Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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% PAD SIZE INCREASE<br />
60<br />
50<br />
40<br />
30<br />
20<br />
10<br />
Trace Routing Impacts Solder Joint<br />
0<br />
EFFECTIVE PAD SIZE ANALYSIS<br />
4 10 15 20<br />
WIDTH OF TRACE 10 Mil Nom 15 Mil Nom 20 Mil Nom<br />
10 Mil Max 15 Mil Max 20 Mil Max<br />
Increased Increased Mounting<br />
Mounting<br />
Pad Pad Size Size Affected Affected By:<br />
By:<br />
• Number Of Trace<br />
Connections To Each Pad<br />
• Width Of Trace<br />
Connections To Each Pad<br />
• Size <strong>of</strong> Pad<br />
– Small Pads Have Less<br />
Margin<br />
• Uniformity Of Trace<br />
Egress Direction<br />
– Some Package Types Are<br />
More Sensitive Than Others<br />
• Uniformity Of Trace Sizes
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