Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Component/PCB Warpage Impacts<br />
Split Split Planes/Unused<br />
Planes/Unused<br />
Planes/Unused<br />
Pad Pad Removal:<br />
Removal:<br />
• Localize Changes In<br />
Thickness/Coplanarity<br />
Of PCB<br />
• Potential Opens From<br />
Tilted Components<br />
(Teeter-Totter Effect)<br />
• Potential Opens From<br />
“Dropped” Solder<br />
Connection<br />
• Potential Reduced<br />
Reliability From<br />
Stretched Solder Joints<br />
Some Photos Courtesy <strong>of</strong> Amkor