin at the same thickness, is not. In 

such cases, an optically clear polyurethane resin, such 

as the company’s UR5634, would be the most suitable 

protection media to prevent the corrosive gases from 

adversely affecting the LED. 


Change in luminous flux after exposure to mixed corrosive gas. 


Der Artikel diskutiert die verschiedenen Überlegungen, die bei der 

Wahl des Schutzes für ein LED-System erforderlich sind. Dabei ist 

die Bewertung der Umwelt entscheidend für die erfolgreiche Spezifikation 

eines Produkts. 

Résumé 

L‘article évoque les diverses considérations à prendre en compte 

lors du choix de la protection d‘un système à LED. L‘évaluation de 

l‘environnement est décisive pour réussir la spécification d‘un produit. 

Резюме 

В статье рассматриваются различные аспекты, которые 

необходимо учитывать при выборе защиты для светодиодной 

системы. При этом оценка окружающей среды имеет 

решающее значение для определения оптимальных 

технических характеристик изделия. 


Suitable resin for LEDs 

Polyurethane resins have been highlighted as suitable 

resins for the protection of LEDs in a number of different 

environments. They can also be adapted to offer additional 

benefits, such as pigmented systems used for 

covering the PCB up to, but not over, the LED. Such resins 

are used for protection of the PCB, offering an aesthetically 

pleasing finish, whilst adding to the performance 

of the luminaire by reflecting the light off the PCB and increasing 

light output. There are also specialist resins that can be used to 

diffuse the light from the LED. Resins, such as the company’s 

UR5635, can offer two solutions in one; protection from the surrounding 

environment and diffusion of light, potentially eliminating 

the need for diffuser covers and caps. 

Encapsulation resins clearly offer a high level of protection in a 

range of environments and can be tailored to suit application 

requirements either by choice of chemistry type or by adaption of 

the formulation of a particular resin. It is important to return back to 

the subject of colour temperature shift, however. Earlier in this article, 

the minimal effect on colour temperature exhibited by thin film 

conformal coatings was discussed. When comparing the thicknesses 

of conformal coating to encapsulation resins, it is evident that 

part of the increased level of protection that resins offer is due to 

the ability to apply a much thicker layer. Resins can be applied at 

1–2 mm or at much greater depths, however this depth will also 

have an effect on the level of colour temperature shift observed. 

The typical colour temperature shift of LEDs covered with different 

thicknesses of polyurethane resin was also examined. It was clear 

that the thickness directly correlates to the degree of colour temperature 

shift, thus highlighting another important consideration 

when choosing suitable protection media. It is unsure if the colour 

temperature shift will occur, but the important consideration is the 

repeatability of the shift for the LED used. If the shift is consistent, 

the change can be accounted for by re-considering the original LED 

colour temperature band, for example. 

L to R: Comparison of diffusing (UR5635) and clear (UR5634) polyurethane resins. 




Effect of resin thickness on colour temperature shift. 

Conclusion 

This article has discussed the various considerations required when 

choosing protection for an LED system. Evaluating the environment 

is essential to successfully specifying a product, both in terms of 

end-use performance and suitability for production processes. Conformal 

coatings offer the best combination of ease of 

application and incorporation into the design, with an 

excellent level of protection in humid and salt mist environments. 

They also exhibit the lowest effect on colour 

temperature due to the low thickness applied. 

When conditions become more challenging, the 

switch to encapsulation resins is advised. 

In this case, the choice between chemistry types will 

be dictated by the end-use conditions and particular 

environmental influences. In addition, the thickness of 

resin applied should be considered to ensure sufficient 

protection is achieved whilst minimising the effect 

on colour temperature shift where possible. By 

ensuring efficient heat dissipation and protection from 

external environments, the efficiency and lifetime of 

LED systems can be increased. LED systems can 

now also be used in a wider range of environments 

and by offering LED designers support through considered 

material development, Electrolube is continually providing 

support for this ever-evolving industry. 


www.electrolube.com 

productronica 

November 12 – 15, 2019 

Hall A4, Booth 335 

Munich 

Best performance in every 

production environment with the 

CondensoX series! 

CondensoX is perfect for handling large or highmass 

boards in a stable process atmosphere. In 

order to improve control of the condensation phase, 

Rehm has developed a patented injection principle 

that allows the soldering procedure to be individually 

regulated. 

The new CondensoXS smart ensures high process 

stability and optimum throughput with a still small 

footprint thanks to a new chamber design. 

CondensoXS smart 

Condensation Soldering 

www.rehm-group.com 



High-power, low-standoff DPAK components 

Automotive-grade solder paste for 

enhanced electrical reliability 

Increased automotive electrification—including 48-volt (48V), hybrid electric vehicles (HEV), 

and electric vehicles (EV) with under-the-hood PCBA platforms, such as – 48/12 V DC-DC 

converter PCBA and voltage stabilizer PCBA for start-stop modules—has resulted in the 

prolific usage of high-power components such as DPAKs, power QFNs. These components 

are typically classified as low-standoff (the gap between the PCB pad and the component 

underbody is typically under 75 μ). During reflow, volatiles in the no-clean paste flux chemistry, 

such as activators and solvents, boil off. However, the lower standoff reduces the opportunity 

for the flux volatiles to vent, potentially resulting in “wet” flux residue post reflow. 

Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, Indium Corporation 

SIR requirements – according to J-Standard 004B and enhanced as per 

automotive requirements. 

Dendritic growth and corrosion with no-clean solder paste for low-standoff 

power Mosfet. 

Source: Indium Corporation 


It is critical that the no-clean flux residue does not cause ionic dendritic 

growth and corrosion under low-standoff power components 

during the working life of the product. For these reasons, the automotive 

industry is imposing more stringent Surface Insulation Resistance 

(SIR) requirements to assess the electrical reliability of the 

no-clean solder paste flux chemistry, versus the standard 

J- STD 004B IPC-SIR test requirements. These include increased 

test voltages, increased test time, reduced space width, upping the 

minimum SIR threshold, and usage of different test coupons. 

Leakage current and failure of high-power Mosfet 

In a study conducted by Indium Corporation, a power Mosfet lowstandoff 

component was assembled with a no-clean solder paste 

and subjected to 50 V, 90 % RH for 1,000 hours. In this example, 

ionic dendritic growth was observed that resulted in leakage current 

and eventual failure of the assembly. This failure was specific only to 

the low-standoff Mosfet with no other component failures. With different 

test vehicles, the company was initiating an attempt to mimic 

the electrical failure of a no-clean paste for low-standoff components, 

with the intent to design an automotive-grade no-clean halogen-free 

solder paste for enhanced electrical reliability. 

Design of automotive-grade no-clean halogen-free 

solder paste 

No-clean flux characteristically consists of a mix of solvents, activators, 

resins, and rheological additives. During reflow, with normal 

volatilization, the activator-solvent system in “dry” flux residue is incapable 

of undergoing corrosion reaction when encapsulated by 

solid rosin in the presence of moisture, bias, and temperature. However, 

with lower standoffs preventing proper venting of flux volatiles, 

activator-solvent system in the “wet” flux residue are available 

for corrosion especially with moisture, bias, and temperature. 

The challenge is to design a flux system with the right rosin-activator-solvent 

complex that passes electrical reliability, regardless of 

whether the residue is “wet” or “dry.” 




B24 SIR coupon with 

and without glass-slide 

(to mimic low standoff). 

On the right side, 

there are glass slides 

on top of the flux deposits. 

SIR testing with and without glass slide 

A standard B24 SIR coupon was chosen for testing purposes. Five 

no-clean solder pastes consisting of four control pastes and the 

automotive-grade designed paste were tested as per J-STD 004B 

IPC SIR conditions. To evaluate the electrical performance of the noclean 

pastes for low standoffs, a glass slide was placed on top of 

the printed flux deposits on one half of the B24 SIR coupon. 

Flux deposits, as opposed to paste deposits, were tested to simulate 

the worst-case low standoff scenario. B24 SIR coupon was applied 

with and without the glass slide, in order to mimic the low 

standoff condition. The solder pastes included a combination of halide 

and halogen-free fluxes, T4 powder, and SAC305 alloy. A standard 

Pb-free air reflow profile was used in the process. For the standard 

SIR testing with no glass slide on top, all of the no-clean fluxes 

passed the minimum SIR requirement of 100 MΩ. For the test with 

the glass slide on top, the four control no-clean pastes failed with 

only the automotive-grade no-clean flux passing. The SIR performance 

for the five no-clean solder pastes tested on a B24 SIR coupon 

with and without the glass slide on top. The dendrites for the control 

pastes were documented with glass slides on top of the B24 SIR 

coupons. 

Automotive-grade no-clean paste for enhanced SIR 

conditions 

Now that a correlation had been established between low standoff 

and an appropriately designed no-clean flux system, the automotive-grade 

no-clean solder paste was subject to SIR testing for enhanced 

conditions, as per automotive requirements using a B52 

coupon; 10 V and 50 V; 1,000 hours; 0.2 mm space width; 93 % RH; 

400 C; and a minimum SIR threshold of 5000 MΩ. The specially designed 

automotive-grade paste passed this stringent SIR test as 

well, using the same standard reflow profile as before.



Reflow profile used to process Pb-free no-clean paste on B24 SIR coupon. 


Dendritic growth with control pastes on SIR coupon with glass slide on. 

Summary 

With increased electrification of automotive platforms, the complexities 

imposed by these systems—higher voltages, higher power 

components, longer hours of operation, and higher temperatures—on 

no-clean halogen-free solder pastes used to assemble 

PCBAs are only going to increase. In the past, the criteria that a noclean 

paste had to achieve included standard SIR testing, good 



Mit der rapid zunehmenden Elektronifizierung der Automobile steigen 

die Anforderungen an die Zuverlässigkeit der Elektronikbaugruppen 

weiter an, die selbstverständlich auch unter harten Bedingungen 

zuverlässig funktionieren müssen. Mit einem verschärften 

SIR-Test konnte nun die Eignung spezieller halogenfreier No-Clean- 

Pastenformulierungen zur Bildung robuster Lötstellen in der Automobilelektronik 

nachgewiesen werden. 

Résumé 

Avec l‘augmentation rapide de l‘électronisation des automobiles, 

les exigences en matière de fiabilité des assemblages électroniques 

ne cessent d‘augmenter, qui doivent bien entendu fonctionner 

de manière fiable, même dans des conditions difficiles. 

Grâce à un test SIR plus rigoureux, il a été possible de démontrer 

l‘adéquation des formulations de pâtes spéciales sans halogène et 

non nettoyantes pour la formation de joints de soudure robustes 

dans l‘électronique automobile. 

Резюме 

С каждым годом доля электроники в автомобилях возрастает. 

Требования к надежности электронных компонентов также 

повышаются — они должны надежно функционировать даже 

в самых суровых условиях. Благодаря более строгому тесту 

SIR теперь можно подтвердить пригодность специальных, не 

содержащих галогенов паяльных паст с флюсом, не 

требующим отмывки, для формирования прочных паяных 

соединений в автомобильной электронике. 

