productronica Guide 2019

HALL A4 / BOOTH 506
Advertorial
Industry 4.0 automation and traceability for your thermal processes;
reflow, wave solder, cure.
KIC: #1 solution for turning
heat into data
Is it smart manufacturing if you skip
reflow data collection, one of the key
elements of the assembly? Are you
covering all your inspection data
requirements; SPI, RPI (Reflow Process
Inspection), AOI?
The growth of Industry 4.0 has stimulated
an immense amount of activity in electronics
manufacturing. Process transparency,
traceability, predictive technologies, embedded
sensing, edge computing are commonplace
topics. The key is to make sure
you have actionable data across the manufacturing
line to make well informed decisions.
There is data collection on most machines
and in addition inspection results possible
after printing with SPI, after placement
with AOI, and at the end of the line with AOI.
But what about reflow? Now you can have
complete inspection process information by
including Reflow Process Inspection, RPI.
With RPI i4.0, KIC has introduced the next
level of inspection, on the reflow process.
Knowing that your production reflow temperature
profile is inspected and monitored
to maintain process control, traceability,
and quality solder joints for every product
Heat to Data with RPI – REFLOW PROCESS INSPECTION
run through your oven is a must. This critical
data should be a part of your overall Industry
4.0 smart factory solution to insure
all production through the oven is within
specifications and that profile data is readily
available for each individual board. A
simple solution and a great way to start
your Industry 4.0 journey, changing heat to
data on your reflow oven, with RPI i4.0. KIC
– making ovens smarter.
KIC Europe
Phone: +393421479460
info.europe@kicmail.com
www.kicthermal.com
EPP productronica Guide 2019 19