Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary
Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary
Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
8.0 <strong>ispMACH</strong> <strong>4000</strong><strong>ZC</strong>/<strong>ZE</strong> ADDITIONAL FAMILY DATA<br />
Table 8.1: <strong>ispMACH</strong> <strong>4000</strong><strong>ZC</strong>/<strong>ZE</strong> Package Assembly Data – csBGA/ ftBGA<br />
Package Attributes /<br />
Assembly Sites ASEM Amkor UNISEM UTAC<br />
Die <strong>Family</strong> (<strong>Product</strong> Line) <strong>ispMACH</strong> <strong>4000</strong> <strong>ispMACH</strong> <strong>4000</strong> <strong>ispMACH</strong> <strong>4000</strong> <strong>ispMACH</strong> <strong>4000</strong><br />
Fabrication Process<br />
Technology<br />
EE9<br />
(180nm CMOS)<br />
EE9<br />
(180nm CMOS)<br />
30<br />
EE9<br />
(180nm CMOS)<br />
EE9<br />
(180nm CMOS)<br />
Package Assemble Site Malaysia Philippines Singapore Singapore<br />
Package Type<br />
csBGA/ucBGA/<br />
csBGA/caBGA/<br />
csBGA csBGA<br />
Ball Counts 56/64/132 56/132 56/132 56/132<br />
Die<br />
wafer saw, full wafer saw, full wafer saw, full wafer saw, full<br />
Preparation/Singulation<br />
cut<br />
cut<br />
cut<br />
cut<br />
Ablebond 2100 Ablebond 2300 Ablebond 2100 Ablebond 2300<br />
Die Attach Material<br />
Series<br />
Series<br />
Series<br />
Series<br />
Mold Compound<br />
Sumitomo / Sumitomo / Sumitomo / Sumitomo /<br />
Supplier/ID<br />
G770 Series G770 Series G770 Series G770 Series<br />
Wire Bond Material Gold (Au) Gold (Au) Gold (Au) Gold (Au)<br />
Thermosonic Thermosonic Thermosonic Thermosonic<br />
Wire Bond Methods<br />
Ball<br />
Ball<br />
Ball<br />
Ball<br />
Bismaleimide Bismaleimide Bismaleimide Bismaleimide<br />
Triazine HL83X Triazine HL83X Triazine HL83X Triazine HL83X<br />
Substrate Material<br />
Series<br />
Series<br />
Series<br />
Series<br />
L/F Plating or BGA Ball<br />
Sn96.5/Ag3.0/<br />
Cu0.5<br />
Sn95.5/Ag4.0/<br />
Cu0.5<br />
Sn96.5/Ag3.0/<br />
Cu0.5<br />
Sn95.5/Ag4.0/<br />
Cu0.5<br />
SnAgCu solder SnAgCu solder SnAgCu solder SnAgCu solder<br />
Lead Finish<br />
ball<br />
ball<br />
ball<br />
ball<br />
Marking Laser Laser Laser Laser<br />
INDEX Return
Change language