Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Wave Solder & Rework Issues<br />
0.005” Trace Dissolution in<br />
30 Seconds<br />
Limit Effects Of Copper Dissolution<br />
– Use Lower Dissolution<br />
Rate Solder Alloy<br />
Modified SAC Alloy<br />
(Sb, Ni, Zn, Ge, In, Etc)<br />
Non-SAC Alloy<br />
(Sn/Cu/Ni, Etc)<br />
– Pad Trace Connection<br />
• Tear Drop<br />
• Snow Man Connection<br />
• Wide Trace<br />
• Greater Than 0.010”<br />
• PCB Photo Courtesy <strong>of</strong> Cookson – Alpha Metals<br />
• Byle, Jean & Lee, “Copper Dissolution Rate in Pb-Free Soldering Fountain Systems”, <strong>SMTA</strong>-I 2006<br />
Original SnPb<br />
SAC 305 SN100C<br />
After wave soldering, 265 o C<br />
solder temperature, 12 seconds<br />
contact time
Change language