Cyntec HM Series POL (Point of Load) Solution

Cyntec HM Series 

POL (Point of Load) Solution

UMPC / NBPC 

Major Applications for POL 

Cell Phone / PDA 

Server Systems 

Power supplies / systems 

IPC 

UPS 

Networking Systems

Adapter 

Application in NB PC Power System 

19V 

Battery 

Charger 

Battery 

Cell 

16.8 V for 4 cell 

12.6 V for 3 cell 

DC/DC 

LDO 

DC/DC 

SMPS 

DC/DC 

SMPS 

DC/DC 

SMPS 

DC/DC 

SMPS 

DC/DC 

SMPS 

DC/DC 

SMPS 

5V 

DC/DC 

LDO 

3V 

5V, 3A - 5A 

3.3 V, 3A - 5A 

1.8 V, 5A 

1.5 V, 7A 

1.05 V, 7A 

Vcore , 40A 

DC/AC 

Inverter 

Standby power 

Power sequence 

AC/DC DC/DC 

Systwm Device, 

SMPS 

USB, LAN, PCI 

Target Application 

System Device, 

USB, LAN, PCI 

DDR Memory 

ICH/VGA 

MCH/ICH 

CPU 

LCD backlight

Benifits of Cyntec POL Solution 

� Size reduction at least 30% 

� Excellent thermal performance 

� High Reliability / Efficiency 

� Standardization 

-Shorten design cycle 

- Part counts reduction 

- Reduce material control efforts

Technology Transference from Infineon in 

2002

Cyntec Packaging Technology Platform 

Signal part 

• PCB 

• Lead frame 

• Thin film 

• Thick film 

Power part 

• DCB 

• Metallization substrate 

• Lead frame 

• IMS 

Encapsulation 

• Transfer molding 

• Casing 

Magnetic part 

• Molding choke 

• Wiring choke 

Inter connection 

• Au wire 

• Al wire 

• Soldering die bond 

• Ag adhesive

Magnetic Technology in POL Package 

Process Technology: MEMS 

Major Competitor: Enpirion 

Application: High frequency 

Strength: 

- Small size 

- Low profile 

Constraint: 

- Low inductance 

- High resistance 

- Low saturated current


Process Technology: LTCC 

Major Competitor: Taiyo Yuden, … 

Application: High frequency 

Strength: 

- Small size 

- Low profile 

Constraint: 

- Low inductance 

- High resistance 

- Low saturated current


Process Technology: Molding 

Major Competitor: Cyntec, Linear, 

Enpirion, …… 

Application: Medium frequency 

Strength: 

- High inductance 

- High saturated current 

- Low eddy current 

- High power density 

Constraint: 

-Large size

Cyntec’s Cyntec s v.s. Vishay’s Vishay s winding patents 

Cyntec’s winding patent: 

Start outside, end outside 

- Approved: Taiwan 

- In process: China, USA, Japan 

Vishay’s winding patent: 

Start inside, end outside

Know How of Powder Materials 

PCMC powder PCMB powder 

SEM 3000x SEM 200x 

Cyntec owned Know How: 

1. Material combination for performance requirements 

2. Insulated coating technology 

3. Binder system

Simulation Capability 

Structure Simulation 

– Software : ANSYS 

– Capability : 

�Warpage simulation 

�Thermal stress simulation 

�Fatigue simulation 

�Thermal simulation 

Thermal Simulation 

– Software : FLOTHERM 


�Steady-state temperature 

distribution simulation 

�Transition temperature 

distribution simulation

Thermal experimental equipments 

Free convection chamber 

• Temperature Range: 

Room Temperature~80°C 

Thermal wind tunnel 

• Flow Speed: 5m/sec Max. (984.25LFM Max.) 

• Temperature Range: 

Room Temperature~75°C 

Testing Condition: 

Follows JEDEC EIJ/JESD 

51 Standards

Simulation Capability 

• Magnetic Simulation 

– Software : Maxwell 3D 


�B/H Field simulation 

�Core-loss simulation 

�Inductance simulation 

�Saturation Current simulation

Cyntec POL Package Solution 

For High Current Applications 

Requirements: 

• Low thermal resistance 

• Low connection resistance 

• Low profile, Compact size 

Cyntec solution: QFN Package 

• Package size: 15x15 mm 

• Good thermal performance 

• Heat can easily dissipate via 

copper leadframe 

• 7A and 10A application 

• Patent in process!! 