Enhanced SIR test conditions for automotive-grade no-clean halogen-free paste. 

SIR values (expressed as log of resistance ohms, Ω) with and without glass 

slide. 

printing with response-to-pause, good soldering in air reflow, good 

coalescence, and the ability to address head-in-pillow defects. 

Now, in addition to these requirements, ensuring the electrical reliability 

of the no-clean solder paste for low-standoff high-power components 

for enhanced SIR conditions has become equally if not 

more important. It is critical, therefore, to specifically design an 

automotive-grade no-clean halogen-free flux system with the right 

rosin-activator-solvent complex, that’s electrically safe with no ionic 

dendritic growth, especially for low standoff high-power components. 

In parallel, the no-clean halogen-free flux system should be 

engineered with the required activity to form reliable solder joints in 

air reflow conditions. 


www.indium.com 

Source: .Indium Corporation 




Compatible cleaning chemistry at productronica 

Zestron will be exhibiting a selection of 

cleaning machines from leading international 

manufacturers at productronica. 


Using the motto “Make the Cleaning 

Check”, Zestron will be exhibiting a selection 

of cleaning machines from leading international 

manufacturers. Visitors who are 

looking for a new cleaning system will be 

shown diverse, innovative and proven technologies. 

The company’s process engineers 

and technologists of the equipment 

manufacturers will be available to answer 

questions about the technology as well as 

the compatible cleaning chemistry. 

In addition to the selection of machines 

and cleaning agents, the focus will be on 

process monitoring. Trade show visitors 

can get information about innovative test 

methods and measuring concepts that 

help to ensure the reliability of electronic 

assemblies and to optimize production processes. 


www.zestron.com 

Convection system for 

reflow soldering 

To produce solder joints with few 

voids, soldering systems with 

vacuum chambers are essential 

for removing gases from the 

molten solder joint once the 

paste has been remelted. Rehm 

Thermal Systems‘ VisionXP+ Vac 

convection soldering system is 

an energy-efficient solution with 

a flexible vacuum option. 

This soldering system with vacuum 

option removes voids while 

the solder is still in its optimal 

molten state. With a vacuum 

under 100 mbar, void areas of 

less than 2 percent can be 

achieved. Soldering with vacuum 

is suitable for dissipating heat in 

demanding assemblies or for assemblies 

for power electronics. 


Innovation Is in Our DNA 

High-speed 3D AOI at 

Gold Level for the Most Reliable 

Assembly Inspection 


Source: Rehm Thermal Systems 

You'll always be a step ahead of the game with our trailblazing 

S3088 ultra gold 3D AOI solution. Its unique combination of speed, 

precision and flexibility guarantees maximum output in the 

manufacturing process for electronic assemblies. Leading 

manufacturers of high-end electronics around the globe rely on 

the S3088 ultra gold high-throughput system for quality assurance. 

WINNER 

The vacuum chamber is essential for 

removing the gases from the molten 

solder joint once the solder paste has 

been remelted. 

Come and see more innovations firsthand at productronica 2019: 

Viscom in Hall A2, Stand 177 

3D SPI 3D AOI 3D AXI 3D MXI 3D Bond CCI 

www.viscom.com


Tinning coil connections 

Rotary soldering table 

with 4 stations 

For decades now, Zevatron Löttechnik has been a reliable partner for professional 

soldering equipment. After successful implementation of multi-axis 

transport systems and robot solutions, rotary soldering tables with 4 stations 

for tinning coil connections have been developed. 

The great advantage of rotary tinning tables consists in extremely 

short cycle times, as several processes are constantly performed 

simultaneously.The stations loading / fluxing / tinning / unloading 

ensure efficient processing of the components. To check the quality 

of the tinned connections, it is possible to install a continuity test 

with encoded trays for nio parts. 

Loading and deloading for up to 2 coils, PLC handling by touch-display. 

Source: Zevatron Löttechnik 

Fluxing and tinning position, easy accessible and exchangeable for cleaning 

and maintenance. 


Solder pump system with customized nozzles, automatic solder supply, 

continuity test. 


Rotary tinning station with 4 positions and encoded trays for nio parts. 




All on one machine 

Best results are achieved by the use of proven modules, such as an 

overflow fluxer for constant flux niveau and a SWLM solder pump 

system, or a static solder bath with ladle and oxide scraper. For 

maintenance purposes, all components are easily accessible and 

exchangeable, if required. 

Easy-change nozzles and workpiece holders make the system ideal 

for tinning different coils on one machine. Each soldering machine is 

developed in close cooperation with the customer, whereby individual 

requirements and specifications are implemented quickly. 

The entire work process is monitored. If the soldering temperature 

or solder level falls below the set minimum, the process stops automatically. 

Optionally, the level is kept constant by a solder level 

supply. In order to minimize the oxide formation, an equipment with 

inert gas is possible. 

The soldering unit is integrated in a cell, a double safety light grid 

provides optimal protection for the operator. The convenient PLC 

control with touch display is user-friendly and enables easy configuration 

of all parameters as well as program storage and management. 

productronica, Booth A4–370 

www.zevatron.com 


Ein kompetenter Partner für professionelle Löttechnik hat aktuell 

nach erfolgreichen Entwicklungen von Mehrachsverfahrsystemen 

und Roboterlösungen Rundtakttische mit 4 Stationen zum Verzinnen 

von Spulenanschlüssen konstruiert und umgesetzt. 

Résumé 

Un partenaire compétent dans la technique de brasage professionnelle 

a conçu et réalisé des tables à transfert rotatif avec 4 stations 

pour l’étamage de la connexion des bobines après sa réussite dans 

le développement de systèmes de glissement multi-axes et de solutions 

robotisées. 

Резюме 

Компетентный партнер в области технологий пайки после 

успешного выпуска на рынок многоосевых систем 

перемещения и роботизированных решений разрабатывает и 

внедряет поворотные индексные столы с 4 станциями для 

лужения соединений катушек.


Smart, flexible and efficient – systematic convection soldering 

Proven process technology 

ready for future trends 

Convection soldering systems are still the backbone of surface mount technology all over 

the world. This is above all due to their enormous flexibility, high levels of efficiency and 

good heat transfer properties. And precisely these properties are more important than 

ever today. Advancing digitalization, ever larger production quantities, a vast variety of 

electronic components and, not least of all, global production of PCBs at multiple locations 

necessitate efficient and flexibly configurable manufacturing equipment. For this 

reason, reflow soldering systems are an essential constituent of every SMT production 

line. This article answers several essential questions concerning the configuration of 

these systems and the resulting effects on the soldering process. 

The design concept of convection soldering equipment makes it 

relatively simple to scale the system to prevailing manufacturing 

conditions. Various system lengths with greatly differing conveyor 

systems can be implemented without having to change the physical 

heat transfer concept. Systems with one to four lanes are possible 

with or without center support. The modular design of the heating 

and cooling modules, which are always of the same size, makes it 

easy to vary system length and at the same time assures calculable 

heat transfer. 

Nitrogen or air 

Nitrogen or air is normally used as the heat transfer medium in convection 

systems. Due to the fact that the thermal conductivity of air 

is only marginally greater than that of nitrogen, but because air is 

more viscous, the heat transfer properties of both gases are comparable. 

Where reflow soldering is involved, this results in the advantage 

that the reflow soldering profile only has to be adapted minimally, 

or not at all, when changing back and forth between operation 

with air and nitrogen. 

During nitrogen operation, a given volume of gas is fed to the system 

(approx. 20 cubic meters per hour) which is heated in addition 

Molten paste deposits in air (a) and in nitrogen (b). 

to the circulating flow of gas. Average power consumption of the reflow 

soldering system is increased in this case by roughly 0.7 kWh. 

The nitrogen displaces the air, thus driving the oxygen out of the 

process chamber and creating a stable, inert process environment 

which prevents in situ oxidation of all materials involved in the sol- 




Power consumption of a reflow soldering system under air and under nitrogen. 

Residual oxygen level, actual and setpoint. 





Tombstone rate, results according to Schake 1) . 

Two superimposed reflow soldering profiles recorded at different 

blower frequencies. 

dering process. Wetting and solder spreading are improved, as revealed 

by a comparison of the molten paste deposits. 

The reflow soldering systems from Rehm Thermal Systems make it 

possible to select the desired residual oxygen value. The user is 

thus provided with an additional parameter, making it possible to optimize 

soldering results for specific PCBs. There might not seem to 

be any apparent reason to increase the oxygen concentration in the 

process chamber, because oxidation impairs wetting performance. 

However, certain reflow defects, in particular tombstoning, can be 

influenced by wetting dynamics. Oxidation is prevented due to the 

lack of oxygen and wetting is accelerated. This results in a time offset 

where wetting of the two sides of a component is concerned – 

a tombstone occurs. And thus, higher concentrations of residual 

oxygen (e.g. 500 or 800 ppm) during reflow soldering can sometimes 

reduce the number of tombstones. Schake 1) demonstrated 

how the residual oxygen level influences the tombstone rate for 

0201 and 01005 components.




Temperature-time curve for a DIP package. 

Temperature profiling 

The purpose of temperature profiling is to generate a reliable, cohesive 

connection at all solder joints on the one hand, and to avoid exceeding 

the limits of the components heat resistance on the other 

hand. Heating system conveyor speed and blower frequencies can 

be adjusted in order to generate a suitable temperature-time curve. 

Blower frequency 

As already indicated by the name of the reflow soldering process, 

the process atmosphere itself becomes the heat transfer medium 

through the use of forced convection. Rehm uses innovative EC 

blower motors to induce convection flow, which can be directly controlled 

with the help of an integrated frequency converter. 

Being able to control volumetric flow provides the user with an additional 

option for influencing the temperature-time profile of their 

PCB. A comparison of two reflow soldering profiles were recorded 

using a VXP+734 with blowers, which were operated at different 

frequency settings. Other parameters, such as conveyor speed and 

reflow system temperature settings, were not changed. It is apparent 

how maximum solder joint temperatures change when lower 

frequencies are used: chip component from 241 to 230 °C, inductor 

component from 232 to 217 °C. 

Blower frequency adjustment is rarely taken into consideration in 

actual reflow soldering practice, but it represents an entirely viable 

option for tricky tasks. For example, it’s used with Endress+Hauser’s 

patented back side reflow technology (patent 

DE 102 11 647 B4). With the help of this technology, THDs which are 

critical due to their heat resistance are soldered upside down in the 

Superimposed temperature-time curves for conveyor speeds of 1050 and 

800 mm/min. 

reflow process. Heat input for the package, which is suspended 

underneath the PCB, is less during the soldering process than for 

the leads which protrude up through the PCB and are soldered at 

the top. 

A DIP package is heated up to a desired reflow soldering temperature 

of 230 °C or higher, whereas the package suspended underneath 

the PCB remains significantly below the maximum permissible 

temperature of 200 °C. This was achieved, amongst other factors, 

through the use of different blower frequencies at the reflow 

system’s top and bottom heater modules. 

