Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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LGA Pad Design<br />
Solder Solder Mask Mask Defined Defined Non Non-Solder Non Solder Solder Mask Mask Defined<br />
Defined<br />
• Solder Solder Solder wicking wicking wicking around around around around NSMD NSMD pads pads produce produce significantly significantly lower<br />
lower<br />
molten molten solder solder height.<br />
height.<br />
• Solder Solder Solder mask mask defined defined defined pads pads should should be be used used for for LGA LGA and and 0.4mm 0.4mm &<br />
&<br />
smaller smaller pitch pitch pitch BGA/CSP BGA/CSP BGA/CSP packages. packages.<br />
packages.