Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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What To Do? • Increase Solder Temperature? Lead Free Solder Issue Higher Solder Temperatures Or Increased Solder Dwell Times Create Problems With Pads On Solder Side * Dr. S. Zweiger, Solectron GMBH, Productronica Green Day, November 2005
Wave Solder & Rework Issues 0.005” Trace Dissolution in 30 Seconds Limit Effects Of Copper Dissolution – Use Lower Dissolution Rate Solder Alloy Modified SAC Alloy (Sb, Ni, Zn, Ge, In, Etc) Non-SAC Alloy (Sn/Cu/Ni, Etc) – Pad Trace Connection • Tear Drop • Snow Man Connection • Wide Trace • Greater Than 0.010” • PCB Photo Courtesy <strong>of</strong> Cookson – Alpha Metals • Byle, Jean & Lee, “Copper Dissolution Rate in Pb-Free Soldering Fountain Systems”, <strong>SMTA</strong>-I 2006 Original SnPb SAC 305 SN100C After wave soldering, 265 o C solder temperature, 12 seconds contact time
Page 1 and 2: Root Root Root Cause Cause Failure
Page 3 and 4: Today’s Electronic Designs • Co
Page 5 and 6: Component Issues - Warpage • High
Page 7 and 8: Component Issues - Decreasing Pitch
Page 9 and 10: LGA Pad Design Solder Solder Mask M
Page 11 and 12: % PAD SIZE INCREASE 60 50 40 30 20
Page 13 and 14: Component Pad - Thermal Imbalance
Page 15 and 16: Thick Copper Design A A CTE CTE Mis
Page 17 and 18: Thick Copper Design Lack Lack Of Of
Page 19 and 20: Copper Etch Process • H H = = = H
Page 21 and 22: Pad Size Reduction Current Procedur
Page 23 and 24: • Voids in Solder Joints - Unfill
Page 25 and 26: Stencil Tolerances Artwork Artwork
Page 27 and 28: Offset Paste - Normal Placement Pho
Page 29 and 30: Match Placement To Paste • Slight
Page 31 and 32: Solder Paste Printing Volume Air Bu
Page 33: Internal PCB Impacts Number Of Laye
Page 37 and 38: PCB Finish Vs Solder Spread - OSP -
Page 39 and 40: Defects Caused By Improper Thermal
Page 41 and 42: Through Hole Pad Design • Square
Page 43 and 44: Effect of Board Thickness On Topsid
Page 45 and 46: Solder Mask Selection Matte Finish
Page 47 and 48: Cleaning Chemistry Compatibility
Page 49 and 50: Inspectability - AOI, AXI, HVI •
Page 51 and 52: Cracked Cap Issue • PCA Is Assemb
Page 53 and 54: Source Of Contamination What is Sou
Page 55 and 56: DFX Software Flexibility • Concur
Page 57 and 58: DFX PCA-PCB Software Systems Mentor
Page 59 and 60: DFX Mechanical Software Systems Ana
Page 61 and 62: Closing Thought “We can’t solve

Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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