Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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Data Format Flexibility • Fabrication & Electrical Design Information – <strong>Board</strong> Fabrication Data - Gerber (274D, 274X), Drill Files (Excellon), etc. – CAM Tools - ODB++, GenCAD, GenCAM, FATF, etc. – CAD Tools - Cadence, Mentor, Zuken, Altium, etc. – Net Lists - IPC-D-356 • Assembly Information – BOM/AVL/Component Placement - ASCII, Excel, Word, etc. – Drawings - DXF, HPGL, Gerber, PDF, Postscript, HTML, etc. • Mechanical Designs – Design Data –STEP, IGES, DXF/DWG, VRML, etc.
Closing Thought “We can’t solve problems by using the same kind <strong>of</strong> thinking we used when we created them.” Albert Einstein Don’t Don’t Forget Forget About About About Reflow Reflow Process Process Induced Induced Warpage/Coplanarity Warpage/Coplanarity Issues. Issues.
Page 1 and 2:
Root Root Root Cause Cause Failure
Page 3 and 4:
Today’s Electronic Designs • Co
Page 5 and 6:
Component Issues - Warpage • High
Page 7 and 8:
Component Issues - Decreasing Pitch
Page 9 and 10: LGA Pad Design Solder Solder Mask M
Page 11 and 12: % PAD SIZE INCREASE 60 50 40 30 20
Page 13 and 14: Component Pad - Thermal Imbalance
Page 15 and 16: Thick Copper Design A A CTE CTE Mis
Page 17 and 18: Thick Copper Design Lack Lack Of Of
Page 19 and 20: Copper Etch Process • H H = = = H
Page 21 and 22: Pad Size Reduction Current Procedur
Page 23 and 24: • Voids in Solder Joints - Unfill
Page 25 and 26: Stencil Tolerances Artwork Artwork
Page 27 and 28: Offset Paste - Normal Placement Pho
Page 29 and 30: Match Placement To Paste • Slight
Page 31 and 32: Solder Paste Printing Volume Air Bu
Page 33 and 34: Internal PCB Impacts Number Of Laye
Page 35 and 36: Wave Solder & Rework Issues 0.005
Page 37 and 38: PCB Finish Vs Solder Spread - OSP -
Page 39 and 40: Defects Caused By Improper Thermal
Page 41 and 42: Through Hole Pad Design • Square
Page 43 and 44: Effect of Board Thickness On Topsid
Page 45 and 46: Solder Mask Selection Matte Finish
Page 47 and 48: Cleaning Chemistry Compatibility
Page 49 and 50: Inspectability - AOI, AXI, HVI •
Page 51 and 52: Cracked Cap Issue • PCA Is Assemb
Page 53 and 54: Source Of Contamination What is Sou
Page 55 and 56: DFX Software Flexibility • Concur
Page 57 and 58: DFX PCA-PCB Software Systems Mentor
Page 59: DFX Mechanical Software Systems Ana
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Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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