Conveyor speed 

PCB soldering results can be influenced by controlling the gaseous 

heat transfer medium (nitrogen or air) or blower frequency. Beyond 

this, the ability to change conveyor speed provides reflow soldering 

systems with an additional, effective method of altering the temperature-time 

profile. Even when heat zone temperature settings 

and blower frequencies remain constant, reflow soldering profiles 

can fluctuate due to a change in conveyor speed. 

As speed is reduced; maximum temperature increases at all 

measuring points and differences in temperature between the various 

thermal masses on the PCB become smaller. The temperature 

of the atmosphere in proximity to the PCB is changed only marginally. 

In contrast, conveyor speed greatly influences heat transfer to 

the PCB. 

As a result, it’s clearly advisable to adjust conveyor speed first and 

foremost– before changing any other system parameters – when 

optimizing the reflow soldering profile. It must be kept in mind that 

Thermal Conductivity in W/mK 

Advantages of EC Motors 

25 °C 

200 °C 

Control 

Integrated frequency converter for each motor 

Air 

0.024 

0.039 

Noise 

Less than AC motors 

Nitrogen 

0.024 

0.037 

Power consumption 

Less than AC motors 

Thermal conductivity of air and nitrogen. 

Industry 4.0 

Predictive maintenance 

Direct interface for > 27 data 

Continuous monitoring of essential operating data 




conveyor speed also has an effect on soldering defects, such as 

solder balls and tombstones. Trodler 4) was able to demonstrate that 

the use of slow conveyor speeds and accordingly longer preheating 

times resulted in less beading on the PCBs. Wohlrabe 5) was able to 

reduce the number of tombstones with lower speeds. 

CoolFlow method 

Whereas the options described above for inerting the soldering process 

and influencing temperature-time curves have long been 

known as separate parameters, multiple, simultaneous use of liquid 

nitrogen as a coolant and as an inert process medium is an innovation. 

With its CoolFlow method, the company has implemented a concept 

developed by Air Liquide GmbH (EP 2 771 145 B1), for the first 

time ever with relevance for machine technology, which entirely 

banishes previously common coolant water from the reflow soldering 

system. Cooling is accomplished in these systems by means of 

liquid nitrogen, which is then used to render the process chamber 

inert after phase transformation to the gaseous state. By waiving 

coolant, water provides the operating company with a power consumption 

advantage. With the CoolFlow option, the VXP+ soldering 

systems consume 10 kWh or less in the operating state under actual 

production conditions. At the same time, very steep cooling 

gradients can also be set up with the CoolFlow, for example in order 

to shorten cooling time. Cooling gradients of up to –6 K/s are possible 

with the Rehm CoolFlow option. 

Temperatures and cooling gradients of a PCB with Rehm CoolFlow. 

 

 

 

 

 

 

 

 

 

 

 

 

 

Temperatures and cooling gradients of a PCB with conventional water cooling.




Dendrite arm spacing measurements at 0402 solder joints by means of EBSD, 

according to J. Villain 3 . 

Reduction in shear force at CR1206 and LED components after 0, 250, 500 and 

1000 temperature cycles (- 40 / + 125 °C), results according to Grözinger 2) . 

Within the framework of their examinations, Villain 3) and Grözinger 2) 

have adequately answered the question as to how a steep cooling 

gradient affects the reliability of the solder joints. With the help of 

dendrite arm spacing measurements conducted by means of EBSD 

for 0402 components on NiAu and iSn PCB finishes, Villain verified 

only a slight tendency towards grain refinement of the solder joints 

due to rapid cooling. In consideration of the scatter range, the cooling 

gradient and the finish of the PCB have no significant effect on 

the microstructure of the solder joints. 

The following shear force measurements conducted by Grözinger 

after the alternating temperature test (- 40/ + 125 °C) confirm the 

findings obtained by means of metallurgical examinations and verify 

that a cooling gradient within the generally accepted reflow soldering 

range of up to –6 K/s has no significant influence on the reliability 

of the solder joints. The reduction in shear force after 250, 500 and 

1000 cycles lies within exactly the same range for various cooling 

gradients for the examined CR1206 and LED components. Consequently, 

the CoolFlow method opens up a considerably larger process 

window for the user, in particular when soldering very heavy 

PCBs. 

Sources 

1) Jeff Schake, Mass Reflow Assembly of 01005 Components, Proceedings 

Apex 2007. 

2) T. Grözinger, Hahn-Schickard Institut Stuttgart, Bericht CoolFlow, Air 

Liquide Deutschland, 15.07.2016. 

3) J. Villain, HS Augsburg, Die Verbindungsqualität von Lötstellen Einfluss 

der Abkühlgradienten, Multipler Nutzen des Stickstoffs in der 

Elektronikfertigung, Rehm 18.2.2015. 

4) J. Trodler, W. Schmidt, Bleifreie Lötprozesstechnik: Haupteinflüsse 

und Wechselwirkungen auf die Lötqualität beim Verarbeiten von 

SAC-Lotpasten, Proceedings 3. DVS/GMM-Fachtagung 2006. 

5) H. Wohlrabe, T. Herzog, S. Schröder, Bericht zur Untersuchung des 

Einflusses von verschiedenen Löt- und Materialbedingungen auf die 

Qualität von gefertigten SMD-Baugruppen – Versuch 2, 2007. 

Conclusions 

This article has answered several essential questions concerning 

the configuration of convection soldering systems and the resulting 

effects on the soldering process. The company’s reflow soldering 

systems offer a great variety of system parameters, which make it 

possible to meet the most diverse soldering requirements. The 

combination of tried and true system options with newly developed 

measures, such as EC motor technology or CoolFlow, not only permits 

improved process technology, it also provides a solid foundation 

for laying out sustainable, Industry 4.0 compliant production 

machines. 




Reflow-Lötanlagen sind ein wesentlicher Bestandteil jeder SMT- 

Fertigungslinie. Dieser Artikel beantwortet einige wesentliche Fragen 

zur Konfiguration dieser Systeme und den daraus resultierenden 

Auswirkungen auf den Lötprozess. 

Résumé 

Les systèmes de brasage par refusion sont une partie essentielle 

de toute ligne de production SMT. Cet article répond à quelques 

questions essentielles sur la configuration de ces systèmes et les 

effets qu‘il induisent sur le processus de brasage. 

Резюме 

Системы пайки оплавлением являются неотъемлемой частью 

каждой производственной линии поверхностного монтажа. В 

этой статье даются ответы на некоторые важные вопросы, 

связанные с конфигурированием этих систем и их влиянием 

на процесс пайки. 




Intelligent, optimized clean room technology modules 

The name of Spetec‘s SuSi product range 

comes from „super silent“. The company 

has taken this as its guiding principle as it 

relaunches its clean room technology modules. 

The revised Laminar Flow Module 

boasts improved air flow characteristics and 

energy-saving fan technology. 

In addition, these modules feature monitoring 

and smart devices. It is now possible to 

control and assess the introduction of clean 

air to match the load and degree of contamination 

from any location. 

The FMS Laminar Flow Module makes it 

possible to equip clean room facilities 

simply and cost-efficiently. The module is 

fitted directly above various types of workplaces 

or a machine. The ambient air is 

drawn in with a radial fan and forced 

through the filter. This creates a laminar 

flow, meaning the filtered air flows in parallel 

layers. Particles are trapped by the parallel 

airflow and transported out of the space. 

The Laminar Flow Modules are characterized 

by low noise emissions. The main filter 

is in a filter cartridge that is screwed to the 

module. This means that the filter can be 

changed either from the top or bottom with 

just a few simple steps. Here, the company 

The revised Laminar Flow Module has improved 

air flow characteristics and energy-saving fan 

technology. 

uses an H14 filter, which provides clean 

room conditions of the class ISO 5 directly 

beneath the Laminar Flow Module. They 

are available in 6 different formats with: 

• Improved air flow characteristics 

• Energy-saving fan technology 

• Monitoring capability 

• Lower noise 

productronica, Booth B2-351 

www.spetec.de 

Source: Spetec GmbH 

Featuring automated innovations at productronica 2019 

Source: Yamaha Motor Europe 

Yamaha Motor Europe SMT Section is to demonstrate automation 

solutions at productronica, across several dedicated focus areas. 

An intelligent factory area will show control and management software 

tools with surface-mount machines of the company’s true Total 

Yamaha’s focus at this year’s produtronica will be to feature automation for 

future-proof flexibility and productivity. 

line solution including YSP10 printer, YSi-SP solder paste inspection, 

YSM20R mounters, and YSi-V 3D AOI. The new dashboard will be 

demonstrated, which provides intuitive controls, image viewer that 

retrieves images from every assembly for analysis, and features for 

controlling equipment remotely and optimising setup. AGVs will also 

show how materials can be moved efficiently to wherever they are 

needed, communicating with Intelligent SMD tower, YST15. 

In the pick and place area, the Sigma G5S II flexible multi-head placer 

and iPulse hybrid mounter will demonstrate flexible capabilities for 

taking on extreme challenges, such as very high density assemblies 

and populating 3D substrates. Also, the robotic area will demonstrate 

robotic electronics assembly processes with high flexibility. 


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Local non-contact heating 

Next generation soldering 

method using a laser technology 

Laser soldering, a new soldering method, which is expected to replace the wave soldering and 

reflow soldering, is receiving more attention. It is a “local heating” which heats only the targeted 

area and a “non-contact” heating, unlike the wave soldering or soldering iron. This avoids thermal 

damage to surrounding components which are not heat resistant. In this technical memo, the 

differences between laser soldering and existing soldering technologies will be discussed. The 

S3X58-M330D solder paste for laser soldering from Koki Corporation Ltd., will also be introduced. 

Source: Koki Corporation Ltd. 


The different 

melting conditions 

for surface 

finish and soldering 

conditions. 

Laser soldering 

condition based 

on the three 

different melting 

conditions. 

the targeted material and the wavelength of the laser. To heat up the 

flux cored solder wire, pad and connector’s preheat condition 

largely depends on the absorption coefficient. The company uses 

Unix-413LIII (wavelength 940 nm) by Japan Unix for all its testing. 

However, this wavelength is known to be low absorption coefficient 

on copper and gold, with gold being especially low. 

A laser soldering test was done, where solder paste was printed on 

500 μm x 600 μm pads with different surface finishes on FR-4 grade 

test PCB, and then soldered by laser under different conditions. The 

results showed that the solder first started to molten, which made it 

slump, then it turned into a spherical shape with low surface tension, 

and lastly, it wet across the pad. These test results suggest 

that OSP was the most insufficiently heated, followed by ENIG, 

HASL, and Sn. 

This order corresponds with the specific heat of respective surface 

finishes. Laser soldering with flux cored solder wire generally “preheat 

the pad” by the laser, then feed the solder wire to form a joint. 

