Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Pad Size Reduction<br />
Current Procedures For Applying Uniform Etch Compensation<br />
Values Across All Surface Features Are Inadequate.<br />
Below Illustrate A Near Exponential Reduction In Pad Size As<br />
The Pad Gets Smaller, For Both Round And Square Pads In<br />
Either Orientation.
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