Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
Root Cause Failure Analysis of Printed Circuit Board ... - SMTA
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Component Issues – LGA & QFN<br />
Potential Potential Issues:<br />
Issues:<br />
– Land Pattern Design<br />
• Pad Size Uniformity (SMD vs NSMD)<br />
– Paste Volume Control<br />
• Pad to Pad Volume<br />
• Pad to Design Defined Volume<br />
– Component/PCB Flatness<br />
• Internal Split Plane<br />
• NFP Removal Impacts<br />
– Component/PCB Warpage<br />
– Decrease Component Stand<strong>of</strong>f Height<br />
• Decreased Reliability