On the other hand, in a laser soldering with solder paste, laser is irradiated 

on the previously dispensed or printed solder paste and the 

components to be soldered to heat them up. As a result, most of 

the laser light is irradiated on the solder, which makes the control 

point of this process be how much heat the solder paste would lose 

It is important to understand that laser soldering provides “heat” 

by an entirely different method than the other soldering technologies. 

Conventional soldering heats up air in an oven, soldering bath 

or soldering iron and the “heat” itself is transferred to the PCB, 

component and/ or solder to obtain solder joint. Therefore, in conventional 

soldering methods, process condition is determined 

based on the difference of thermal capacity, which depends on the 

size and material of the components (e.g. a reflow profile with sufficient 

preheat duration, etc.). 

Laser soldering and existing soldering technologies 

On the other hand, laser soldering is performed by converting the 

“light” to “heat,” meaning the process condition needs to consider 

the subject’s absorption efficiency along with the aforementioned 

difference of thermal capacities. Absorption coefficient depends on 

Laser emission timing according to the solder feed method. 




Different melt conditions with the two different profiles 

of the laser. Capillary balls are encircled in red in the 

flat type profile column. 


Linear type 

laser profile 

based on the 

four different 

melt conditions. 

Flat type laser 

profile based 

on the four 

different melt 

conditions. 


to the PCB, rather than how much laser light could the pad material 

absorb. 

In addition, if the laser is irradiated besides the solder, such as the 

soldering area is larger than the provided solder paste or the laser 

light covers the component surface, process condition must consider 

the absorption ratio of these spots area as well. 

In short, laser soldering outcome is not only determined by the heat 

as similar to conventional process, but also by laser light related parameters. 

Therefore, minor difference in the thickness of the copper 

on PCB or the pad dimension may have large impact, requiring 

much finer condition setting for each soldering needs. 

Difference in laser process profile 

Laser soldering can be completed in less than a few seconds. This 

means that cycle time reduction is one of the biggest benefits of 

this type of soldering. In the case of laser soldering, the quality of 

solder joint depends on process profile. Even if the amount of energy 

emitted is the same, different profile produces different solder 

joints. Another laser soldering test was done, where a FR-4 grade 

PCB with ENIG surface finish was used. Solder paste was printed 

on 500 μm × 600 μm pads using 80 μmt stencil with 100 % aperture 

ratio. The sample was then soldered by laser using two process profiles. 

The first was a linear profile, which starts from OW initial output 

and escalates with time. The other was a flat profile, output of 

which is consistent throughout the cycle. For both profiles, the laser 

was emitted for one second. 

The energy provided by laser can be determined by size of area 

made by the output and duration. For the test, the same amount of 

energy was used for each profile but there were different results. 

For instance, the solder was properly molten with a linear profile, 

however when using a flat profile due to insufficient energy, it 

showed unmolten solder. When testing with the strongest energy, 

the pad burned with a linear profile, but for the flat profile, the solder 

is appropriately molten without any burn. Based on these observations, 

it is suggested that flat type soldering condition loses more 

energy than linear type soldering profile between laser emitted and 

absorbed by solder paste. 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 





Insulation resistance comb-pattern test PCB (left) after paste printing (right) after soldering. 

Comb area after reliability test. 


In addition, heating by the laser is completed in approximately 1 

second. This means that evaporation of solvent in the solder paste, 

heat slump of resin materials, and melt and coagulation of solder all 

completed within a fraction of a second. Consequently, it is generally 

recognized that laser soldering is prone to capillary balls. Conversely, 

linear type profile results show less capillary ball occurrence 

as their heating was not as rapid. The same tendency is observed 

regardless of the different surface finish and different heating 

condition thereof. 

In summary, a linear type profile, which provides slightly gradual 

heating, is recommended as it can reduce the production cost by inhibiting 

the energy loss and also reduces the failure ratio by reducing 

the capillary ball occurrences. 

Measured insulation resistance during testing. 


Flux residue reliability in laser soldering 

Generally, high content of solvent or activator in flux residue will 

have negative impact on the insulation reliability. Solvent is evaporated 

by the heat while the solder is molten. Activator loses its activation 

by reducing the metal oxide layer or is simply degraded by 

the heat. In reflow soldering, activator is consumed by repeatedly 

removing the oxide layer as the solder re-oxidizes during long preheat 

to molten stage. Simultaneously, activator is degraded by heat. 

Thus, solder paste for reflow soldering is designed to contain 

enough activator to assure sufficient wetting while it also provides 

the insulation resistance of its flux residue. 

On the other hand, laser heating lasts only about 1 second which 

causes more solvent and activator to remain in its residue. Therefore, 

solder paste for laser soldering must be designed based on a 

different concept than for reflow soldering to avoid unfavorable impact 

on the reliability. Since the solder does not re-oxidize as much 

during the laser soldering, solder paste for reflow soldering can be 

used in laser soldering. However, since there will be high content of 

residual solvent and activator in the flux residue, there is a possibility 

where proper insulation resistance could not be assured. Therefore, 

it is not encouraged to use a conventional solder paste for reflow 

in laser soldering for reliability reasons. The company developed 

a solder paste for laser soldering with flux reliability in mind. 

To confirm the flux residue reliability of this solder paste, namely, 

S3X58-M330D, an insulation resistance test was conducted. Test 

board was prepared by printing S3X58-M330D on the combs on a 

comb-pattern test board using a 150 μm thick stencil with 0.318 mm 

aperture. Printed solder pastes are then soldered by laser to produce 

flux residue from laser soldering. Insulation resistance test 

was conducted with bias voltage applied to this test board. Test 

board was then placed in a chamber maintained at 85 °C/ 85 %RH 

for 1000 hours with bias voltage of 50V. Measured insulation resistance 

was sufficiently high at over 10 9 Ω. 

Visual observation of the test board revealed no evidence of migration 

occurrence; therefore, it is confirmed that high insulation reliability 

could be assured by using S3X58-M330D with laser soldering. 

Solder paste designed to reduce capillary ball 

In this paper, it was shown that capillary ball can be reduced by 

using a linear type laser soldering profile. However, conventional 

solder pastes for dispensing applications are designed to be low viscosity 

to ensure smooth dispensing. Therefore, they tend to contain 

considerable amount of substance which is prone to heat slump, 

namely, solvent or resin. As similar to the activators, these ingredients 

also tend to remain in the flux residue when heated by laser 

compared to the reflow, and contribute to capillary ball occurrence. 

If the laser soldering is implemented under the optimal condition, 

capillary ball can be reduced; however, such condition’s process 


Beim Laserlöten, ein neues Lötverfahren, werden thermische 

Schäden an umliegenden sensiblen Bauteilen vermieden. Der Artikel 

diskutiert die Unterschiede zwischen dem Laserlöten und den 

bestehenden Löttechnologien. 

Résumé 

Nouveau procédé, le brasage au laser permet d‘éviter les dommages 

thermiques pouvant toucher les composants sensibles environnants. 

L’article traite des différences entre le brasage au laser 

et les technologies de brasage existantes. 

Резюме 

Лазерная пайка — достаточно новая технология — 

предотвращает термическое повреждение чувствительных 

компонентов, расположенных по соседству В статье 

рассматриваются отличия лазерной пайки от традиционных 

технологий. 




Solder paste comparison: 

S3X58-M330D 

laser soldering paste 

and a paste not specifically 

for laser. 

window is so small and may not be able to correspond to any 

change in soldering condition, such as specific heat. 

A solder joint was formed by a linear type profile using 

S3X58-M330D as well as a solder paste for dispensing application, 

which is not specifically designed for laser soldering. Capillary ball 

was not observed under any condition with S3X58-M330D. However, 

in the one out of three conditions, the not-for-laser solder 

paste showed capillary ball occurrence. This showed that capillary 

ball is unavoidable with solder paste that is not designed for laser 

soldering, even if the process profile is optimized to reduce the capillary 

ball. To the contrary, the company’s solder paste contains the 

most suited type of activator and resin in the right amount for its 

purpose. As a result, its capillary ball is minimal, and it is compatible 

with wider range of laser emission. 

Conclusion 

1. Laser soldering applies heat in a different method, so consideration 

must be made to not only the specific heat of the target, etc. 

but also the absorption coefficient of the laser light. 

2. Laser soldering profile must be determined for each soldering target. 

Due to its short preheat time and rapid heating nature, the specific 

heat of a target has significant impact on the soldering result. 

3. Laser soldering tends to be a rapid heating in order to reduce the 

cycle time and it is prone to capillary ball occurrence. This can be reduced 

by using a linear type laser soldering profile. 

4. Since the laser heats up solder paste quickly, residual flux constituents 

in flux residue is drastically different from the conventional 

soldering method. Consequently, a separated flux residue reliability 

evaluation for laser soldering must be conducted. 

5. S3X58-M330D is designed for laser soldering; therefore, it can 

obtain sufficient insulation reliability even with a short laser heating 

duration. 

6. The paste produced fewer capillary balls compared to the conventional, 

no-laser compatibility solder paste and allows wider laser 

profile window. 


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Conformal coating line 

Equipment and process 

control for optimal efficiency 

In today’s competitive marketplace, manufacturers face significant pressure to meet consumer demand 

with reliable products. Many new products are designed to work in extreme environmental conditions that 

can affect performance and reliability. Conformal coating serves as an insulation layer that ensures that 

the components on a printed circuit board or in a module can achieve the functionality they were designed 

for, rather than being a cause of a premature failure. They protect electronics from external factors, such 

as extreme heat, humidity, moisture, and dust and from internal factors, such as circuit board corrosion, 

whisker growth, and shorts within the system. Applied correctly, conformal coating increases product 

yield and reliability, especially in harsh environments. 

Camille Sybert, Product Marketing Engineer, Nordson Asymtek 

In the automotive and mobile electronics industries, meeting the 

standards and requirements for high reliability has become critical. 

With an increased emphasis on Industry 4.0 and automation, there 

is a pressing need to address the entire conformal coating process 

as one system. Not only must the system be able to apply conformal 

coating, but it also must support overall process tracking and 

traceability. Everything that goes into the assembly of these electronic 

systems must be recorded and monitored so the process can 

be researched retrospectively and the specific source of the problem 

can be identified if an issue arises. 

Process as a whole 

When talking about conformal coating, the tendency is to focus on 

the conformal coating machine, but conformal coating is an entire 

process in itself. This includes maintaining the coating quality, 

choosing the correct curing process for that coating, and inspecting 

the coating so that it is applied correctly before the printed circuit 

board or device heads to the next part of the assembly process. Increasingly, 

manufacturers are moving to full conformal coating line 

solutions that combine coating, curing, and inspection capabilities 

with closed-loop process controls and traceability to meet demand 

and deliver consistent product reliability. 

Closed-loop controls, or the move to more automated operator-less 

factories, are based on requirements for equipment to be more independent 

and self-monitoring. Corrections and adjustments are 

made internal to the machine or system without operator intervention. 

