Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary
Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary
Lattice ispMACH 4000 ZC/ZE Product Family Qualification Summary
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TEST STANDARD TEST CONDITIONS SAMPLE SI<strong>ZE</strong> PERFORMED ON<br />
(Typ)<br />
Moisture <strong>Lattice</strong> Procedure Biased to maximum 45 devices/lot Design, Foundry<br />
Resistance # 70-101571, operating Vcc, 85° C, 2-3 lots Process, Package<br />
Temperature JESD22-A101B 85% Relative Humidity,<br />
<strong>Qualification</strong><br />
Humidity Bias<br />
1000 hours<br />
85/85<br />
Plastic Packages only<br />
THBS<br />
or<br />
Biased to maximum<br />
or<br />
operating Vcc, 2atm.<br />
Biased HAST JESD22-A110B Pressure,<br />
BHAST<br />
96 hrs, 130 C,<br />
85% Relative Humidity<br />
Physical<br />
Dimensions<br />
Wire Bond<br />
Strength<br />
<strong>Lattice</strong> Procedure<br />
# 70-100211,<br />
MIL-STD- 883 Method<br />
2016 or applicable<br />
LSC case outline<br />
drawings<br />
<strong>Lattice</strong> Procedure<br />
# 70-100220<br />
Solderability <strong>Lattice</strong> Procedure<br />
# 70-100212,<br />
MIL-STD-883, Method<br />
2003<br />
INDEX Return<br />
Measure all dimensions<br />
listed on the case<br />
outline.<br />
Per package type 15 devices per<br />
pkg. per year<br />
Steam Pre-conditioning<br />
4-8 hours. Solder dip<br />
at 245°C+5°C<br />
10<br />
5 devices Package <strong>Qualification</strong><br />
22 leads/<br />
3 devices/<br />
Package family<br />
Design, Foundry<br />
Process, Package<br />
<strong>Qualification</strong><br />
All packages except<br />
BGAs
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