Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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What do you mean 0% first pass yield? Photo Courtesy <strong>of</strong> G. Toren My My My My process process process process is is is is in in in in control control control control , , , , so so so so what what what what happened? happened? happened? happened?
Today’s Electronic Designs • Component Packages Are Getting Smaller • 0603 > 0402 > 0201>01005 • BGA > CSP > WL-CSP > ? • Assembly Design Density Is Increasing • Tighter Component to Component Spacing (Spacing Smaller Than 0.020” Common) • Smaller Copper (Pad) Interconnections • Assembly Process Margins Are Tighter • Thermal Balance @ Pad Level Is Critical (Trace/Via Connection Size to Pads) • Component Placement Accuracy (The Thickness Of A Piece <strong>of</strong> Paper Can Be Difference Between 100% Rework or High Yields)
Page 1: Root Root Root Cause Cause Failure
Page 5 and 6: Component Issues - Warpage • High
Page 7 and 8: Component Issues - Decreasing Pitch
Page 9 and 10: LGA Pad Design Solder Solder Mask M
Page 11 and 12: % PAD SIZE INCREASE 60 50 40 30 20
Page 13 and 14: Component Pad - Thermal Imbalance
Page 15 and 16: Thick Copper Design A A CTE CTE Mis
Page 17 and 18: Thick Copper Design Lack Lack Of Of
Page 19 and 20: Copper Etch Process • H H = = = H
Page 21 and 22: Pad Size Reduction Current Procedur
Page 23 and 24: • Voids in Solder Joints - Unfill
Page 25 and 26: Stencil Tolerances Artwork Artwork
Page 27 and 28: Offset Paste - Normal Placement Pho
Page 29 and 30: Match Placement To Paste • Slight
Page 31 and 32: Solder Paste Printing Volume Air Bu
Page 33 and 34: Internal PCB Impacts Number Of Laye
Page 35 and 36: Wave Solder & Rework Issues 0.005
Page 37 and 38: PCB Finish Vs Solder Spread - OSP -
Page 39 and 40: Defects Caused By Improper Thermal
Page 41 and 42: Through Hole Pad Design • Square
Page 43 and 44: Effect of Board Thickness On Topsid
Page 45 and 46: Solder Mask Selection Matte Finish
Page 47 and 48: Cleaning Chemistry Compatibility
Page 49 and 50: Inspectability - AOI, AXI, HVI •
Page 51 and 52: Cracked Cap Issue • PCA Is Assemb
Page 53 and 54:
Source Of Contamination What is Sou
Page 55 and 56:
DFX Software Flexibility • Concur
Page 57 and 58:
DFX PCA-PCB Software Systems Mentor
Page 59 and 60:
DFX Mechanical Software Systems Ana
Page 61 and 62:
Closing Thought “We can’t solve
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Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

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