With automated coating inspection, a lot of operator subjectivity 

can be removed by setting pass/fail criteria around what is being 

inspected. There is verification that the coating material is placed 

where intended and not placed where it’s not intended, and that the 

final product is within the accepted tolerance. The same is true with 

ovens and other systems having closed-loop controls to make sure 

that temperature is being appropriately regulated to avoid an incomplete 

cure that may potentially cause other concerns and considerations. 

The benefit of a complete line is that not only can these 

pieces of equipment collect data and gather information, but that

BAMFIT by F&S BONDTEC 

Select Coat SC-350 select spray applicator delivers superior edge definition and 

uniform coating thickness at high speeds. 

Source: Nordson Asymtek 

>> BAMFIT is a completely new test 

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>> Suitable for Al wires 100 μm – 

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they‘re able to share this data and information with other equipment 

in the line, so the system can take action on that information. 

Choosing the optimal conformal coating line configuration is determined 

by the type of board and application, the desired cycle rate, 

and the coating material. The quality of the process is influenced by 

the edge definition, coating thickness, and adhesion of the material to 

the substrate. Eliminating coating problems starts with a high-quality 

conformal coating system. Some requirements to consider are the 

materials being used and the type of applicators to best apply them. 

Closed-loop system 

Other process controls relate to fan width, temperature, and flow. 

Laser fan width control maintains coating width, independent of fluid 

viscosity, and provides data logging for statistical process control. 

Viscosity control is especially important because the fluid must remain 

at a constant consistency and thickness for proper flow rate 

and application, despite viscosity fluctuations due to the manufacturing 

environment. For example, Qadence flow control, a closed-loop 

system that combines conformal coating hardware and software, 

automatically compensates for viscosity changes related to temperature, 

humidity, and batch-to-batch variation, maintaining stable fluid 

application, flow rates, and performance. Fluid delivery methods, 

such as atomized, non-atomized, and precision jetting and whether 

the application needs single or multiple applicators with simultaneous 

and/or toggling capabilities, should be taken into account. 

The type of curing system selected should be based on factors such 

as desired cycle rate, temperature constraints for the board or part, 

and the curing mechanism needed. Conformal coating inspection 

considerations are the ability to verify coating thickness, to inspect 

coated and non-coated areas within defined limits and around fillets, 

selective bubble detection, and the ability to inspect the sides 

of the components. Facility requirements, such as available floor 

space and ventilation, should also be considered. 

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Visit us at productronica 

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Phone: +43-7722-67052-8270 

Fax: +43-7722-67052-8272 

E-Mail: info@fsbondtec.at 

www.fsbondtec.at


There are many advantages to having a conformal coating line. First 

and foremost is improved quality and reliability. Process controls 

and monitoring occur at every process step – coating, coating inspection, 

and curing. Quality increases because an automated line 

with process controls and closed-loop feedback replaces physically 

handling the product and variations in manual inspection results, 

makes adjustments to coatings and settings, and reduces operator 

intervention. Process feedback is redundant -- every process has 

some level of control and multiple control systems are in place 

along the line. 

Qadence flow control closed-loop system automatically compensates 

for viscosity changes. 

Coating inspection 

The system works as one unit. The results from automated coating 

inspection (ACI), for example, help operators monitor the process in 

real time and enable them to make on-the-fly adjustments. There is 

more flexibility in configuring the line, so inspection can be done before 

cure, after cure, or both. By inspecting before cure, issues can 

be fixed in the coating process, making rework easier. Rework is 

more difficult if inspection is done after curing, but after cure inspection 

catches problems that may have occurred in the curing step. 

Many of the solvent-based materials used in coating have high volatile 

organic compounds (VOCs). There is an initiative in the industry 

to make conformal coating a safer, more environmentally friendly 

process. Having one line makes it easier to address environmental 

needs by managing and removing the VOCs. 

Creating the configuration for the coating process line with a development 

team lets you develop a program and check the process before 

coating begins. Having a single source for maintenance, repair, 

and support also streamlines the operation and is more cost efficient. 

Working with a single supplier eliminates time spent communicating 

and coordinating between suppliers. Instead, efforts can 

be focused on overseeing the process, ensuring the equipment is 

installed to your requirements, and ramping up production. It eliminates 

finger-pointing between upstream and downstream equipment 

suppliers and there is technical support across the entire line when 

and where it’s needed. 

Automated coating line 

With the many advantages and industry emphasis on conformal 

coating as a process, and as a logical extension of its existing conformal 

coating systems and lines, Nordson Asymtek introduced the 


Panorama S-Line, the first fully automated conformal coating line. A 

flexible, modular system, it enables you to select the equipment 

and layout you need today and scale the system as demand increases. 

It also provides a turn-key coating solution with a single 

supplier with global support for the entire process. The line delivers 

conformal coating process control in a compact footprint, with overlapping 

line processes, such as heated return or flash-off in the 

lower compartment of each piece of equipment, minimizing manufacturing 

floor space use up to 50 %. The closed-loop systems within 

the line stabilize and track the process, eliminate variations, validate 

coating results, and capture up-to-the-minute process data 

with FIS/MES integration. 

Panorama S-Line includes a Select Coat SL-940 conformal coating 

system with an exhaust conveyor or IR-9 module in the lower deck 

area. EasyCoat 6 software enables intuitive, visual programming as 

well as off-line programming capabilities. Included in the line is an 

FX-940UV ACI module to confirm in real time that the conformal 

coating is being properly applied. It, too, is fully integrated with the 

FIS/MES data capture system. 

The Select Cure IR-9 module performs both top and bottom material 

curing and can handle mid- to high-volume production environments. 

It is the final step in conformal coating automation and ensures 

that the applied coating doesn’t migrate, remains unblemished, 

and that damage wasn’t introduced through handling. Failures 

such as shrinkage, solvent entrapment, orange peel, and bubbles 

can occur if the coating material isn’t appropriately cured. Curing, 

however, takes time and can impact operator safety. The Panorama 

line addresses these concerns by introducing ovens that “dry” 

boards, safely vent VOCs, block UV light, and support high production 

throughput. Having a flash-off capability in each module eliminates 

bubbles by allowing time for excess solvent to evaporate before 

a coated board enters the curing oven. Ventilation for flash-off 

can be incorporated within the line, distancing operators from 

fumes and fluids. 

To optimize the Panorama line, modules for loading/unloading, 

board flipping, and lifting are available. Using a line loader/unloader 

module, operators can feed new PCBs into the process line and un- 


Richtig angewendet erhöht die konforme Beschichtung als Isolationsschicht 

die Produktausbeute sowie Zuverlässigkeit insbesondere 

in rauen Umgebungen, und stellt so sicher, dass Elektronik nicht 

vorzeitig ausfällt. 

Résumé 

Correctement appliqué comme couche isolante, le revêtement conforme 

augmente le rendement des produits ainsi que leur fiabilité 

notamment dans des environnements difficiles, évitant ainsi toute 

panne électronique précoce. 

Резюме 

Правильно нанесенное конформное покрытие, выступающее в 

роли изоляционного слоя, повышает выход продукции и ее 

надежность, в частности, при эксплуатации в суровых 

условиях, и снижает вероятность преждевременного выхода 

из строя электроники. 




The Panorama S-Line modular automated conformal coating line. With an increased emphasis on Industry 4.0 and automation, there is a need to address the entire 

conformal coating process as one system. 

load finished products simultaneously. The module is available in different 

lengths and can be equipped with an operator touchscreen 

and an exhaust or IR-9 module in the lower deck. The boards are 

loaded in the middle of the coating line, giving a single operator the 

ability to load and unload production products from one location. 

The flip module flips boards automatically to allow both sides 

of a board to be coated without operator intervention, reducing 

board-handling requirements and increasing yield. The boards are 

then transported efficiently between the upper and lower decks in 

the line using the lift module. This modular system can be configured 

for each specific application and location. 

Summary 

A fully automated, configurable, conformal coating line solution 

offers a synergistic approach to stabilizing coating variations. It provides 

control and ensures an efficient and accurate process from 

beginning to end. It streamlines the coating process, is cost efficient, 

and increases throughput and yield. Incorporating coating, 

curing, and inspection in one conformal coating line provides the 

right balance of equipment and process control for optimal conformal 

coating efficiency. Panorama fulfills the speed, throughput, and 

stringent quality demands of today’s electronics applications and Industry 

4.0 requirements. 


www.nordsonasymtek.com



Depaneling unit with smart interfaces 

The Divisio 5100 has smart 

interfaces that allow modules 

to be integrated without 

programming effort. The controller 

takes over the parameters 

of the module and 

adapts the setup, test and 

production sequences of the 

system accordingly. 

Smart features make 

the difference 

The depaneling unit supports 

predictive maintenance and 

thus achieves maximum 

availability. This means that 

maintenance is adapted to 

the machine condition in 

order to avoid unnecessary 

interruptions during operation. 

Due to intelligent and 

networked sensors within 

the system, comprehensive 

process control is possible. 

Data is collected and evaluated 

to enable continuous 

process optimization. 

„Solid mechanical engineering, 

profound process experience 

and a comprehensive 

competence in depaneling 

distinguish the Divisio 

portfolio. The new generation 

of the 5100 series represents 

high productivity in 

panel processing. Simple 

maintenance and operation 

as well as in combination 

with a palletizing system and 

autonomous transport robots 

make the concept unparalleled“, 

says Philipp 

Schmidt, Product Manager. 

productronica, 

Booth A3-277 

www.asys-group.com 

The Divisio 5100 controls maintenance and optimization processes as 

required and with foresight. 

Source: Asys 

Solution for turning heat into data at productronica 

At productronica, KIC will discuss their 

RPI i4.0 solution, which is a reflow process 

inspection and monitoring system. 

At productronica, KIC Europe will 

discuss Industry 4.0 automation, 

traceability, NPI setup, and machine 

verification, all for thermal 

processes; reflow, wave solder 

and cure. RPI i4.0. is a simple solution 

and a great way to start the 

Industry 4.0 journey, changing heat 

to data on a reflow oven. 

Actionable data is needed across a 

manufacturing line to make well informed 

decisions. Not only is data 

collection on most machines available, 

but it is also possible to receive 

inspection results after printing 

with a SPI, after placement or 

at the end of the line with an AOI. 

But what about reflow? The next 

level of inspection for the reflow 

process has been introduced with 

the RPI i4.0. Knowing that a reflow 

temperature profile is monitored to 

maintain process control and 

Source: KIC 

quality solder joints for every product 

running through an oven is a 

must. This critical data should be a 

part of the smart factory solution 

to ensure all oven production is 

within specifications and that profile 

data is available for each board. 

The RPI i4.0 automatically acquires 

profile data from each PCB soldered 

in the reflow or curing oven, 

in real-time. Along with NPI setup 

and machine verification tools, and 

profile datalogging, this ecosystem 

offers real-time thermal process 

dashboard and traceability, reduced 

scrap and rework, fast defect 

troubleshooting, lower electricity 

use and more. Browser 

based data search and analytic features 

also save time. 


www.kicthermal.com 

IPTE is exhibiting at 

PRODUCTRONICA 2019 

in Muenchen Germany 

12 - 15 November 2019 

Hall A1 | Booth 534

AR Human 4.0 debut at productronica 

Source: Cogiscan 

The FactoryOptix, from Aegis Software, integrates human assembly 

operations into the automated Industry 4.0 environment, using Augmented 

Reality to deliver FactoryLogix paperless work-instructions. 

