Root Cause Failure Analysis of Printed Circuit Board ... - SMTA

Thick Copper Design
• Heavy Heavy Copper, Copper, Embedded Embedded In In Glass Glass Epoxy, Epoxy, Can Can Result Result
Result
In In Nonplanar Nonplanar Conditions Conditions On On On The The Surface Surface Of Of The The
The
Substrate
Substrate
• The The Heavier Heavier The The Copper, Copper, The The Worse Worse The The Effect
Effect
• In In In In Multi Multi-layer Multi Multi-layer Multi layer layer Applications, Applications, Local Local Local Local Local Areas Areas With With “Stacked”
“Stacked”
Copper, Copper, Beside Beside Areas Areas That That Are Are Etched Etched Out, Out, Can
Can
Result Result Result In In Extreme Extreme Non Non-planarities
Non Non planarities
• PCB PCB Fabrication Fabrication Industry Industry Typically Typically Refers Refers To To This This As
As
“Image “Image Transfer” Transfer”
Transfer”