Applications for Maskless E-Beam Lithography between ... - Sematech

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E-Beam Direct Write: Possible Applications Test Structures for technology learning and tool qualification Personalization ASIC Structuring Ground rule, cell concept and device learning Metal fix applications for 130nm and 90nm technologies Chip shuttle for macro verification Main focus Qimonda Main focus for logic companies Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 6 Confidential Increasing complexity
2005 Timeline E-Beam Project 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 Site Accept E-Beam Tool Delivery CNT Transfer Resist Process Final Acceptance 2006 2007 Support Device 1 layer Ready for Service Center for (external) customers Column Upgrade Support Device >1 layer 45nm node capability 32nm node capability Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 7 Confidential
Page 1 and 2: Applications for Mask-less E-Beam L
Page 3 and 4: Table of Contents E-Beam Lithograph
Page 5: Center of Competence E-Beam at QD P
Page 11 and 12: Mission or Fraunhofer CNT Center Na
Page 13 and 14: European Nanotechnology Platform -
Page 15 and 16: CNT Layout acces to CNT offices pag
Page 17 and 18: Resist Benchmarking at IMS Chips Ex
Page 19 and 20: Status Exposure Results: Negative R
Page 23 and 24: PML2 SEMATECH Litho Forum Vancouver
Page 25 and 26: PML2 SEMATECH Litho Forum Vancouver
Page 27 and 28: Acknowledgement The Qimonda part of
Page 29: Thank you The World’s Leading Cre

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