The human operator is a flexible production asset, and yet is excluded 

from implementations of manufacturing automation. The 

FactoryLogix, IIoT-driven MES, brings 2 digital worlds in 1 solution, 

for automation featuring the IPC CFX, and for human assembly, test 

and inspection operations featuring AR.FactoryOptix can double the 

productivity of human operators, simply by enabling the use of both 

hands at all times. The latest 

AR hardware has good battery 

life and is light enough to 

allow long-term usage. AR 

glasses provide step-by-step 

instructions, with confirmation 

from the operator that each 

operation is done. Feedback is 

captured using voice recognition 

for commands, with barcodes 

read by the glasses 

when instructed to do so. 


www.aiscorp.com 

Debuted at productronica 2019, FactoryOptix 

can double the productivity of 

human operators with the help of Augmented 

Reality. 

Source: Aegis Software 

Cogiscan will discuss TTC solutions at productronica in Munich, Germany. 

TTC solutions to productronica 2019 

Cogiscan, a provider of Track, Trace and Control (TTC) solutions for 

the electronics manufacturing industry, is attending productronica 

2019. Taking place in Munich, Germany, the company will be co-exhibiting 

with their German sales and service partner, pb tec. 

The company helps customers achieve sustainable Industry 4.0 

goals with: 

• Connectivity 

• Data management 

• Material & process control 

• 360 ° traceability 

•Analytics 

The company has created TTC solutions to help electronics manufacturers 

improve productivity, reduce waste, and in doing so, leverage 

higher margins. Offering leading machine and systems connectivity 

solutions is their way to ensure that companies remain futureproof 

through this fast-paced, ever-changing industry. 


www.cogiscan.com 

Visit us at Productronica Munich 

Thermal management solutions 

that perform when the heat is on 

With a consumer requirement for ever-more diminutive devices and an expectation 

of improved efficiency and power, effective thermal management materials have 

become an increasingly essential part of product development. 

From bonding and non-bonding thermal interface materials, to thermally conductive 

resins, our solutions offer the ultimate level of protection and heat dissipation. 

With an expansive product range and a strong emphasis on research and 

collaboration, we provide a complete electro-chemical solution to the world’s 

leading manufacturers across a variety of industries. 

Isn’t it time you discovered how Electrolube can serve you? 

Simply call, or visit our website. 

Hall A4, Stand 466 

+44 (0)1530 419600 

www.electrolube.com 

Scan the code to discover our full 

spectrum of superior Thermal Management 

and electro-chemical solutions. 

Electronic & General 

Purpose Cleaning 

Conformal 

Coatings 

Encapsulation 

Resins 

Thermal Management 

Solutions 

Contact 

Lubricants 

Maintenance 

& Service Aids 


TEST + QUALITY ASSURANCE 

Ensuring safety in mobile energy production 

Resistance welder 

for quality assurance 

In an age in which it‘s almost impossible to imagine life without 

mobile devices and gadgets, batteries are more important than 

ever before. Consumers expect battery-powered electronic devices 

to function reliably even under demanding conditions. In 

order to meet these requirements, Varta Consumer is carrying 

out extensive testing at its site in Ellwangen, Germany. The 

company recently started using welding equipment from Avio, 

which is represented by Hilpert electronics in the DACH region 

and its neighbouring areas. 

Varta is an acronym of the German “Vertrieb, Aufladung, Reparatur 

transportabler Akkumulatoren“ (distribution, recharging 

and repair of transportable accumulators), and their success story 

began in the Swabian Alps. When a consumer sees the blue square 

with a yellow triangle, they immediately recognise the brand — and 

this is not unique to Germany and Central Europe. For more than 

130 years, Varta Consumer Batteries has been synonymous with reliability, 

innovation and progress „Made in Germany“. 

For branded batteries, reliability is key 

To keep up with consistently high demand for “mobile power“, 

around 1.6 billion alkaline batteries are produced with the „Made in 

Germany“ seal each year at the company‘s production plant in Dischingen, 

Germany. Varta Consumer Batteries also produces a 

number of other high-quality, innovative products, including rechargeable 

batteries, chargers, lamps and power banks. The company 

is therefore able to provide retailers with impressive sales displays 

with a full range of products — all of which must meet the highest 

standards of quality. 

At their QA laboratory in Ellwangen, six employees are responsible 

for performing various tests, including a vital safety test in which a 

metal lug or wire is welded to both poles of the battery to create a 

short circuit. The welding machine that had been used for these 

A cross section of an alkaline battery. 

tests for years was due to be replaced by a more modern, compact 

model. This upgrade was overseen by engineers, Matthias Dörrer 

and Jürgen Balle, who were first made aware of the resistance 

welders from Japanese manufacturer, Avio, at a local conference. 

The company requires two leads to be welded to approximately 100 

batteries per week. Forming an optimum connection and being able 

to reproduce the results of the process reliably are important factors 

for the company. For the actual test, the short-circuited cells are 

stored in special containers and cabinets for 24 hours. The batteries 

must not explode, as is sometimes the case with cheaper products. 

All tests are carried out in accordance with a comprehensive, internationally 

valid set of rules and are carefully documented according 

to production batch. Performing multiple tests on the batteries ensures 

that no serious damage is caused when the batteries used 

under the most demanding conditions or if the batteries are used incorrectly. 

Source: Varta Consumer Batteries GmbH & Co. KGaA 

Batteries being discharged at a test station. 

Source: Hilpert electronics 

Welding the metal lug. 




The first step of the test is completed. 


Matthias Dörrer of Varta Consumer and Axel Tschumi of Hilpert electronics. 


A prepared test object. 

Impressive test results 

Two key expectations the company had of the supplier were that 

the right solution should be delivered as quickly as possible and that 

good after-sales support must be guaranteed. In one of the initial 

conversations, the performance requirements and the previous process 

were discussed. It quickly became clear that if Axel Tschumi 

was looking for a more powerful device, the NRW-DC150 plus with 

NA-142 welding head would be the perfect solution for meeting all 

customer requirements. 

In order to form their own opinion, the Varta project managers gladly 

took Avio up on the offer of trying out the devices with their own 

cells and connectors at the Hilpert demo centre in Baden-Dättwil, 

Switzerland. In one day of testing, the company used the equipment 

to produce a range of welded connections. A subsequent 

evaluation in the laboratory showed positive results in favour of Avio 

and Hilpert electronics. 

The desired result with minimum effort 

The welding device was installed within two weeks of the order. 

The plug-and-play design and easy handling meant that the device 

could be commissioned immediately and with no need for additional 

training. The processes for day-to-day use in the field were 

quickly adjusted using initial pull-off and shear tests and could easily 

be adapted to specific requirements. When asked, an operator 

stated that she very much appreciated the new device. It is easy to 

operate, compact and features a practical base that allows the same 

process to be adopted for different types of battery. 

The first step of the process is to insert the battery into a fixture. 

The connector is then placed on the pole by hand and a foot pedal is 

used to apply a defined pressure to the electrode. The welding process 

is triggered automatically when the set pressure is reached. 

The cell is then rotated 180 ° and the process is repeated for the 


other pole. Once all test objects have been prepared, the metal lugs 

are twisted, and the cell is placed in the test container. 

Both Dörrer and Balle felt that they received good advice from Hilpert 

and that the company had expertise in the field. They were especially 

impressed by the opportunity to test different resistance 

welding generators using different profiles at the Hilpert demo 

centre, as this helped them make their decision. The cost-benefit 

ratio of the NRW-DC150 was also a deciding factor. Customers may 

also carry out tests using their own material free of charge at any 

time — and they can come back and seek out the expertise of the 

Avio application specialists for new applications. 

Even the distributor is impressed. According to Axel Tschumi, product 

expert, “It‘s always good and helpful for a customer to take advantage 

of the free trial at our demo centre. Specific tests can be 

carried out under realistic conditions using their own sample parts 

and with the help of an experienced technician. This benefits all parties 

involved, as a customer-specific system configuration and suitable 

parameter settings can be defined before the customer invests 

in the technology. This makes it very rare for the planned solution to 

be unworkable at the customer‘s premises. This knowledge of the 

customer‘s requirements minimises subsequent complaints and 

dissatisfaction. We are very pleased to be able to count another global 

player among our satisfied customers and thank Varta Consumer 

for this successful collaboration“. 

www.hilpert.ch; www.varta-consumer.com 


Verbraucher erwarten, dass batteriebetriebene elektronische Geräte 

auch unter anspruchsvollen Bedingungen zuverlässig funktionieren. 

Um diese Anforderungen zu erfüllen, setzt ein Batteriehersteller 

Widerstandsschweißgeräte zur Qualitätssicherung ein. 

Résumé 

Les consommateurs attendent que les appareils électroniques alimentés 

par piles fonctionnent de manière fiable, même dans des 

conditions difficiles. Afin de répondre à ces exigences, un fabricant 

de batteries utilise des équipements de soudage par résistance 

pour garantir la qualité. 

Резюме 

Потребители ожидают, что электронные устройства, 

работающие от аккумуляторов, не подведут даже в сложных 

условиях. Для выполнения этих требований производитель 

аккумуляторов использует оборудование контактной сварки, 

позволяющее обеспечить высокий уровень качества.


Source: Seica S.p.A. 

is possible to automate the reverse engineering process with the Pilot V8 Next Series tester. 

Automated process generating full data package 

Reverse engineering for flying 

probe systems 

In the electronics industry, the concept of reverse engineering (RE) represents 

the process used to understand how a device, object, or system has been 

designed: it allows redesigning the technical construction through the analysis 

of its structure, function and operation. 

Referring to an electronic board, the reverse engineering process 

consists of: 

• Netlist regeneration; 

• XY target coordinates: test point/pad/pin/via center; 

• Bill of Materials (BOM) regeneration; 

• PCB CAD file regeneration; 

• Schematic diagrams regeneration. 

Why use reverse engineering 

In military aerospace and partially in telecommunication, railway and 

electronic manufacturing industries, there are pieces of equipment 

with a long lifecycle: up to 40 years or more. Over this time, electronics 

can stop working or the electronic manufacturer can even 

leave the business. When spare parts are not available or very expensive, 

it is then mandatory to repair faulty boards. 

If the electronic board is very old, the manufacturing data or schematics 

could have been lost. This means that repairing a board can 

be a very long, frustrating and expensive task, if data isn’t available. 

In this case, reverse engineering can be the only solution. 

Accordingly, one of the main reasons for reverse engineering is to 

build spares in similar environments where the manufacturer itself 

has lost the board data or when it does not exist anymore. This process 

also allows the user to repair, copy, clone, test or redesign a 

PCB module, despite the CAD data not being available. 

Methods used for reverse engineering 

Mainly, two different methods can be used to rebuild the netlist of a 

board. 

