Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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Effects <strong>of</strong> Mfg Environment • Elements From Manufacturing Facility May Contribute Defects. These include: – Process Equipment Materials – ESD Control (Smock/Wrist Strap) – Paper Work – Component Packaging – Facility Environment – Clothing – Operators (Hair)
Component Issues - Warpage • Higher Lead Free Solder Solidification and Process Temperatures, Increases The Amount Of Thermal Expansion Mismatch Of Components Which Can Increase Amount Of Component Warping During Assembly Process • May Require Redesign Of Package (Material Selection) For Thermal Mass And Expansion Balance.
Page 1 and 2: Root Root Root Cause Cause Failure
Page 3: Today’s Electronic Designs • Co
Page 7 and 8: Component Issues - Decreasing Pitch
Page 9 and 10: LGA Pad Design Solder Solder Mask M
Page 11 and 12: % PAD SIZE INCREASE 60 50 40 30 20
Page 13 and 14: Component Pad - Thermal Imbalance
Page 15 and 16: Thick Copper Design A A CTE CTE Mis
Page 17 and 18: Thick Copper Design Lack Lack Of Of
Page 19 and 20: Copper Etch Process • H H = = = H
Page 21 and 22: Pad Size Reduction Current Procedur
Page 23 and 24: • Voids in Solder Joints - Unfill
Page 25 and 26: Stencil Tolerances Artwork Artwork
Page 27 and 28: Offset Paste - Normal Placement Pho
Page 29 and 30: Match Placement To Paste • Slight
Page 31 and 32: Solder Paste Printing Volume Air Bu
Page 33 and 34: Internal PCB Impacts Number Of Laye
Page 35 and 36: Wave Solder & Rework Issues 0.005
Page 37 and 38: PCB Finish Vs Solder Spread - OSP -
Page 39 and 40: Defects Caused By Improper Thermal
Page 41 and 42: Through Hole Pad Design • Square
Page 43 and 44: Effect of Board Thickness On Topsid
Page 45 and 46: Solder Mask Selection Matte Finish
Page 47 and 48: Cleaning Chemistry Compatibility
Page 49 and 50: Inspectability - AOI, AXI, HVI •
Page 51 and 52: Cracked Cap Issue • PCA Is Assemb
Page 53 and 54: Source Of Contamination What is Sou
Page 55 and 56:
DFX Software Flexibility • Concur
Page 57 and 58:
DFX PCA-PCB Software Systems Mentor
Page 59 and 60:
DFX Mechanical Software Systems Ana
Page 61 and 62:
Closing Thought “We can’t solve
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Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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