Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
LGA/QFN Package Assembly<br />
• Trace Routing Under Component<br />
Create Localized Height Variations<br />
– Stand<strong>of</strong>f Height Variation<br />
• Leadless Devices Are More<br />
Sensitive To PCB/Component<br />
Flatness/Warpage<br />
– Received Condition<br />
– In-process Condition (During<br />
Reflow/Rework Solder Process)<br />
LGA Package<br />
BGA Package