Optical method: Easy with simple double-side PCBs. In the past, 

this was the only method available. In case of multi-layer boards, to 

rebuild tracks and netlist visually, highly specialized companies 

would remove each layer from the PCB. This process was very time 

consuming and expensive. 

Electrical method: Between two points, a short means that these 

belong to the same net. Theoretically, a continuity test between 

each point and all the others, provides all the information concerning 

the netlist. Nevertheless, the total continuity test is very high: 

500,000 tests for a board with 1000 pins. Which isn’t easy for a 

human. The electrical method can be divided into two other categories: 

• Capacitive measurement, which is almost obsolete and unused. 

• Dynamic impedance measurement, which acquires the net signature 

of an analog dipole. 

Automatizing reverse engineering 

This long process can be automized with the Pilot V8 Next Series 

tester by Seica. The PCB accessibility on both sides is a preliminary 

and mandatory condition to fully rebuild the netlist because this is 

the only way to learn the connections between SMT components 



on opposite sides. The vertical architecture is the best mechanical 

damping because board vibrations are not increased by the force of 

gravity. Sophisticated but easy-to-use algorithms drastically decrease 

the total amount of tests, reducing the total reverse time 

and costs. The rebuilt data is ready to use to generate a test program 

by automatic procedures. 

Board analysis 

Thanks to multiple inspection and analysis techniques, the Viva software 

may operate both on mounted and bare boards. The reverse 

engineering can have a destructive or a non-destructive approach. 

The first method will destroy the device during the test procedure, 

while the non-destructive process retains full functionality of the device 

under test after the analysis. The Pilot V8 Next Series> tester 

features a non-destructive method, although the following exceptions 

must be taken into account and solved: 

• Microchips with BGA packages with the pins below the component, 

because it is necessary to expose the components with no 

accessibility. 

• Protective coating that is a thin polymeric film applied to a printed 

circuit board (PCB). 

The result of the netlist auto-learning procedure depends on the real 

accessibility of the probes on the test points. It is possible to analyze 

the following types of electronic boards: 

• Bare board: this condition provides a complete and reliable learning 

of all the netlists on the PCB. Moreover, the check of the data 

learned is relatively easy and fast. 

• Partially mounted board: to enhance the accessibility and minimize 

the subsequent manual operations, it is recommended to remove 

those components which prevent the access to some pads. 

• Fully assembled board: in this case, the limited accessibility to the 

pads may require the execution of manual netlist learning using 

the dedicated tools available in the Viva software. 

Board layout learning 

At this point, with the so-called “net-oriented test methods”, it is 

possible to extract the netlist using only a golden board. 

Autolearning: Dual side board digitalizing 


Die im Artikel vorgestellten Flying-Probe-Systeme sind nicht nur 

flexible Werkzeuge zum Testen von Boards. Sie können auch im 

Reverse Engineering sehr nützlich sein, sowohl für die Prüfung als 

auch für die Ableitung von technischen Entscheidungen auf der 

Grundlage von Endprodukten. 

Résumé 

Les systèmes à sondes mobiles présentés dans cet article ne sont 

pas seulement des outils flexibles pour tester les cartes. Ils peuvent 

également être très utiles en rétroingénierie, tant pour les essais 

que pour les décisions techniques basées sur les produits finis. 

Резюме 

Рассмотренные в данной статье системы на базе летающих 

щупов являются не только гибкими инструментами для 

тестирования плат. Они также могут быть крайне полезны при 

обратном проектировании как для тестирования, так и для 

принятия технических решений на основе конечных 

продуктов. 

A signal generator applies a frequency sweep to pin1 while pin2 

is connected to GND. 

The CCD color cameras, available on each side of a Pilot V8 flying 

prober, digitalize two detailed images of the top and bottom sides of 

the board. The company has developed several manual and automatic 

routines that identify the XY location coordinates using the 

built-in AOI system. There are four modes for auto-learning all the 

points and components of a board: manual, automatic, connector 

and component. This technique reproduces the full layout and it is 

useful for data processing and analysis, either online (auto-learn) in 

the system or offline (digitizer) on a remote PC. 

Netlist learning 

The first step is to manually identify at least one GND point. Similarly, 

the user can determine the VCC point if it is useful for the netlist 

analysis. Once the user has classified the GND signal, the “netlist 

learning” process on the flying prober can start with the Fnode 

macro. 

The company employs a proprietary dynamic impedance measurement 

method designated as Fnode, which acquires the net signature 

of an analog dipole. This powerful test method is used to 

measure the dynamic impedance of an unknown dipole to recognize 

and separate all the nets of a mounted board. From that, it creates 

a suitable number of continuity tests. 

Since each dipole of the UUT is unknown, an “auto-learn” of the 

golden board is used to acquire the behavior of the dipole over a 

broad frequency range. 

The typical input signal amplitude is 0.2 V to be below the P-N transition 

threshold and to avoid nonlinear distortions, as well as, to avoid 

guarding (electrically isolating the net environment to perform an individual 

measurement on a single component). The Fnode 

measures the current which flows into the dipole and, in each case, 

the amplitude and the phase for each net is stored by the test program. 

The Fnode is a purely passive measurement procedure, with 

no power on the UUT. 

The advantages of Fnode are easily summarized: 

• It does not need any CAD data and no manual debug is necessary. 

• The auto-learn process is fully automatic and creates a full shorts 

test with higher fault coverage than the traditional adjacency test. 

Moreover, many in-circuit measurements can be avoided without 

decreasing test coverage. 

This procedure utilizes a DSP-based (Digital Signal Processor) multifunction 

instrument, which digitizes the generated and measured 

signals. The acquired data enable the almost simultaneous execution 

of multiple, high-speed tests, because the test models are 

“hardware-emulated”, substantially increasing the test throughput. 

EPP EUROPE November 2019 107 

Source: Seica S.p.A.


Continuity macro 

If two or more nets have the same current signature, the next step 

is to execute the continuity test. The main goal of the continuity 

macro, optimized to work in sets of 1000 tests each, is to group the 

test pads belonging to the same net. This procedure is also capable 

of detecting as separate nets the signals connected to low impedance 

(e.g. inductors, resistances at 0 Ohm…) when belonging to 

two-pin components regularly declared in the graphic environment 

edit board of the Viva software. 

Power monitor 

At this point, it is necessary to acquire the signatures/functions of 

the digital components. Once the GND and VCC inputs have been 

identified, the UUT is powered on to execute the Power Monitor 

(PWMON). It is possible to measure the current needed to produce 

logic 0 or logic 1 on each node (input pin of a digital component). 

This way, the threshold is learned, and the system can recognize a 

possible error on a net. Using this method, a “golden board” is not 

necessary but strongly recommended. 

The advantages of PWMON are summarized as follows: 

• It is a vector less method to test ICs in a powered-up condition. 

• It can be generated without CAD data. 

• It does not require manual operations, since it is a fully automatic 

procedure and it is independent of the UUT initialization conditions 

(when the UUT is powered on). 


The green depicts the voltage applied between the net under test and ground, 

while the magenta shows the current signature of the net. 

Schematics creation (from Viva to Elgris) 

The final step of the reverse engineering is to export data from Viva 

to Elgris E-studio in order to generate the schematics in .PDF 

format. 

Conclusion 

As a result, the company’s flying probers are not only flexible tools 

used to test boards. They can also be very useful in reverse engineering, 

both for testing and deducing engineering decision-making 

based on end products of which little knowledge about the procedures 

involved in the original production is available. The flying 

prober is equipped with specific software and hardware characteristics 

and algorithms, which enable the generation of a comprehensive 

test program without CAD data or a bill of materials. The unique 

software tools and mechanical capabilities of the flying prober allow 

the facilities for assigning test points and entering component information, 

so that a full data package can be generated for future 

production builds, field repairs, or contractual obligations. 

productronica, Booth A1-445, A3-337, B3-570 

www.seica.com 

Data verification 

When the netlist learning procedure has been completed, it is possible 

to check the results, to analyze and verify the data. The company 

provides tools that generate a list of points, connectors and 

components, electrically isolated from the netlist (capacitors, resistances, 

…). 

Test program creation 

Once the netlist learning procedure has been completed, along with 

the possible manual connection of some nets, the task carried out 

may be employed to create a test program for repair activity purposes, 

and/or create the data to be employed to rebuild the board 

schematics. 


Giada Ferraro graduated with 

honors in Electronic Engineering 

at the Politecnico of Turin in 

2017. 

She started her career at Seica 

S.p.A. (Italy) in 2017 as an application 

engineer, working especially 

in the functional test 

environment. 

After one year of experience, 

she moved to the new Pre-Sales 

and Product Development 

group. 

Giada and her colleagues cooperate 

with internal departments 

to fulfill the terms of the 

contract between Seica and the 

customer and investigate the industry 

trends to upgrade the 

brand knowledge. 



2D-bottom side AOI 

An ultra-fast, inline way to 

inspect PCBs 

Bottom-side automated optical inspection (AOI) has become an important addition to the printed 

circuit board assembly (PCBA) process. This has been driven by the stringent quality requirements for 

circuit boards and modules in the automotive industry and by EMS companies, where inspection is 

necessary after selective and wave soldering. Along with this, demand has come the necessity to 

automate the process, have more standardization, and to accommodate larger boards and clearance 

for taller components and larger connectors. Bottom-side inspection is used in the SMT process after 

reflow, pin-in-paste, and in the backend process for PCB assembly after selective soldering, reflow, 

and wave soldering. 

Ikumi Sugawara, Saki Europe 

The need for bottom-side AOI came at the 

same time that selective soldering became 

more popular. A majority of the components 

placed on a circuit board are applied using surface 

mount technology. However, in the automotive industry, 

the circuit boards contain more throughhole 

parts that need soldering. Automated selective 

soldering equipment became popular to 

solder the through-hole parts on the bottom-side 

of the board. Bottom-side inspection was also 

needed after dipping and wave soldering. 

Bottom-side inspection 

Historically, through-hole inspection was done 

manually by an operator or semi-automated, often 

using 2D bench top systems where the PCB was 

inserted by hand. There was little standardization 

in the electronics assembly industry so there 

were considerable variations from process to process 

and customer to customer. Standardizing the 

inspection operation and specifications was difficult. 

Because the process was operator-dependent, 

it not only lacked accuracy and consistency, it 

could also result in contamination and mishandled 

boards. Another drawback was that the inspection 

process was slow. Without automation, how could 

the inspection process be viable? 

2D and 3D automated optical inspection of the top 

side of a PCBA has been around for a long time. In an effort to inspect 

the bottom-side, some companies manually flipped the board 

and then placed the boards into an AOI system. While this was a 

way to provide quality inspection of the bottom side, once again 

handling and contamination problems arose. Some companies 

added flippers to the line, but the added step of flipping decreased 

throughput. 

2Di-LU1 bottom-side AOI system. 

