Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Low Component<br />
Stand-<strong>of</strong>f Height<br />
• Tilted Component<br />
• Open Joints (stand<strong>of</strong>f<br />
from PCB)<br />
• Misalignment<br />
Component Types<br />
• Leadless<br />
– QFN, DFN, Passives,<br />
etc.<br />
• Fine Pitch Area Array<br />
– BGA, WL-CSP, CSP,<br />
etc.<br />
Silk Screen Design