PCB 

leadframe 

Choke

Cyntec POL Package Solution 

For Small Current Applications 

Requirements: 

Low profile, Compact size 

Cyntec Solution: PLCC Package 

• Package size: 11x8.5 mm 

• 3A & 5A application 

• Patent in process !!

Cyntec HM series POL Product Family 

Part Number 

HM03145 


Voltage Range 

( for PWM IC ) 

Input : 1.8V – 25V 

Output : 0.5V - 5V / 3A 

Input : 1.8V – 25V 

Output : 0.5V - 5V / 5A 

Input : 1.8V – 25V 

Output : 0.5V - 5V / 7A 

Input : 1.8V – 25V 

Output : 0.5V - 5V / 10A 

Size(mm) Output line 

11*8.5*3.85 

HM05175 11*8.5*4.15 



15*15*3.5 

Note : HMxxxx5 is Semtech PWM IC solution.

Application Circuit for HM10105

Features of Semtech PWM IC SC411 Solution 

Constant on-time Control 

Features: 

Vin : 1.8 V ~ 25V. 

Vout : 0.5V ~ 5V. 

+5V bias demand. 

Power good indicator. 

Power saving mode option. 

Internal soft start. 

OVP, UVP, OCP, OTP. 

Integrated bootstrap diode. 

Constant on-time control.

Cyntec HM series PWM IC Solution 

Application Maker Parts Vin / Vout Control Protection Others Function 

Portable Appliance: 

Note-book 

UMPC 

PDA 

General Appliance: 

Industrial PC 

Server system 

Networking system 

Semtech 

Intersil ISL6269 

TI TPS51117 

Intersil 

SC411 

ISL8105 

ISL6341 

Vi: 1.8V~25V 

Vo: 0.5V~5V 

Vi: 1.8V~25V 

Vo: 0.5V~5V 

Vi: 1.8V~24V 

Vo: 0.75V~5V 

Vi: 1V~20V 

Vo: 0.6V~5V 

Vi: 1.5V~25V 

Vo: 0.8V~5V 

Constant 

on-time mode 

(Variable freq.) 

Hysteretic 

mode 


Constant 

on-time mode 


Voltage mode 

(Fixed freq.) 

Voltage mode 

(Fixed freq.) 

OCP: Latch-off 

OVP, UVP 

OTP 


OVP, UVP 

OTP 


OVP, UVP 

OTP 

OCP: Hiccups 

OCP: 

Hiccups 

Latch-off 

OVP, UVP 

On/Off 

Power saving mode 

option 

Internal soft-start 

On/Off 


option 

Pre-biased start-up 


On/Off 


option 


On/Off 



On/Off 


Internal soft-start

Power Saving Operation at Light Load 

Vin 

Cin 

Q1 

Q2 enable 

Q2 

Lo 

Q2 disable 

Q2 enable 

Cout Rload 

Low-side Low side MOSFET was 

disabled when inductor current 

below 0.5A. It could save the 

power loss at light load 

current . 

Inductor current 

High-side High side MOSFET Vgs 

Low-side Low side MOSFET Vgs

Improvement Efficiency at Light Load 

Efficiency (%) 

90 

85 

80 

75 

70 

65 

60 

55 

50 

45 

40 

Condition: 19Vin / 1.5Vout, Fs = 300k Hz, 

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 

Load Current (A) 


With PSV 

Without PSV 

The efficiency could be improved on 40 % at light load, 

when power saving mode is active.

