Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary

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Dear Customer, Welcome to the Lattice Semiconductor Corp. ispMACH 4000ZC/ZE Product Family Qualification Report. This report reflects our continued commitment to product quality and reliability. The information in this report is drawn from an extensive qualification program of the wafer technology and packaging assembly processes used to manufacture our products. The program adheres to JEDEC and Automotive Industry standards for qualification of the technology and device packaging. This program ensures you only receive product that meets the most demanding requirements for Quality and Reliability. This report is another member of a new generation of Product Qualification Summary Reports. The information contained in this document is extensive, and represents the entire qualification effort for this device family. Our goal is to provide this information to support your decision making process, and to facilitate the selection and use of our products. As always, your feedback is valuable to Lattice. Our goal is to continuously improve our systems, including the generation of this report and the data included. Please feel free to forward your comments and suggestions to your local Lattice representative. We will use that feedback carefully and wisely in our effort to maximize customer satisfaction. Sincerely, Michael J. Gariepy VP – Reliability and Quality Assurance LATTICE SEMICONDUCTOR CORP. 2
INDEX 1.0 INTRODUCTION ................................................................................................................................................. 4 Table 1.1 Lattice ispMACH 4000ZE Product Family Attributes ................................................................................. 4 Table 1.2 Lattice ispMACH 4000ZC Product Family Attributes ................................................................................. 5 Table 1.3 Lattice Automotive LA-ispMACH 4000ZC Product Family Attributes ........................................................ 5 2.0 LATTICE PRODUCT QUALIFICATION PROGRAM .......................................................................................... 6 Figure 2.1: ispMACH 4000ZC/ZE Product Qualification Process Flow ..................................................................... 7 Table 2.2: Standard Qualification Testing ................................................................................................................. 9 3.0 QUALIFICATION DATA FOR ISPMACH 4000ZC/ZE PRODUCT FAMILY .................................................... 11 3.1 ISPMACH 4000ZC/ZE PRODUCT FAMILY LIFE DATA .................................................................................................. 11 Table 3.1.1: EE9 Product Family HTOL Results ..................................................................................................... 11 3.2 ISPMACH 4000 PRODUCT FAMILY HIGH TEMPERATURE DATA RETENTION (HTRX) AND HIGH TEMPERATURE STORAGE LIFE (HTSL) DATA ................................................................................................................................................................ 12 Table 3.2.1: EE9 High Temperature Data Retention Results .................................................................................. 12 Table 3.2.2: EE9 High Temperature Storage Life Results ...................................................................................... 13 3.3 ISPMACH 4000 PRODUCT FAMILY ENDURANCE CYCLING DATA .................................................................................. 14 Table 3.3.1: EE9 Endurance Cycling Results ......................................................................................................... 14 3.4 ISPMACH 4000ZC/ZE PRODUCT FAMILY – ESD AND LATCH UP DATA ....................................................................... 15 Table 3.4.1 ispMACH 4000ZC/ZE (Commercial/Industrial) ESD-HBM Data .......................................................... 15 Table 3.4.2 LA-ispMACH 4000ZC (Automotive) ESD-HBM Data ........................................................................... 15 Table 3.4.3 ispMACH 4000ZC/ZE (Commercial/Industrial) ESD-CDM Data .......................................................... 16 Table 3.4.4 LA-ispMACH 4000 (Automotive) ESD-CDM Data ................................................................................ 16 Table 3.4.5 ispMACH4000 I/O Latch Up Data ........................................................................................................ 17 Table 3.4.6 LA-ispMACH4000 (Automotive) I/O Latch Up Data ............................................................................. 17 4.0 PACKAGE QUALIFICATION DATA FOR ISPMACH 4000ZC/ZE PRODUCT FAMILY ................................. 18 Table 4.1 ispMACH 4000ZC/ZE Product-Package Qualification-By-Extension Matrix ........................................... 18 Note: All packages are qualified by an extension from the largest package and largest die in that package technology.Table 4.2 LA-ispMACH 4000ZC (Automotive) Product-Package Qualification-By-Extension Matrix ... 18 Table 4.2 LA-ispMACH 4000ZC (Automotive) Product-Package Qualification-By-Extension Matrix ...................... 19 4.1 ISPMACH 4000ZC/ZE PRODUCT FAMILY SURFACE MOUNT PRECONDITIONING TESTING ............................................. 20 Table 4.1.1 Surface Mount Precondition Data ........................................................................................................ 20 4.2 – ISPMACH 4000ZC/ZE PRODUCT FAMILY TEMPERATURE CYCLING DATA ................................................................. 22 Table 4.2.1: Temperature Cycling Data .................................................................................................................. 22 4.3 UNBIASED HAST DATA ............................................................................................................................................. 24 Table 4.3.1: Unbiased HAST Data .......................................................................................................................... 24 4.4 THB: BIASED HAST DATA ........................................................................................................................................ 25 Table 4.4.1: Biased HAST Data .............................................................................................................................. 25 5.0 ISPMACH 4000 PROCESS RELIABILITY WAFER LEVEL REVIEW ............................................................. 26 Table 5.1 – Wafer Level Reliability Results for Seiko EE9 (180nm) Process Technology ...................................... 26 Table 5.2 – Wafer Level Reliability Results for UMC EE9 (180nm) Process Technology....................................... 27 6.0 ISPMACH 4000 SOFT ERROR RATE DATA ................................................................................................... 28 Table 6.1 ispMACH 4000 MEASURED FITs / Mb ................................................................................................... 28 7.0 ISPMACH 4000 PACKAGE ASSEMBLY INTEGRITY TESTS ........................................................................ 29 7.1 WIRE BOND SHEAR TEST .......................................................................................................................................... 29 7.2 WIRE BOND PULL ..................................................................................................................................................... 29 7.3 SOLDERABILITY ........................................................................................................................................................ 29 7.4 PHYSICAL DIMENSIONS ............................................................................................................................................. 29 7.5 SOLDER BALL SHEAR ................................................................................................................................................ 29 8.0 ISPMACH 4000ZC/ZE ADDITIONAL FAMILY DATA ...................................................................................... 30 Table 8.1: ispMACH 4000ZC/ZE Package Assembly Data – csBGA/ ftBGA .......................................................... 30 Table 8.2: ispMACH 4000ZC/ZE Package Assembly Data- TQFP ......................................................................... 31 3
Page 1: ` Lattice ispMACH 4000 ZC/ZE Produc
Page 5 and 6: Table 1.2 Lattice ispMACH 4000ZC Pr
Page 7 and 8: Figure 2.1: ispMACH 4000ZC/ZE Produ
Page 9 and 10: Table 2.2: Standard Qualification T
Page 11 and 12: 3.0 QUALIFICATION DATA FOR ispMACH
Page 13 and 14: High Temperature Storage Life (HTSL
Page 15 and 16: 3.4 ispMACH 4000ZC/ZE Product Famil
Page 17 and 18: Latch-Up: ispMACH 4000 product fami
Page 19 and 20: Table 4.2 LA-ispMACH 4000ZC (Automo
Page 21 and 22: Assembly Lot Reflow Product Name Pa
Page 23 and 24: Assembly Lot 250 500 1000 Product N
Page 25 and 26: 4.4 THB: Biased HAST Data Highly Ac
Page 27 and 28: Table 5.2 - Wafer Level Reliability
Page 29 and 30: 7.0 ispMACH 4000 PACKAGE ASSEMBLY I
Page 31 and 32: Table 8.2: ispMACH 4000ZC/ZE Packag

Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary

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