Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary

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6.0 ispMACH 4000 Soft Error Rate Data Soft Error Rate (SER) testing is conducted to characterize the sensitivity of EECPLD storage and device registered logic elements to High Energy Neutron and Alpha Particle radiation. Charge induced by the impact of these particles can collect at sensitive nodes in the device, and result in changes in the internal electrical states of the device. While these changes do not cause physical damage to the device, they can cause a logical error in device operation. All testing conforms to JEDEC JESD-89. Table 6.1 ispMACH 4000 MEASURED FITs / Mb Stress / Structure REGISTERED LOGIC EECLPD Neutron 0.6 0 Alpha N/A 0 Note: Detailed SER data is available upon request. INDEX Return 28
7.0 ispMACH 4000 PACKAGE ASSEMBLY INTEGRITY TESTS 7.1 Wire Bond Shear Test This procedure is used to measure the wire bond strength at the ball joints. Thirty bonds from a minimum of five devices were used for Wire Bond Shear. WIRE BOND SHEAR TEST RESULTS: All bond shear observations were > 15 grams for TQFP and csBGA packages tested. The average measured bond shear results for TQFP were Cpk of > 3.7 and Ppk of > 3.7. The average measured bond shear results for 132 ball csBGA were Cpk of > 8.9 and Ppk of > 6. 7.2 Wire Bond Pull This procedure is used to measure the wire bond strength at the ball joints and stitch bonds. For products evaluation thirty bonds from a minimum of five devices were used for and Wire Bond Pull. Test conditions for these tests were 6 grams minimum for 1.0 mil gold wire WIRE BOND PULL RESULTS: All bond pull observations were >6 grams for TQFP and csBGA packages tested. The average measured wire bond pull results for TQFP were Cpk of > 2.0 and Ppk of > 2.1. The average measured wire bond pull results for 132 ball csBGA were Cpk of > 5.3 and Ppk of > 2.6. 7.3 Solderability This procedure is used to evaluate the solderability of device terminals normally joined by a soldering operation. An accelerated aging test is included in this test method, which simulates natural aging under a combination of various storage conditions that have deleterious effects. Units are exposed to a 8 hour steam preconditioning followed a flux exposure for 7 seconds and a dip in Pb-free solder alloy @ 245 °C ± 5°C for 5 seconds. Minimum of 22 leads from 3 devices per lot were tested with zero failure acceptance. No failures were observed for ispMACH 4000 devices in TQFP packages. All the tested units passed. There was less than 5% pitting and dewetting on the solder covered area. 7.4 Physical Dimensions Devices were measured using the appropriate Lattice Semiconductor case outline drawings. The 10 devices of TQFP from 3 different lots were measured with no failures found. The calculated Cpk on this small sample is Cpk > 9.6. The 132 ball csBGA calculated Cpk is > 6.1 and Ppk > 2.4. 7.5 Solder Ball Shear For the csBGA ten devices from three lots were tested. All units were exposed to two surface mount reflow simulations. The 132 ball csBGA packages use a 0.40 mm barrier metal diameter. All ball shear observations were > 315 grams. The average measured ball shear results for 132 ball csBGA packages post reflow stress were Cpk of > 1.9 and Ppk of > 1.4. Note: Mach4K 132 csBGA packages are qualified by extension from LatticeXP2 devices. ucBGA is qualified by extension. 29
Page 1 and 2: ` Lattice ispMACH 4000 ZC/ZE Produc
Page 3 and 4: INDEX 1.0 INTRODUCTION ............
Page 5 and 6: Table 1.2 Lattice ispMACH 4000ZC Pr
Page 7 and 8: Figure 2.1: ispMACH 4000ZC/ZE Produ
Page 9 and 10: Table 2.2: Standard Qualification T
Page 11 and 12: 3.0 QUALIFICATION DATA FOR ispMACH
Page 13 and 14: High Temperature Storage Life (HTSL
Page 15 and 16: 3.4 ispMACH 4000ZC/ZE Product Famil
Page 17 and 18: Latch-Up: ispMACH 4000 product fami
Page 19 and 20: Table 4.2 LA-ispMACH 4000ZC (Automo
Page 21 and 22: Assembly Lot Reflow Product Name Pa
Page 23 and 24: Assembly Lot 250 500 1000 Product N
Page 25 and 26: 4.4 THB: Biased HAST Data Highly Ac
Page 27: Table 5.2 - Wafer Level Reliability
Page 31 and 32: Table 8.2: ispMACH 4000ZC/ZE Packag

Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary

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