Demo Board for QFN and PLCC Package

Transient Response for HM10105 

Condition: 19Vin / 1.5Vout, Fs = 300k Hz, Io = 1A to 9A, Slew rate: rate: 

2.5A/uS 

Cout = 330uF*1, 22uF*3, 1uF*1, 0.1uF*1 

Test Method: Method 

Short loop measurement 

50mV / div 

2A / div 

Vp-p Vp = 73mV 

Transient time = 8uS

Ripple / Noise Voltage for HM10105 

Condition:Cout 

Condition Cout = 330uF*1, 22uF*3, 1uF*1, 0.1uF*1 

Without power saving mode 

19Vin / 1.5Vout, Fs = 245k Hz, Io = 0A 

Ripple / Noise = 52mV 

No Load 

With power saving mode 

19Vin / 1.5Vout, Fs = 16 Hz, Io = 0A 


No Load 




Full Load 




Full Load

Line / Load Regulation for HM10105 

Symbol Parameter Conditions measurement Spec Units 

ΔV OUT /ΔV IN 

ΔV OUT /ΔI OUT 

Line regulation 

accuracy 

Load regulation 

accuracy 

Line regulation testing result: 

Vin = 3V to 25V 

Vout = 1.5V, Iout = 0A 

Vout = 1.5V, Iout = 10A 

Iout = 0A to 10A 

Vin = 3V, Iout = 0A, �� Vout = 1.5036V 


Load regulation testing result: 



Vin = 19V, Vout = 1.5V 

Vin = 12V, Vout = 1.5V 

0.0655 

0.0668 

0.154 

0.137 

0.1 

0.1 

Vin = 1.8V, Iout = 10A, �� Vout = 1.4927V 




1 

1 

% 

% 

%

Major Competitors In Market 

Linear LTM4600 Enpirion EN5360 Cyntec HM10105

Cyntec QFN Type POL HM10105 

PCB 

leadframe 

Choke 

Features: 

Wide input range: 1.8V~25V 

High efficiency 

The best thermal resistance of existing 

products. Heat can easily be dissipated via 

copper leadframe. 

Low profile, compact size : 15X15X3.5mm 

Patent in process

Competitor Structure – Linear LTM4600 

Package size: 15x15x2.8 mm 

Input range: 4.5V~28V 

Poor thermal performance 

due to PCB LGA package

Competitor Structure – Enpirion EN5360 

Package size:17x8.1x2.13 mm 

Input range: 2.375V~5.5V 

Poor efficiency 

Poor thermal performance 

due to PCB DFN package


Efficiency Comparison of HM10105 V.S. LT4600 

100 

90 

80 

70 

60 

50 

40 

30 

20 


Efficiency vs. Load Current 

with 12Vin 

0 1 2 3 4 5 6 7 8 9 10 

Load current (A) 

Vout=1.5V 

Vout=2.5V 

Vout=3.3V 

LT4600 

HM10101

De-Rating De Rating Curve 

Comparison of HM10105 V.S. LT4600 

HM10105 LT4600 

Vin = 12V, Vout = 3.3V Vin = 12V, Vout = 3.3V

Efficiency Comparison of HM07105 V.S. EN5360 

Effic iency (%) 

100 

95 

90 

85 

80 

75 

70 

65 

60 

55 

50 

45 

40 

35 

30 

25 

20 

15 

10 

5 

0 


0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 


Vin = 3.3V, Vout = 2.5V 

Vout=2.5V (without PSV) 

Vout=2.5V(with PSV) 

Efficiency: 90.2% 

at Iout = 7A 

EN5360 

Efficiency: 84% 

at Iout = 6A

MAXIMUM LOARD CURRENT 

8 

7 

6 

5 

4 

3 

2 

1 

0 

De-Rating De Rating Curve 

Comparison of HM07105 V.S. EN5360 


Vin = 3.3V, Vout = 1.5V 

0LFM 

100LFM 

DERATING CURVE 

35 45 55 65 75 85 

AMBIENT TEMPERATURE o C 

EN5360 

Vin = 3.3V, Vout = 1.5V

Efficiency Comparison of HM03145 V.S. EN5330 


98 

96 

94 

92 

90 

88 

86 

84 

82 

80 


Vin = 3.3V, Vout = 2.5V 

E ffic iency - Vout = 2 .5V 

0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 


Vin=3.3V 

EN5330 

Vin = 3.3V, Vout = 2.5V

Reliability Test by Category 

1 Thermal Shock (TS) 

2 Pressure Cooker Test (PCT) 

3 High Temperature Storage Life (HTSL) 

4 High Temperature Operation Life (HTOL) 

5 Temperature Humidity Bias (THB) 

6 Vibration 

7 Shock 

8 Solderability 

9 Electro Static Discharge (ESD) 

Comply EIAJ/JEDEC Reliability Requirement

Failure Analysis Equipment 

Electrical Test 

X-ray 

Scanning Acoustic Tomography 

(SAT or SAM) 

