Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Lead To Hole Clearance<br />
• Lead Lead Lead Free Free Soldering Soldering<br />
Soldering<br />
– Lead Clearance Minimum May<br />
Increase<br />
– Increasing <strong>Board</strong> Thickness May<br />
Further Increase Lead To Hole<br />
Clearance (Aspect Ratio)<br />
– Larger Holes Create Less Voids<br />
• Smaller Smaller Lead Lead To To Hole<br />
Hole<br />
Clearance Clearance Clearance Decreases<br />
Decreases<br />
Shrinkage Shrinkage Holes Holes / / Hot Hot Tear<br />
Tear<br />
Joints<br />
Joints<br />
IPC-A-610D, Fig. 5.67