Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Warpage & Thermal Pr<strong>of</strong>ile Issues<br />
May May May Require Require Require Change Change In In In Production<br />
Production<br />
Process<br />
Process<br />
• Tooling To Bridge Warpage Gap.<br />
(Increased Solder Paste Volume Application, etc.<br />
Reflow Pallets For <strong>Board</strong> Support)<br />
• Reflow Pr<strong>of</strong>ile To Bridge Component<br />
Warpage Gap.<br />
(Decreased Thermal Change Rate And Delta T<br />
Vertically In Component Package – Reduce Surface<br />
To Cooler Location Temperature Delta - TCE<br />
Induced Warpage)<br />
• Reflow Pr<strong>of</strong>ile To Bridge PCB Warpage Gap.<br />
(Decreased Thermal Change Rate And Delta T<br />
Vertically In PCB – Reduce Surface To Cooler<br />
Location Temperature Delta - TCE Induced<br />
Warpage)<br />
Large ∆T across <strong>Board</strong>
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