Solution for market demand 

Although Saki has had equipment to inspect both sides of a circuit 

board since 2015, the systems weren’t designed to handle today’s 

larger boards and taller components. As more customers started to 

request a bottom-side inspection system that could accommodate 

these new conditions, the company looked at ways to adapt its 





Images obtained from bottom-side AOI inspection. 

The Fujiyama algorithm shows soldering defects. 

proven 2D line-scan technology and latest AOI systems to a 2D bottom-side 

AOI inspection system that could solve their inspection 

requirements. 

The result was the 2Di-LU1 2D automated bottom-side inspection 

system. It accommodates L-size 500 x 460 mm and 610 x 610 mm 

frames and handles tall components with clearances of 130 mm on 

the top side and 40 mm on the bottom. There are two different 

handling systems, a standard conveyor belt and a chain, and it’s 

equipped with space for return conveyor availability on the bottom 

side of the machine. The machine can carry up to 12 kg of PCB 

weight, which is suitable for a soldering jig frame operation. 


Easy software configuration 

The 2Di-LU1 software includes the company’s proprietary Fujiyama 

algorithm, which provides complete through-hole joint inspection in 

a single step. It simultaneously inspects for copper exposure, pin 

detection, pin-holes, solder fillet abnormalities, missing components, 

soldering problems, and bridges. Inspection is not only performed 

for through-holes; a complete AOI inspection is done for parameters, 

such as polarity. Extra Component Detection (ECD) inspects 

for scratches, contamination, solder balls, and other foreign 

objects during the through-hole device inspection process. The programming 

is very easy -- just specify the area of interest and target 

size. Auto tuning, which optimizes inspection parameters automatically 

based on an SPC approach, is also available. ECD has been 

used in the automotive industry for several years and complies with 

the IPC-A-610 standard. 

Saki invented 2D line-scan technology in 1994 and has continued to 

perfect it. It can scan a circuit board in one pass, capturing an entire 

400 mm x 400 mm board’s field of view in less than 8 seconds, making 

it a fast through-hole inspection system. This speed is critical for 

takt time in the wave soldering process. By eliminating the loading 

and unloading process for flipping, it can keep up with the line 

speed needed in the automotive industry and increase throughput. 


Da der Markt die Automatisierung in der Baugruppen-Backendproduktion 

weiter beschleunigt, ist die Realisierung der Smart Factory 

oder Industry 4.0 unerlässlich, wozu eine gemeinsame Softwareplattform 

für SPI und AOI geschaffen wurde. 

Résumé 

Le marché ne cesse d‘accélérer l‘automatisation de la back-end 

production des composants et rend essentielle de mettre en œuvre 

les modèles Smart Factory ou Industry 4.0. Une plate-forme logicielle 

commune pour SPI et AOI a été créée à cet effet. 

Резюме 

Рынок продолжает стремительно развиваться в направлении 

автоматизации производства бэкенда узлов, поэтому 

концепции умного производства или индустрии 4.0 все чаще 

реализуются на практике. Именно для этого и была 

разработана общая программная платформа для систем 

контроля нанесения паяльной пасты (SPI) и оптического 

контроля качества (AOI). 




PCBA back-end production line. 

Having an automated inline system saves the cost of using an operator 

and reduces time and floorspace. As with all Saki inspection 

systems, the platform starts with a solid base and stable construction, 

so the platform can withstand vibrations, while axes stay 

aligned during operation. Also, images are clear, there is greater 

noise resistance, and the data secured by the system remains accurate. 

There is less hardware, so diagnostics are simple, and the cost 

of the hardware is lower. 

The camera system gives excellent image contrast, quality, and a 

clear image. Coaxial top lighting reduces shadowing for effective 

solder joint inspection. Since the through-hole inspection algorithm 

uses gray scale analysis for solder inspection, the coaxial top lighting 

provides better contrast on the soldering fillet, which extends 

the inspection capability of the through-hole solder joint. 

The software is integrated to function similarly to the company’s 

other AOI and solder paste inspection (SPI) systems, with the same 

easy and simple GUI. The solder meniscus is evaluated based on 

gray scale analysis and checks for the highest and lowest deviation 

in the soldering pad (360 degrees). This is based on the searched pin 

location, which will make soldering inspection more accurate. Programming 

is easy and based on through-hole location data, which 

can be transferred to the off-line teaching system. Manager and 

Logger options are available, which are necessary for M2M connections. 

For consistency and reliability, process parameters are easily 

input, monitored, and maintained, with notifications provided to ensure 

that the system and process are operating smoothly. 

Speeding inspection process 

Incorporating bottom-side AOI into the assembly process increases 

productivity by reducing the time, costs, labor, and floorspace 

needed for manual inspection, additional conveyors, or equipment 

to flip the board. The company’s system speeds the inspection process, 

increases throughput, and eliminates extra PCBA handling 

and the risk of substrate damage. 

As the market continues to accelerate automation in PCBA backend 

production, realizing the Smart Factory or Industry 4.0 is essential. 

Towards that end, Saki created a common software platform for 

SPI and AOI. Now their bottom-side AOI can also connect to other 

systems in back-end production. In the future, PCBA back-end production 

will have a similar configuration to an SMT production line, 

connecting other systems to feedback or feedforward information 

of defect points, to have better control of production quality. Together 

with the company’s advanced SPC and reporting feature, not 

only in the SMT production line, but also PCBA, back-end production 

will bring a comprehensive perspective to improving product 

quality in the production line. 






Stand-alone modular camera for more flexibility 

The C12s digital camera is a modular version of its predecessor, which includes 

a standalone camera format for more flexibly. 

Inspectis AB launched the C12s digital camera, a modular version of 

the original Inspectis C12. The C12s offers a standalone camera 

format in a system for those requiring a flexible and cost-effective 

solution for visual inspection across all subjects. 

The C12s camera uses the same large sensor unit as the original, 

delivering vivid images with auto focus and 12 x zoom, can be 

mounted on any of the extensive range of the company’s stands, 

and uses the available lighting and lens accessories to achieve the 

desired viewing conditions. Further accessories such as tilt stands, 

XY tables can be added for optimum object handling. 

Cost effective and featuring superior optics and 12:1 optical zoom, 

the C12s is designed into a robust industrial-grade aluminum housing 

for HD image quality. It produces pictures of inspection objects 

up to 90 x magnification directly onto an LCD monitor or PC. 

Due to the large size of its image sensor and pixel elements, the 

C12s provides excellent image rendering of such structures as 

solder joints on PCB assemblies with minimum glare and reflection. 

It offers ease of use with minimal interaction needed. All basic parameters 

such as zoom, brightness and color levels can be controlled 

through on-board buttons on top of the device or an optional remote-control 

pad. With these features, camera and lens attributes 

are all controllable, and features including zoom factor display and a 

crosshair overlay on the live image can be turned on. 


www.inspect-is.com 

Source: Inspectis AB 

PCBA cleaning process verification system 

Verinas verification system for PCBA cleaning was developed due to 

lack of monitoring methods for the stability of cleaning. Cleaning 

under components, critical for reliability, has become a challenge. 

Ionic contamination test cannot measure cleaned PCBA correctly 

because the solvent and impingement of the test fluid cannot dissolve 

these residues from gaps under components. The first precondition 

for clean assembly is the lack of any visible residues. 

Therefore, PBT Works s.r.o. has developed a Glass Test Board 

(GTB), which visually checks the residues under components. 

This consists of a glass with 400 pcs of 0805 chip models with spacing 

300 μm and gap under chips 60 + - 5 μm. Chips are sealed with a 

patented process, which enables repeated underfilling of GTB with 

flux from solder paste, passing reflow oven and cleaning. 

GTB is not built for the maximal capability of cleaning; it is for process 

stability monitoring. The proper result of cleaning is, therefore, 

about 50 % of residues remaining under components on the GTB. 

The AOI tester, Verinas can detect the clear flux residues under 

components of GTB and calculate a percentage rate of flux residues 

under each chip of GTB separately. One test gives 400 readings, 

which is enough to get validated data on average cleaning results. 

Verinas verification can be used for: 

1: comparing the solubility of different flux residues in the cleaner 

2: machine capability study, which includes process chamber uniformity 

check or uniformity in time check 

3: Process capability study 

4: Process change validation (acc. to IPC J-STD 001 Add. 01) 


www.pbt-works.com 

PBT Works s.r.o. has developed 

a Glass Test Board (GTB), which 

enables to visually check the 

residues under components. 

Source: PBT Works s.r.o.

Future-oriented investment in high-quality X-ray tubes 

Viscom has invested in microfocus X-ray tubes, which includes 

three X-ray laboratories with certified radiation safety up to 300 kV 

and 1500 W. This expansion brings further development in the direct 

radiation and transmission tube segments. 

Microfocus X-ray tubes are distinguished by their small focal spot 

size, which generates sharp images. A center for X-ray tubes has 

also been established, where development, production, final inspection 

and customer-specific adaptation of the tubes take place. 

Two of the three areas shielded from radiation are used for putting 

products into service shortly before delivery. Continuous tests and 

stress tests can be conducted simultaneously on two separate data 

processors and controllers. The third laboratory is used for the development 

of tubes and the corresponding individual components. 

Microfocus X-ray tubes are used in high-quality inspection systems, 

which are deployed for quality control in electronics manufacturing. 

They are also used in X-ray laboratories and installed as components 

in premium machinery. Thus, a wide range of objects, from 

small workpieces to entire car bodies, can be reliably inspected and 

measured, also in combination with X-ray computer tomography. 

Both direct radiation and transmission tubes with voltages of up to 

250 kV are offered. Approvals and permits are available for operation. 

„The right product selection is based on the desired performance 

range, the required resolution and the intended application,“ 

explained Christian Wolff, Global sales of X-ray solutions. 

Inspection of the interface to the X-ray controller on a microfocus transmission 

tube. 

Microfocus X-ray tubes extend up to a max. of 500 W for fast inspections 

or, as an option, high inspection quality for large and solid 

objects. According to Wolff, “The outstanding versatility of the X-ray 

tubes is a unique selling point in the market. Our XT9250D-500W 

offers high resolutions as well as inspection optimized in terms of 

time, which is important when used in production lines.” 

In addition to product adaptations, customized tubes can be developed. 

They can be equipped with cooling systems or a radiation 

shield. The VXC operating software controls the X-ray process. 

Other software applications then take over further steps via interfaces, 

including image analysis and 3D reconstruction – like the 

XMC software, which is available for manual inspection systems. 



Source: Viscom AG 

See you at 

PRODUCTRONICA 2019, 

Nov. 12th – 15th 

Hall A1 

Booth 321 

PEMTRON 

ZEUS 

2019 NEW 

3D AOI Series 

launch! 

• High Accuracy die inspection without problems 

due to reflection 

• Best 3D wire Bonding AOI Inspection System 

• Best 3D Inspection system for Advanced Packaging 

• Wafer Bumper 3D AOI 

• Wire Bonding 3D AOI 

broken wire flatten wire shorted wire 

www.pemtron.com 

sales@pemtron.com

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ISSN 1618–5587 

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