Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Effect <strong>of</strong> <strong>Board</strong> Thickness<br />
On Topside Fillet Formation<br />
0.062”<br />
0.100”<br />
0.150”<br />
<strong>Board</strong> Thickness<br />
• <strong>Board</strong> thickness<br />
increase thermal mass<br />
<strong>of</strong> plated through-hole<br />
• Increase thermal pad<br />
isolation to improve<br />
solder flow to the top<br />
side<br />
• Increase lead hole<br />
clearance (aspect ratio)<br />
to improve solder flow<br />
to top side
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