Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Heavy Copper Lamination<br />
• Imaging Imaging Resist Resist Resist Thickness Thickness Is Is 1.3 1.3 1.3 - 2mils. 2mils. At At At Some Some Some Point, Point, Image<br />
Image<br />
Transfer Transfer Transfer Interferes Interferes With With The The Imaging Imaging Resists Resists Ability Ability To To “Conform” “Conform”<br />
“Conform”<br />
To To The The Lack Lack Of Of Planarity Planarity Planarity On On The The Surface Surface Of Of The The Substrate. Substrate.<br />
• This This Lack Lack Of Of Planarity Planarity Also Also Reduces Reduces The The Effective Effective Resolution Resolution Of<br />
Of<br />
The The System, System, Limiting Limiting Feature<br />
Feature