Scanning Electron Microscope(SEM) 

Cross Section 

De-capsulation 

Material Analysis (EDX) 

Emission Microscope (EMMI)

Failure Analysis (X-Ray) (X Ray)

Failure Analysis (EDX & SEM)

Failure Analysis (SAT)

Failure Analysis (Cross-Section (Cross Section & De-Capsulation) 

De Capsulation)

Failure Analysis (EMMI)

New Product Development 

For High Current Applications 

Requirements : 

High efficiency, Small foot-print, 

Good thermal performance 

Choke 

IC 

PCB MOS MOS 

Cyntec Solution: Stack Type 

• Small foot-print: 11x12 mm 

• Choke design is more flexible. 

• High efficiency & less output capacitor 

requirement 

• High power density 

• Output current: 15A max. 

• Patent in process

Efficiency(%) 

100 

95 

90 

85 

80 

75 

70 

65 

60 

55 

50 

45 

40 

35 

30 

Comparison of Stack Type V.S. HM10105 

19Vin / 1.5Vout 

Efficiency - 19Vin / 1.5Vout 

0 1 2 3 4 5 6 7 8 9 10 11 12 13 

Load(A) 

Stack 


Efficiency(%) 

100 

95 

90 

85 

80 

75 

70 

65 

60 

55 

50 

45 

40 

35 

30 



0 1 2 3 4 5 6 7 8 9 10 11 12 13 


Stack 



5A/7A QFN Type : 

1. Package size: 11x11mm 

2. Low profile: 2.8mm for 5A 

Feature: 

3.5mm for 7A 

• Low thermal resistance 

• Low connection resistance 

• Low profile, Compact size

Efficiency(%) 

100 

95 

90 

85 

80 

75 

70 

65 

60 

55 

50 

45 

40 

35 

30 

Efficiency Comparison of 

QFN 5A 11*11mm V.S. HM05175 



0 1 2 3 4 5 


QFN 5A 11*11 


Efficiency(%) 

100 

95 

90 

85 

80 

75 

70 

65 

60 

55 

50 

45 

40 

35 

30 



0 1 2 3 4 5 


QFN 5A 11*11 


MAXIMUM LOAD CURRENT, Iload 

(A ) 

6 

5 

4 

3 

2 

1 

0 

De-Rating De Rating Curve Comparison of 

QFN 5A 11*11mm V.S. HM05175 

QFN 5A 11*11mm 

Vin = 12V, Vout = 3.3V 

HM05125 12-3.3V de-rating curves 

0 LFM 

100LFM 

200LFM 

35 45 55 65 75 85 

AMBIENT TEMPERATURE, Ta (oC) 

MAXIMUM LOAD CURRENT, Iloa d (A) 

6 

5 

4 

3 

2 

1 

0 


Vin = 12V, Vout = 3.3V 

HM05175 12-3.3V de-rating curves 

0 LFM 

100 LFM 

200 LFM 

400 LFM 

35 45 55 65 75 85 

AMBIENT TEMPERATURE, Ta (oC)


For Small Current Application 

Requirement: 

Low profile, Extra compact size 

Cyntec Solution: Hybrid Package 

� Thin Film/ Thick Film Process 

� < 1A application 

� IC and MOSFET Combo CSP package 

� Patent in process !!

15A 

10A 

7A 

5A 

3A 

Iout 

5*5*3mm 

7*7*2mm 

Product Map 

8.5*11*4.15mm 

8.5*11*3.85mm 

11*12*2.1mm 

11*11*3.5mm 

11*11*2.8mm 

15*15*3.5mm 

15*15*3.5mm 

Footprint 

0 100mm2 200mm2 300mm2 50mm2

N.B. PC/ 

IPC 

Telecom/ 

Server 

Cell 

Phone/ 

PDA/ MP3 

Product Roadmap 

3A/ 5A/ 7A/ 10A/15A 

High Frequency (MHz) Module 

High Output Current:Multi-Phase 

High Input Voltage: 24V input 

600mA/ 1A/ 2A/ 3A 

2006 2007 2008 2009 2010

Q & A 

Thank you!

Cyntec HM Series POL (Point of Load) Solution

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