Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Component Issues – Decreasing Pitch<br />
0.2 mm<br />
0.4 mm<br />
0.8 mm<br />
Potential Potential Issues:<br />
Issues:<br />
1.0 mm<br />
– Paste Volume Control<br />
– Component/PCB Flatness<br />
• Internal Split Plane<br />
• NFP Removal Impacts<br />
– Component/PCB Warpage<br />
1.27 mm