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Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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Defects <strong>Cause</strong>d By Improper Thermal Balance<br />

Wave Solder Process<br />

Thermal Shock<br />

Damage<br />

LED<br />

lead<br />

LED<br />

• Increase thermal<br />

pad isolation<br />

• Balance number<br />

connections for<br />

component per<br />

each plated through<br />

hole<br />

• Uniformity <strong>of</strong> trace<br />

size connection to<br />

component plated<br />

through hole

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