Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

Heavy Copper Lamination
• Imaging Imaging Resist Resist Resist Thickness Thickness Is Is 1.3 1.3 1.3 - 2mils. 2mils. At At At Some Some Some Point, Point, Image
Image
Transfer Transfer Transfer Interferes Interferes With With The The Imaging Imaging Resists Resists Ability Ability To To “Conform” “Conform”
“Conform”
To To The The Lack Lack Of Of Planarity Planarity Planarity On On The The Surface Surface Of Of The The Substrate. Substrate.
• This This Lack Lack Of Of Planarity Planarity Also Also Reduces Reduces The The Effective Effective Resolution Resolution Of
Of
The The System, System, Limiting Limiting Feature
Feature