Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Cracked Cap Issue<br />
• PCA Is Assembled In<br />
Panelized Form<br />
• PCA Is Depanelized<br />
Using A V-Score<br />
Slicing System<br />
• No Indication Of<br />
Issue At ICT &<br />
Functional Test<br />
Fig.1